Hitachi, Ltd.

Hitachi Tokyo Electronics Co., Ltd.

Takashi Nagaoka

Masahiro Mase

Seiji Sakagami

Akira Nishiuchi

Shinjiro Ueda

Shinjiroo Ueda

Kimio Muramatsu

Minoru Taniyama

Ichiro Gyobu

Katsuaki Kikuchi

Yoshihisa Awada

Hirofumi Sakurai

Shigeo Tomiyama

Tadao Kusaka

Noboru Matsumura

Akihiko Satou

Hiroaki Sakamoto

Kouzi Aoki

Haruo Miura

Yoshiaki Abe

Takeshi Okawada

Kazuaki Nakamori

Yoshitsugu Tsutsumi

Keiji Ueyama

Souji Sakata

Makoto Terajima

A dry turbo vacuum pump has a multistage circumferential impeller supported on a shaft, and a stator which cooperates with it to form a multistage peripheral flow pump. A centrifugal pump arranged at an inlet side of the peripheral flow pump is also mounted on the same shaft, so that gas sucked from the inlet is discharged to the atmosphere from the peripheral flow pump. The multistage peripheral flow pump and at least one stage of the centrifugal pump are integrated.

Vacuum pump

A turbo vacuum pump for compressing a low-pressure gas to discharge the compressed gas into atmosphere comprises pump stator having a gas flow passage comprising a plurality of annular flow passages on an inner surface thereof arranged stepwise diameters of which become smaller toward downstream and passages intercommunicating with adjacent annular flow passages and a gas discharge port communicated with one of the plurality of annular flow passages disposed at the most downstream. The pump stator includes a cylindrical spiral grooved pump impeller and a plurality of peripheral flow pump impellers facing the annular flow passages provided downstream of the cylindrical spiral grooved pump impeller and having stepwise diameters which become smaller toward downstream to form a peripheral flow pump stage. The suction casing has a spiral groove on a cylindrical inner surface thereof arranged with a predetermined clearance in relation to the spiral grooved pump impeller of the pump rotor so as to form a spiral grooved pump stage and a gas suction port communicated with the spiral grooved pump stage.

Turbo vacuum pump

A turbo vacuum pump has a housing provided with a suction port and a discharge port, an evacuation pump disposed in the housing for compressing a gas suctioned through the suction port and discharging the compressed gas through the discharge port, and a motor for driving the evacuation pump, the motor and the evacuation pump having a common rotor. The rotor is supported at its both axial ends by bearings. A spiral grooved dynamic seal is disposed in the vicinity of the suction port and at the opposite side of the suction port to the evacuation pump. The diameter of the spiral grooved dynamic seal, at the smallest, is greater than the outside diameter of the final stage impeller of the evacuation pumps.

A compact, easy-to-handle turbo vacuum pump includes a housing having an inlet port and an outlet port; a cylindrical rotor disposed in the housing and having a stepped peripheral surface and a plurality of blades secured to protruding corners of the steps; and a pumping mechanism portion in which a pumping stage is formed by a stator which faces the blades of the rotor across a narrow gap, and in which peripheral pump flow paths are provided in step-like recessions inside the stator. The turbo vacuum pump further includes a rotating shaft which is connected to the rotor and is rotatably supported by a radial gas bearing and a thrust gas bearing; and a motor portion for operating the rotor. Gas sucked in through the inlet port can be discharged into the atmosphere through the outlet port.

A turbo vacuum pump has a housing provided with a suction port and a discharge port, an evacuation pump disposed in the housing for compressing a gas sucked through the suction port and discharging the compressed gas through the discharge port, and a motor for driving the evacuation pump, the motor and the evacuation pump having a common rotor. The rotor is supported at its both axial ends by bearings. A spiral grooved dynamic seal is disposed in the vicinity of the suction port and at the opposite side of the suction port to the evacuation pump. The diameter of the spiral grooved dynamic seal, at the smallest, is greater than the outside diameter of the final stage impeller of the evacuation pump.

A vacuum pump of the present invention comprises a housing including a suction port and an exhaust port, a stator fixed in the housing, a rotor rotatably supported in the housing, and a cooling jacket provided adjacent to the stator. Gas suctioned from the suction port and having a pressure substantially equal to or close to the atmospheric pressure is exhausted from the exhaust port. A cooling fluid having a thermal conductivity less than that of water, for example, of 0.08 to 0.25 Kcal/m.h..degree.C. flows through the cooling jacket. When the gas contains aluminum chloride, the cooling fluid flows into the cooling jacket in such a manner that the temperature inside a gas conduit is maintained to be higher than the sublimation temperature of aluminum chloride. Lubrication oil may be supplied as the cooling fluid to the cooling jacket from the same supply line as lubrication oil supplied to oil lubricating bearings provided below a pump mechanism unit. A closed-loop line may be comprised of the cooling jacket, a tank, the supply line, and a return line, to thereby circulate the cooling fluid by a pump.

This invention concerns a production method and a processing apparatus for semiconductor devices, as well as an evacuating apparatus used for the processing apparatus. According to this invention, since the evacuation system of pressure-reduction processing apparatus for conducting various wafer processings during production steps of semiconductor devices is constituted only with oil-free vacuum pump, deleterious oil contaminations or carbonation products of oils produced from oils upon heating are not present in the pressure-reducing processing chamber as compared with conventional pressure-reducing processing apparatus using a vacuum oil pump as an evacuation pump and the production method of semiconductor devices using such apparatus. Accordingly, highly clean evacuated condition can be attained and, in addition, semiconductor devices at high reliability and with no degradation in the electric characteristics can be obtained by using the pressure-reducing processing apparatus having such a highly clean processing chamber.

Vacuum system with a secondary gas also connected to the roughing pump

Since a peripheral-flow pump according to the present invention has a peripheral-flow impeller having a cylindrical staircase shape whose outer diameter increases in one direction only like a staircase, a stator, which conventionally has been of a complicated configuration composed of two pieces, can be formed into an integral molding without any deterioration in pump performance. Accordingly, the production of pumps is facilitated.

A vacuum pump with a heating portion for preventing adhesion of reaction products on a discharge side thereof.

This invention concerns a production method and a processing apparatus for semiconductor devices, as well as an evacuating apparatus used for the processing apparatus. According to this invention, since the evacuation system of pressure-reduction processing apparatus for conducting various wafer processings during production steps of semi-conductor devices is constituted only with oil-free vacuum pump, deleterious oil contaminations or carbonation products of oils produced from oils upon heating are not present in the pressure-reducing processing chamber as compared with conventional pressure-reducing processing apparatus using a vacuum oil pump as an evacuation pump and the production method of semiconductor devices using such apparatus. Accordingly, highly clean evacuated condition can be attained and, in addition, semiconductor devices at high reliability and with no degradation in the electric characteristics can be obtained by using the pressure-reducing processing apparatus having such a highly clean processing chamber.

Method for LPCVD of semiconductors using oil free vacuum pumps

A vacuum pump with a seal structure for a pump unit of the vacuum pump and a driving mechanism for rotating a rotor in the pump stages of the pump is disclosed. The seal structure is provided with a narrow gap sealing arrangement formed by a stationary member which is opposed to the portion of a shaft of the driving mechanism which is between the pump unit and an upper bearing supporting the same shaft, which narrow gap sealing arrangement comprises first, second and third seal portions; a mechanism for supplying a discharge gas to the first seal portion; and a mechanism for supplying a purge gas to the second and third seal portions. Owing to these parts, the feed rate of the purge gas can be minimized, and the entry of the oil mist, which occurs during the lubrication of the bearing, into the interior of the pump unit can be prevented. This enables the interior of the pump unit to be kept clean.

Vacuum pump with plural labyrinth seal portions

A vacuum pump including a centrifugal compressor stage on the side of a suction opening and a circumferential flow compressor on the side of an exhaust opening. The centrifugal compressor pump works as a Siegbahn pump at a steady state, and works as a centrifugal compressor under a transient condition at the initial stage of the pump operation, thus obtaining a high pumping speed under the transient condition.

A device for changing and attaching or mounting an angle of stationary vanes of an axial-flow fluid machine by rotating the stationary vanes through a circumferential movement of an intermediate cylinder. The device includes at least one arm secured to one end of the intermediate cylinder and engaging at a second end in a groove formed in a block member which is attached to an end of an actuator and is movable in a tangential direction of the intermediate cylinder. A guide arrangement is provided for guiding a movement of the block member and at least a portion of the actuator so as to ensure a smooth operation of the actuator by freeing the same from any influence of undesireable forces such as lateral pressure caused by a thermal expansion of the intermediate cylinder.

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Tsukuba, Japan

Takashi Nagaoka