Mitsui Chemicals, Inc.

Takashi Kozeki

Daiki Taneichi

Kazuo Kohmura

Yosuke Ono

Tsuneaki Biyajima

Shuichi Murakami

Atsushi Okubo

Hisako Ishikawa

Toshiaki Hirota

Shintaro Maekawa

Yasuyuki Sato

Akihiro Koide

Minehiro Mori

The purpose of the present invention is to provide: a pellicle frame which is not susceptible to deterioration even if irradiated with short-wavelength light such as excimer light, and which is not susceptible to generation of an outgas or foreign substance; and a pellicle which uses this pellicle frame. In order to achieve the above-described purpose, this pellicle frame for supporting the outer periphery of a pellicle film is configured to comprise a frame and a film that is formed on the surface of the frame and contains a polyimide resin.

Pellicle frame, pellicle containing same, method for producing pellicle frame, and method for producing pellicle

Provided are a pellicle for extreme ultraviolet light lithography, a method for producing the same, and an exposure method. A pellicle according to the present invention includes a first frame having a pellicle film located thereon; a second frame supporting the first frame; a through-hole running through the first frame; and a filter covering the through-hole on the side of a surface of the first frame on which the pellicle film is located. The through-hole may run through the pellicle film; and the filter may be located on the pellicle film. The filter may be located, adjacent to the pellicle film, on the first frame.

Pellicle, pellicle production method and exposure method using pellicle

A pellicle which has a mask adhesive layer that can be plastic-deformed readily particularly at a temperature at which exposure to light is carried out, rarely provides a residue of an adhesive agent upon the removal of the mask adhesive layer from a mask and has good handling properties, and which can prevent the position gap of a pattern. The pellicle comprises a pellicle frame, a pellicle membrane and a mask adhesive layer containing a mask adhesive agent. The mask adhesive agent comprises 100 parts by mass of a thermoplastic elastomer (A) having a tan &#x3b4; peak temperature of &#x2212;20 to 30 DEG C and 20 to 150 parts by mass of an adhesiveness-imparting resin (B).

Pellicle and mask adhesive agent for use in same

The purpose of the present invention is to produce a pellicle film, which is suppressed in light deterioration or photodecomposition due to lithography light exposure, by simpler processes. Specifically disclosed is a pellicle film for lithography containing an amorphous fluoropolymer, which is characterized by containing 5-800 ppm by mass of a fluorine-based solvent. Also specifically disclosed is a method for producing a pellicle film, which comprises: a step A wherein a coating film of a solution that contains an amorphous fluoropolymer and a fluorine-based solvent is formed; and a step B wherein the fluorine-based solvent in the coating film is removed. The method for producing a pellicle film is characterized in that 5-800 ppm by mass of the fluorine-based solvent is caused to remain in the coating film in the step B.

Pellicle membrane

Disclosed is a pellicle having a mask adhesive layer having appropriate softness, having a small adhesive residue after being peeled off from a mask, and having good handling characteristics; and a pellicle for preventing position deviation of patterns, in particular in double patterning. The pellicle of the present invention includes a pellicle frame, a pellicle membrane disposed on one end surface of the pellicle frame, and a mask adhesive layer disposed on other end surface of the pellicle frame; wherein the mask adhesive layer includes 35 to 170 weight parts of a hardness adjuster (B) containing a polypropylene (b1) and a propylene based elastomer (b2) per 100 weight parts of a styrene resin (A); and in an electron microscopic photograph of the mask adhesive layer, a phase-separated structure of a continuous phase of the styrene resin (A) and a discontinuous phase of the hardness adjuster (B) is observed.

Pellicle and mask adhesive therefor

Provided is a pellicle that has appropriate membrane strength, high resistance to chemicals, and a low degree of sulfate ion generation and outgassing. A provided pellicle frame supports the outer rim of a pellicle membrane, and an epoxy resin coating is formed on the surface of the pellicle frame. In the infrared absorption spectrum of said epoxy resin coating, the ratio of the absorbance of a peak in the range between 1450 cmand 1550 cmto the absorbance of a peak in the range between 1200 cmand 1275 cmis at least 0.5 and at most 3; also, the ratio of the absorbance of a peak in the range between 1450 cmand 1550 cmto the absorbance of a peak in the range between 905 cmand 930 cmis at least 1 and less than 7.

Growing community of inventors

Otake, Japan

Takashi Kozeki