Hitachi, Ltd.

Takashi Kubo

Hiroshi Kikuchi

Norio Nakazato

Naotaka Tanaka

Takashi Suga

Satoru Isomura

Hiroyasu Sasaki

Hideko Ando

Fujiaki Nose

Masanori Fukuhara

Yasuo Osone

Masaki Asagai

A high-frequency signal from a tape-shaped line section having a surface layer signal lead and surface layer GND lead disposed on both sides thereof is directly inputted to a semiconductor chip via a signal surface layer wiring of a package substrate and through solder bump electrodes. Alternatively, a high-frequency signal from the semiconductor chip is outputted to the outside via the tape-shaped line section in reverse. Owing to the transmission of the high-frequency signal by only a microstrip line at the whole surface layer of the package substrate, the high-frequency signal can be transmitted by only the microstrip line at the surface layer without through vias or the like. Accordingly, the high-frequency signal can be transmitted without a loss in frequency characteristic, and a high-quality high-frequency signal can be transmitted with a reduction in loss at high-frequency transmission.

Semiconductor device and electronic device

A method of measuring a thermal resistance of laminated resin sandwiched by a first member and a second member according to the present invention includes measuring, as thermal resistance of resin, a sum of thermal resistance of an interface between the resin and the first member, thermal restistance of an interface between the resin and the second member, and thermal resistance caused by conduction of heat through the resin.

Method of measuring thermal resistance of resin and a measuring apparatus using the method

Growing community of inventors

Chiyoda, Japan

Takashi Kubo