Other

Adv Antest Corporation

Nhk Spring Co., Ltd.

Advantest Coprporation

Takashi Masaki

Takashi Naito

Shigeru Murayama

Katsuhiko Sakamoto

Kenji Yoshida

Shinya Miyaji

Jun Futakuchiya

Hidenori Ishiwata

Shinji Saito

Kenzo Yasuda

Tsutomu Amakawa

Toshihiro Sugisawa

A semiconductor component mounting apparatus for mounting a semiconductor component to test the electric characteristics of the semiconductor component, comprising: a contactor with which the semiconductor component contacts; a substrate which supplies an electric signal to the contractor a plurality of connection components each of which has an electric terminal for supplying the electric signal to the substrate and which is fixed to the substrate a plurality of connectors which has a contact pin including a contact part for contacting with the electric terminal of the connection component a housing for holding the contact pin a pushing apart for pushing the contact pin to the electric terminal and which is freely-detachably connected to one of the plurality of the connection components a holder which holds the plurality of the connectors and a fixing part which fixes the holder to the substrate wherein the contact part slides along the electric terminal while contacting with the electric terminal when the pushing part pushes the contact pin

Semiconductor component mounting apparatus

A semiconductor component mounting apparatus for mounting a semiconductor component to test the electric characteristics of the semiconductor component, comprising: a contactor with which the semiconductor component contacts; a substrate which supplies an electric signal to the contactor ; a plurality of connection components , each of which has an electric terminal for supplying the electric signal to the substrate and which is fixed to the substrate ; a plurality of connectors which has a contact pin including a contact part for contacting with the electric terminal of the connection component , a housing for holding the contact pin , a pushing part for pushing the contact pin to the electric terminal , and which is freely-detachably connected to one of the plurality of the connection components ; a holder which holds the plurality of the connectors , and a fixing part which fixes the holder to the substrate , wherein the contact part slides along the electric terminal , while contacting with the electric terminal , when the pushing part pushes the contact pin

In a heater unit, comprising a lower metallic base, an upper metallic base placed closely over an upper surface of said lower base, and a resistance heater wire received in a groove defined between opposing surfaces of said lower and upper bases, ceramic powder is filled in said groove to keep said heater wire at least away from a wall surface of said groove. Thus, the heater wire can be directly installed in the groove of the base without the intervention of a sheath pipe so that the heater wire can be bent in a desired dense pattern, and the heater unit can be heated both rapidly and uniformly. Also, the ceramic powder filled in the groove improves the heat transfer, and this even further enhances the these advantages of the present invention.

Heater unit for semiconductor processing

A semiconductor component mounting apparatus for mounting a semiconductor component to test the electric characteristics of the semiconductor component, comprising: a contactor,with which the semiconductor component contacts; a substrate,which supplies an electric signal to the contactor,; a plurality of connection components,, each of which has an electric terminal,for supplying the electric signal to the substrate,and which is fixed to the substrate,; a plurality of connectors,which has a contact pin,including a contact part,for contacting with the electric terminal,of the connection component,, a housing,for holding the contact pin,, a pushing part,for pushing the contact pin,to the electric terminal,, and which is freely-detachably connected to one of the plurality of the connection components,; a holder,which holds the plurality of the connectors,; and a fixing part,which fixes the holder,to the substrate,, wherein the contact part,slides along the electric terminal,, while contacting with the electric terminal,, when the pushing part,pushes the contact pin

An upper metallic base is placed over a lower metallic base with a resistance heater element interposed between them so as to cause a plastic deformation to at least one of the opposing surfaces until the corresponding surfaces conform to an outer profile of the heater element, and the opposing surfaces of the lower and upper bases, and the resistance heater element are substantially entirely bonded to one another by a metallic bonding which may consist of brazing, soldering or diffusion bonding. Because the metallic bonding provides a favorable heat conduction, and can thereby improve the thermal efficiency and prevent local heating, a rapid temperature rise and uniform heating are made possible. Because the base consists of two parts, the material for the base can be selected from a wide range of materials including those capable of withstanding high temperatures and corrosive materials.

Growing community of inventors

Kanagawa, Japan

Takashi Masaki