Hitachi Chemical Company, Ltd.

Takashi Morinaga

Yoshihiro Nomura

Kazuhito Hanabusa

Hiromu Miyajima

Hiroshi Minamisawa

Hiroshi Nishizawa

Yoshiyuki Mukoyama

Hiromasa Kawai

Toshio Akima

Yutaka Hosoi

Koichi Kakefuda

Toichi Sakata

Kiyoyuki Suzue

Mitsuharu Kato

Toshiaki Fukushima

Yasuyuki Okano

A hot-melt adhesive comprising a special polyamideimide or polyamide is excellent in heat resistance and adhesive strength and usable for providing substrates for printed circuit boards.

Hot-melt adhesive and its use in polyimide film and printed circuit board

A solvent-soluble polyimide obtained from an exo-form dicarboxylic acid anhydride with an aromatic diamine, e.g. 2,2,-bis[4-(4-aminophenoxy)phenyl]propane is improved in film-forming properties and transparency, and particularly suitable for producing an orientation controlling film in a liquid crystal display device.

Solvent-soluble polyimide and production thereof

A polymer obtained by polymerizing tricyclo[5.2.1.0.sup.2,6 ]deca-8-yl acrylate or methacrylate in an amount of 100-5% by weight with one or more copolymerizable unsaturated monomers in an amount of 0 to 95% by weight is excellent in transparency, moisture resistance, and heat resistance and is suitable as a material for optical elements.

Polymers of tricyclo[5.2.1.0.sup.2,6 ]deca-8-yl (meth)acrylate

A process for producing a thermoplastic polymer highly resistant to impact and weather by graft-copolymerizing, in the presence of a water-soluble polymer and a radical polymerization initiator in an aqueous medium, [B] 90 to 60 parts by weight of a monomer mixture comprising 30 to 100% by weight of an aromatic vinyl compound (for example, styrene) and 0 to 70% by weight of acrylonitrile plus methyl methacrylate in which the proportion of acrylonitrile is 20 to 100% by weight and that of methyl methacrylate is 80 to 0% by weight, on [A] 10 to 40 parts by weight (in terms of solids content) of a rubbery copolymer latex obtained by copolymerizing in an aqueous emulsion a mixture comprising [I] 60 to 99.9% by weight of at least one alkyl acrylate (for example, butyl acrylate) having 1 to 13 carbon atoms in the alkyl group, [II] 0 to 20% by weight of at least one vinyl compound copolymerizable with [I] (for example, styrene) and [III] 0.1 to 20% by weight of at least one organic polyallyl compound copolymerizable with [I] (for example, triallyl isocyanurate), which is characterized by previously subjecting the reaction system to a mechanical mixing treatment (mixing by means of, for example, an ordinary agitator, homogenizer, or colloid mill) and then conducting said graft-copolymerization.

Process for producing thermoplastic resin highly resistant to impact and

Growing community of inventors

Chiba, Japan

Takashi Morinaga