Panasonic Corporation

Matsushita Electric Industrial Co., Ltd.

Other

Senju Metal Industry Co., Ltd.

Kao Corporation

Kabushiki Kaisha Nihon Genma

Takashi Nagashima

Toshihiko Taguchi

Masahiko Hirata

Hisahiko Yoshida

Suguru Nakao

Kunihito Takaura

Shuji Yamashita

Takehiko Yamashita

Masahiro Mori

Yoshitaka Toyoda

Kaoru Shimizu

Tsukasa Ohnishi

Takao Hisazumi

Akira Takenaka

Toshiaki Ogura

Takeshi Meguro

Tomoya Tsuboi

Takao Namihira

Yasuji Kawashima

Yoshiro Oda

Hidenori Akiyama

Setsuko Tadokoro

Hideo Chaki

Akihiko Matsuike

A material for audio equipment housing containing a polylactic acid resin composition containing a polylactic acid resin, a plasticizer, an organic crystal nucleating agent, and an inorganic material, wherein the content of the plasticizer is from 1 to 50 parts by mass based on 100 parts by mass of the polylactic acid resin; and a vibration-damping material containing a polylactic acid resin composition containing a polylactic acid resin, a plasticizer, an organic crystal nucleating agent, and an inorganic material, wherein the content of the plasticizer is from 1 to 50 parts by mass based on 100 parts by mass of the polylactic acid resin. The material of the present invention can be suitably used as materials for audio equipment of, for example, speakers, television, radio cassette players, headphones, audio components, or microphones, and manufactured articles, such as electric appliances, transportation vehicles, construction buildings, and industrial equipment, or parts or housing thereof.

Vibration damping material

A decorative member composing a casing includes: a resin layer () having a front surface () and a back surface (); and a reflective layer () formed on the back surface () of the resin layer (). The back surface () of the resin layer () includes a receding surface () formed therein. The receding surface recedes gradually toward the front surface () to change a thickness of the resin layer (). The receding surface () is a concave surface forming a depression that opens while broadening. The back surface () of the resin layer () has a reference surface () around the receding surface (), and a portion of the reference surface () facing an internal space of the casing is a roughened area ().

Decorative member

A decorative member (A) includes: a resin layer () having a front surface () and a back surface (); and a reflective layer () formed on the back surface () of the resin layer (). The back surface () of the resin layer () includes a receding surface () formed therein. The receding surface recedes gradually toward the front surface () to change a thickness of the resin layer (). A pigmented layer () configured so that lightness/depth of color thereof changes in accordance with the change in the thickness of the resin layer () is provided between the back surface () of the resin layer () and the reflective layer ().

A metal coating removing apparatus () includes a first electrode () arranged so as to be opposed to a metal coating () as an object to be removed, a second electrodearranged so as to be opposed to the metal coating () at a predetermined distance from the first electrode (), and a pulse power generator (), for example, that functions as a discharge energy supply portion. The pulse power generator () supplies discharge energy between the first electrode () and the second electrode () so as to allow discharging to occur between the first electrode () and the second electrode (). By allowing discharging to occur between the first electrode () and the second electrode (), the metal coating () can be removed.

Metal coating removing apparatus and metal coating removing method

The present invention provides a Sn&#x2014;Zn based lead-free solder which can prevent peeling of solder from soldered portions even after the passage of long periods after soldering of portions to be soldered made of Cu. A Sn&#x2014;Zn based lead-free solder according to the present invention comprises 5-10 mass percent of Zn, a total of 0.005-1.0 mass percent of at least one substance selected from the group consisting of Au, Pt, Pd, Fe, and Sb, optionally a total of at most 15 mass percent of at least one substance selected from the group consisting of Bi and In, and a remainder of Sn. This Sn&#x2014;Zn based lead-free solder can be made into a solder paste using a rosin flux containing a halide such as an amine hydrochloride as an activator.

Lead-free solder and soldered article

A solder paste comprising a powder of a Zn-containing Sn-based, lead-free solder mixed with an activator-containing rosin-based flux to which 0.5-10.0 wt % of isocyanuric acid or a haloalkyl ester thereof is added can prevent the formation of solder balls and voids during reflow soldering and exhibit good solderability. A solder paste comprising a powder of an Ag- or Zn-containing Sn-based, lead-free solder mixed with an activator-containing rosin-based flux to which 0.01-10.0 wt % of a salicylamide compound also does not exhibit a change in viscosity and exhibits good solderability.

Solder paste

A lead-free solder paste comprises an Sn&mdash;Zn based lead-free solder powder mixed with a flux. The flux contains at least one aromatic hydroxycarboxylic acid selected from the group consisting of aromatic carboxylic acids having one hydroxyl group in a meta position (such as 3-hydroxy-2-methylbenzoic acid) and aromatic carboxylic acids having at least two hydroxyl groups (such as dihydroxynaphthoic acid or dihydroxybenzoic acid) in an amount of 0.1-10.0 mass %. The flux may further include 0.5-20 mass % of an aliphatic hydroxy carboxylic acid (such as hydroxyoleic acid).

A solder paste having a powder of a Zn-containing solder alloy such as an Sn&mdash;Zn based alloy in admixture with a soldering flux such as a rosin flux is improved by adding from 0.1% to 5.0% by weight of a glycidyl ether compound such as alkyl, alkenyl, or aryl glycidyl ether. The improved solder paste has increased resistance to aging and to concomitant deterioration in solderability caused by reaction of Zn in the solder alloy with ingredients in the flux and has a substantially extended shelf life.

Lead-free zinc-containing solder paste

A tin-lead alloy solder is provided which exhibits high joint strength under conditions which are likely to induce fatigue fracture. The tin-lead alloy solder comprises 15-80 wt. % lead, 0.1-5 wt. % silver, 0.1-10 wt. % antimony, and 0.0005-0.3 phosphorus, the balance being tin.

Solder

Growing community of inventors

Kyoto, Japan

Takashi Nagashima