Mitsubishi Gas Chemical Company, Inc.

Takashi Nakata

Hideyuki Takahashi

Takahiro Seki

Tetsuo Aoyama

Toshihiko Kobayashi

Hidetoshi Hatakeyama

Takeshi Nagasaka

Tatsuo Iwai

Youichi Takizawa

Haruaki Eto

Naohito Yoshimura

There are provided an oxygen scavenger composition and the like, which are excellent in economy in which the amount of oxygen absorbed per unit volume of the oxygen scavenger composition is large, and rusting at high humidity is inhibited. The oxygen scavenger composition of the present invention comprises (A) an iron powder, (B) a metal bromide and/or a metal iodide, and (C) a thiosulfate.

Oxygen scavenger composition, and oxygen scavenger package using the same, and method for oxygen scavenging

A deoxidant composition comprising 100 parts by weight of iron powder, 0.01 to 20 parts by weight of metal halide and 0.01 to 5 parts by weight of water repellent agent. The deoxidant composition even when used in a high-humidity atmosphere can maintain oxygen absorption potency. A deoxidant pack for high humidity obtained by wrapping the deoxidant composition without mixing of any inorganic filler by means of an air-permeable packaging material can reduce the apparent volume of deoxidant composition, so that the amount of packaging material used in the production of the deoxidant pack can be reduced.

Moisture-resistant deoxidant

An oxygen-absorbing composition for a low-humidity environment includes a reduced metal and an accelerator having at least one of iodide and bromide. The accelerator may have at least one of a metallic iodide salt and a metallic bromide salt. The reduced metal and the accelerator may be included in a dry state and the oxygen-absorbing composition may take the form of particles. The oxygen-absorbing composition may be a resin composition made by kneading an oxygen absorber with a thermoplastic resin.

Oxygen-absorbing composition, oxygen-absorbing resin composition,

A developing solution comprising a specific amount of a quaternary ammonium hydroxide represented by the general formula [(R.sup.1).sub.3 N--R].sup.+ .multidot.OH.sup.- (R indicates an alkyl group having 1 to 3 carbon atoms or a hydroxy-substituted alkyl group having 1 to 3 carbon atoms, and R.sup.1 indicates an alkyl group having 1 to 3 carbon atoms) and, if necessary, a quaternary ammonium hydrogen carbonate represented by the general formula [(R.sup.1).sub.3 N--R].sup.+ .multidot.HCO.sub.3.sup.- (R and R.sup.1 are the same as the above) and having a pH in the range of 9 to 13, and a process for producing printed circuit boards using an organic alkali solution, are provided. The developing solution needs no defoaming agent because it causes little foaming. Printed circuit boards produced by using the developing solution have excellent finished accuracy. Therefore, fine circuits of printed circuit networks can be produced with stability.

Developing solution for producing printed circuit boards and a process

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Tokyo, Japan

Takashi Nakata