Tokyo Electron Limited

Takashi Nagai

Hideaki Sato

Norihiro Ito

Kazuhiro Aiura

Hiromi Hara

Naoki Shindo

Hiroshi Yoshida

Yosuke Hachiya

Takahiro Kawazu

Jiro Higashijima

Junichi Kitano

Nobuhiro Ogata

Osamu Kuroda

Jun Nonaka

Yusuke Hashimoto

Norihiro Itoh

Yasuhiro Takaki

Takafumi Tsuchiya

Tsukasa Hirayama

Takumi Honda

Hidemasa Aratake

Shinichi Umeno

Keita Hirase

Yusuke Takamatsu

Jiro Harada

Koji Ogura

Kenji Goto

Hisashi Morita

A substrate processing apparatus includes: a processing container, a mixing device, a liquid feeding path, and a controller. The processing container processes a substrate by immersing the substrate in a processing liquid. The mixing device mixes a phosphoric acid aqueous solution and an additive, to produce a mixed liquid to be used as a raw material of the processing liquid. The liquid feeding path feeds the mixed liquid from the mixing device to the processing container. The controller controls the substrate processing apparatus. The controller performs a control to feed the mixed liquid from the mixing device to the processing container in which the substrate is immersed, after a phosphoric acid concentration of the mixed liquid is regulated from a first concentration to a second concentration higher than the first concentration. The first concentration is a concentration when the phosphoric acid aqueous solution is supplied to the mixing device.

Substrate processing apparatus and substrate processing method

A substrate liquid processing apparatus includes a processing liquid storage unit configured to store a processing liquid therein; a processing liquid drain unit configured to drain the processing liquid from the processing liquid storage unit; and a control unit. The control unit performs a first control in a constant concentration mode in which a concentration of the processing liquid in the processing liquid storage unit is regulated to a predetermined set concentration and a second control in a concentration changing mode in which the concentration of the processing liquid is changed. In the second control, a set concentration after concentration change is compared with a set concentration before the concentration change, and when the set concentration after the concentration change is lower, the control unit controls the processing liquid drain unit to start draining of the processing liquid.

Substrate liquid processing apparatus

A substrate liquid processing apparatus includes a processing tubwhich is configured to store therein a processing liquid and in which a processing of a substrate is performed by immersing the substrate in the stored processing liquid; a circulation lineconnected to the processing tub; a pumpprovided at the circulation line and configured to generate a flow of the processing liquid flowing out from the processing tub and returning back to the processing tub after passing through the circulation line; and a heaterprovided at the circulation line and configured to heat the processing liquid. At least two temperature sensorstoare provided at different positions within a circulation system including the processing tub and the circulation line. Controllersandcontrol a heat generation amount of the heater based on detection temperatures of the at least two temperature sensors.

A recovery route returns, to a retaining tank, mixed solution supplied to a substrate processing unit. A discarding route discards the supplied mixed solution to a place other than the retaining tank. A switching controller causes the supplied mixed solution to flow into the discarding route during a time interval until a first time interval has elapsed from a time point when the substrate processing unit starts to supply the mixed solution; causes the supplied mixed solution to flow into the recovery route during a time interval until a second time interval, which is decided based on a predetermined recovery rate, has elapsed after the first time interval elapses; and causes the supplied mixed solution to flow into the discarding route during a time interval until supply of the mixed solution has been ended from a time point when the second time interval elapses.

A substrate liquid processing apparatus includes a processing tubA which is configured to store therein a processing liquid in a boiling state and in which a processing of a substrateis performed by immersing the substrate in the stored processing liquid; a concentration sensorB configured to detect a concentration of a chemical liquid component contained in the processing liquid; a concentration control unit() configured to control the concentration of the chemical liquid component to a set concentration by adding the chemical liquid component or a diluting solution to the processing liquid based on a detection concentration of the concentration sensor; a head pressure sensorB configured to detect a head pressure of the processing liquid within the processing tub; and a concentration set value correction unitconfigured to correct, based on a detection value of the head pressure sensor, the set concentration.

Disclosed is a method for performing a liquid processing on a substrate using an aqueous solution of a chemical agent at a predetermined concentration as a processing liquid. The method includes: storing the processing liquid in a processing liquid storage unit; and supplying an aqueous solution of the chemical agent at a different concentration from the concentration of the processing liquid to the processing liquid storage unit, discharging the processing liquid from the processing liquid storage unit so as to update the processing liquid stored in the processing liquid storage unit. The aqueous solution in a predetermined amount is supplied to the processing liquid storage unit, and the processing liquid is discharged from the processing liquid storage unit, the processing liquid containing the chemical agent in the same amount as the amount of the chemical agent contained in the aqueous solution supplied to the processing liquid storage unit.

Substrate liquid processing apparatus, substrate liquid processing method and computer readable recording medium having substrate liquid processing program recorded therein

Disclosed is a substrate liquid processing apparatus that includes: a liquid processing unit that performs a liquid processing on a film formed on a surface of a substrate with an etching liquid; an etching liquid supply unit that supplies an etching liquid to the liquid processing unit; and a controller that controls the etching liquid supply unit. The controller is configured to perform a control such that an etching liquid in a state of having a relatively low etching rate for the film is supplied from the etching liquid supply unit to the liquid processing unit so that the substrate is etched in the liquid processing unit, and then, an etching liquid in a state of having a relatively high etching rate for the film is supplied from the etching liquid supply unit to the liquid processing unit so that the substrate is etched in the liquid processing unit.

Substrate liquid processing apparatus, substrate liquid processing method, and computer-readable storage medium storing substrate liquid processing program

Disclosed are a liquid processing apparatus and a liquid processing method. The liquid processing apparatus includes an ejection port ejecting a first liquid to a wafer, a first liquid supply mechanism supplying sulphuric acid to the ejection port, and a second liquid supply mechanism supplying hydrogen peroxide solution to the ejection port. The first liquid supply mechanism includes a first temperature adjustment mechanism maintaining the first liquid heated to a first temperature, a second temperature adjustment mechanism connected to the first temperature adjustment mechanism, and an ejection line connecting the second temperature adjustment mechanism with the ejection port. The second temperature adjustment mechanism includes a second circulation line and a second heater. The ejection line connects the second circulation line through a switching valve at a location further downstream than the second heater.

Liquid processing apparatus, liquid processing method and storage medium

A top plate is provided with a top plate rotation mechanism configured to rotate the top plate in a horizontal plane. An outside cup peripheral case disposed around a cup is configured to move between an upper position, in which a top end of the cylinder is positioned above the cup, and a lower position located below the upper position. A nozzle support arm configured to support a nozzle is moved, in a horizontal direction, between an advanced position, in which the arm is advanced into the outside cup peripheral case via a side opening formed in a side surface of the outside cup peripheral case when the cylinder is located in the upper position, and a retracted position, in which the arm is retracted outward from the outside cup peripheral case.

Liquid process apparatus and liquid process method

A liquid treatment apparatus includes a substrate holding member that holds a substrate horizontally, a rotation mechanism that rotates the substrate holding member; a chemical liquid nozzle that supplies a chemical liquid to the substrate held by the substrate holding member; a top plate that covers the substrate held by the substrate holding member from above the substrate; and at least one LED lamp that heats the substrate during a chemical liquid treatment by irradiating the substrate with light of a predetermined wavelength through the top plate from above the top plate.

Liquid treatment apparatus and liquid treatment method

A top plateis provided to be moved in a horizontal direction between an advanced position, in which the top platecovers from above a substrate W held by a substrate holding unit, and a retracted position that is retracted from the advanced position. An air hoodconfigured to supply a purified gas downward is provided to be lifted between a lower position, in which the air hood covers from above the substrate W held by the substrate holding unit, and an upper position located above the lower position.

Provided is a substrate processing apparatus in which flexibility of disposing a device configured to determine a holding state of a substrate and the flexibility of timing of determining the holding state are enhanced. The substrate processing apparatus includes a light projector configured to radiate detection light toward a region where a substrate may exist when the substrate is held by a substrate holding member and a light receiver configured to receive the detection light radiated from the light projector. A light path of the detection light from the light projector toward the light receiver passes a substrate surrounding member installed around the substrate held by the substrate holding member. The detection light penetrates the substrate surrounding member and has a wavelength which does not penetrate the substrate.

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Koshi, Japan

Takashi Nagai