Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

I-pro Co., Ltd.

Takashi Kubara

Hisahiro Tanaka

Matsuo Masuda

Tsuyoshi Tokiwa

Natsushi Ono

Hiroshi Shibata

Yuichi Hatase

Seishi Tomari

Naoto Yoshida

Hirofumi Kama

Yosuke Kawauchi

Shin-ichiro Kaneko

A camera module is provided with: an imaging element which is formed in a rectangular shape and has a plurality of pads provided to a back surface opposite from an imaging surface; a substrate where, on the same plane, a plurality of linear conductors are lined up in parallel and have an insulating coating in a rectangular shape such that the side of one end and the other end in the direction of extension of the conductors is shorter than one side of the imaging element, the conductors at the one end and the other end being exposed at a plate surface front and/or back; and a low-melting-point electroconductive material for connecting, to each of the pads, the conductors of the one end that are exposed due to one end surface of the substrate being abutted against the back surface.

Camera module, camera, and cable connection method for camera module

A three-dimensional image communication terminal can make communication in which there are a sense of being engaged on a place and a sense of reality by use of a three-dimensional image with naturalness and a high robust characteristic. A three-dimensional image communication terminal includes a three-dimensional image input section, a transmitting section that transmits an input image to a communication partner after image processing, a three-dimension image display section which monitor-displays a human image or an object image which was shot, and a telephone calling section which receives three-dimensional image information from a partner and communicates with the other end by voice. The three-dimensional image display section includes an integral photography type horizontal/vertical parallax display device. In the three-dimensional image input section, camerasare disposed in the vicinity of the three-dimensional image display section, in order to capture a telephone calling person or an object at an arbitrary position. The cameras can be configured so as to be detachable, and a human image or an object image, which was captured, is image-processed and becomes an image which can be viewed in three dimensions. Since a communication person can view an image in three dimensions, he can make natural communication.

Three-dimensional image communication terminal

A projection-type three-dimensional image display apparatus includes a projector, a screen and an image former. The projector projects a plurality of element images containing parallax information to a two-dimensional plane. An image is formed on the screen, of a light transmittance that is electrically controlled by the projector. An image former forms a three-dimensional image having a vertical parallax and a horizontal parallax in a space in front of the screen from the projection image.

Three-dimensional image communication terminal and projection-type three-dimensional image display apparatus

It is possible to provide a three-dimensional image display apparatus which can reproduce a three-dimensional image having an appearance of solidity with a simple configuration. The three-dimensional image reproduction apparatus includes: a display devicefor displaying two-dimensional element images having a plurality of horizontal and vertical parallax imagescontaining information on a parallax and an image at the time of reproducing a three-dimensional solid image; and a lensfor forming the three-dimensional solid imageat a predetermined spatial intersection from the element images displayed by the display device. Here, the lensdiffracts the element images and forms the three-dimensional image by the use of a diffraction effect when the element images are emitted from the display device

Lead frame for semiconductor device, process for producing the same and semiconductor device using the same

A lead frame made from Ni, a Ni alloy, Cu, a Cu alloy, Fe or an Fe alloy, comprising an inner lead part with a surface treatment layer of Ag or a Ag-containing alloy and an outer lead part with a surface treatment layer of an alloy containing Ag and Sn, wherein the latter surface treatment layer has a brightness of not less than 0.6 and Sn has the body-centered tetragonal lattice with the crystal orientation indices of from 1.5 to 5 at the (220) plane, not more than 0.9 at the (211) plane and not less than 0.5 at the (200) plane. The surface treatment layer is plated with utilization of a plating solution which contains one or more selected from alkane sulfonic acid, alkanol sulfonic acid and sulfamine acid as the acid component, one or more of tin methane-sulfonate and SnO as a tin salt, and one or more slected from silver methane-sulfonate, Ag O and AgO as a silver salt. The outer lead part may be subjected to a preliminary etching treatment with utilization of a treatment agent of one or more selected from chloric acid, nitric acid and sulfic acid prior to forming the surface treatment layer. The formed surface treatment layer may be treated by a treating agent containing sodium triphosphate.

Semiconductor device with a coating of Pb-free Sn-base solder and manufacturing method therefor

In a lead frame formed out of at least one metal selected from the group consisting of nickel and nickel alloys, copper and copper alloys and iron and iron alloys, the inner lead part is provided with a surface treatment layer of Ag or an alloy containing silver and the outer lead part is provided at least with a surface treatment layer of an alloy containing silver and tin of the body-centered cubic structure preferentially oriented in the (101) plane and/or the (211) plane. According to the above-mentioned structure, a semiconductor device that uses a lead frame for electronic parts which does not contain lead, one of the environmentally harmful pollutants, has good characteristics including solder wettability and bonding strength and is of low cost and a process for producing the device are provided.

Semiconductor devices having tin-based solder film containing no lead

An ink-jet head for injecting ink into a work piece, has an ink passage in which the ink is received, and a pair of electrodes in the ink passage for heating electrically and vaporizing thermally the ink to generate an ink-jet toward the work piece, wherein a crystal grain diameter of the electrodes is not less than 0.1 .mu.m, a total orientation deviation of (002) or (011) crystal orientation face of the electrodes with respect to a direction perpendicular to an electrode layer thickness direction is decreased, and/or a surface roughness of the electrodes is not less than 0.005 .mu.m, so that oxidation and corrosion of the electrodes are restrained.

Growing community of inventors

Fukuoka, Japan

Takashi Kubara