Tosoh Corporation

Nichicon Corporation

Screen Holdings Co., Ltd.

Xanavi Informatics Corporation

Takashi Mori

Eiichi Iwata

Nobuhiro Ogawa

Yasuyuki Murakami

Masaya Yamamoto

Hajime Funakoshi

Naoto Suzuki

Kazuaki Yamamoto

Atsushi Harada

Takuo Koyanagi

Ken-ichi Takahashi

Yoshinori Shirakura

Shunsuke Yatsunami

Koichi Yaita

Koji Maeda

Takuya Kawaguchi

Yasushi Ohsaki

A second busbar is provided that has a second electrode terminal and a second connection terminal. A first busbar is provided that has a first electrode terminal, a lateral side coupler, an overhang, and a first connection terminal. The first electrode terminal and/or the second electrode terminal has a protruding piece for connection (connecting protrusion). This protruding piece is elastically depressible in response to contact with an electrode surface of a capacitor element unit inserted from an opposite side of the lateral side coupler across a space between the first and second electrode terminals.

Capacitor and method for manufacturing same

The insulating plate has a swelling protruding in a first direction that is a direction a first plate portion toward a second plate portion. The swelling is formed integral with the insulating plate. The first plate portion has a first fitting part protruding in the first direction and formed integral with this plate portion. The first fitting part is fitted, in the first direction, onto one surface side of the swelling of the insulating plate. The second plate portion has a second fitting part protruding in the first direction and formed integral with this plate portion. The second fitting part is fitted, in a second direction opposite to the first direction, onto the other surface side of the swelling.

Busbar structure for capacitor

The insulating member is integrated with only one of the busbars by insert molding in which one of opposing plate members in either one of the busbars is used as an insert target. The insulating member includes an insulation active portion, a reinforcing portion and a connecting portion. The insulation active portion is disposed on a back-surface side of one of the opposing plate portions and is interposed between the back-surface side and the other one of the opposing plate portions. The reinforcing portion is disposed on the front-surface side of the one of the opposing plate portions. The connecting portion serves to connect the insulation active portion and the reinforcing portion into an integral unit. In the insulating member, lower end regions of the insulation active portion, reinforcing portion and connecting portion, which are close to the capacitor element and extending from an upper-surface side to a lower-surface side of a side plate portion, are embedded in a mold resin that covers the side plate portion.

To provide a printing system, printing control device, and printing control program that can optimize the operating rate of a printer. An operation optimization processing part includes a comparison part and an output destination determination part, and performs a process that in order to the optimize the operating status of a printer, before an RIP process is performed, in accordance with a condition determined by the relationship between an RIP processing speed and a printing speed, for each print data, preliminarily determines a raster data output destination for temporarily storing raster data generated by performing the RIP process of the print data.

Printing system for enabling optimization of printer operation rate, printing control device, and recording medium for recording printing control program

Spinel-type lithium-manganese oxide containing heteroelements preparation process and use thereof

Lithium manganese oxide, and process for its production and secondary cell employing it

A novel heat-resistant low-silica zeolite, an industrial production process, and uses of the low-silica zeolite are provided. The heat-resistant low-silica zeolite contains Si and Al in a molar ratio of SiO.sub.2 /Al.sub.2 O.sub.3 ranging from 1.9 to 2.1, and has sodium and/or potassium as metal cation, wherein the low-silica zeolite contains low-silica faujasite type zeolite at a content of not lower than 88%, and has a thermal decomposition temperature ranging from 870.degree. C. to 900.degree. C. in the air. The process for producing the heat-resistant low-silica zeolite comprises mixing a solution containing an aluminate with another solution containing a silicate, allowing the resulting mixture to gel, and aging the resulting gel, at the temperature of from 0.degree. C. to 60.degree. C., to prepare a slurry having a viscosity ranging from 10 to 10000 cp and containing amorphous aluminosilicate having a specific surface area of not less than 10 m.sup.2 /g with an SiO.sub.2 /Al.sub.2 O.sub.3 molar ratio ranging from 1.9 to 2.1; and subsequently crystallizing the aluminosilicate. The low-silica zeolite ion-exchanged with lithium or an alkaline earth metal is useful for gas separation.

Heat-resistant low-silica zeolite, and process for production and

An electroconductive zinc oxide sintered body composed of sintered particles fusion-bonded in the grain boundaries thereof; which has a sintered density of from 5 to 5.5 g/cm.sup.3 ; and which does not substantially contain closed cells isolated from the outside in the interior of the sintered body. The electroconductive zinc oxide sintered body is prepared by sintering a mixture of an oxide of an element having a positive valency of at least 3 and zinc oxide in the presence of water at a temperature of at least 1,300.degree. C. The electroconductive zinc oxide sintered body is used as a sputtering target for the preparation of a low resistance, transparent electroconductive film.

Zinc oxide sintered body, and preparation process and use thereof

Growing community of inventors

Kyoto, Japan

Takashi Mori