Tokyo Electron Limited

Tokyo Electron Limi Ted

Takashi Koga

Masataka Matsunaga

Takahiro Masunaga

Takeshi Tamura

Satoshi Nishimura

Kazutoshi Ishimaru

Masaaki Umitsuki

Fumio Sakata

Toshifumi Inamasu

Masaru Honda

Yuji Mimura

Yasuharu Iwashita

Shingo Katsuki

Yasutaka Soma

Shogo Hara

Yohei Maeda

A separating system includes a placing unit, a removing apparatus and a transfer device. The placing unit is configured to place therein a first cassette allowed to accommodate a combined substrate in which a first substrate and a second substrate are bonded to each other with a separation layer therebetween, a second cassette allowed to accommodate the first substrate, and a third cassette allowed to accommodate the second substrate. The removing apparatus is configured to remove the separation layer by radiating laser light to the combined substrate. The transfer device is configured to perform a processing of transferring the combined substrate to the removing apparatus and a processing of transferring the first substrate and the second substrate separated from the combined substrate to the placing unit.

Separating system and separating method

A bonding system includes a substrate transfer device configured to transfer a first substrate and a second substrate to a bonding apparatus, a first holding plate configured to hold the first substrate from an upper surface side, and a second holding plate disposed below the first holding plate and configured to hold the second substrate from a lower surface side so that the second substrate faces the first substrate. The substrate transfer device includes a first holding part capable of holding the first substrate from the upper surface side, and a second holding part disposed below the first holding part and capable of holding the second substrate from the lower surface side. The first holding part and the second holding part are configured to receive and hold the first substrate and the second substrate at the same time from the first holding plate and the second holding plate.

Bonding system

A substrate transfer device for transferring a first substrate and a second substrate to a bonding apparatus configured to bond the first substrate and the second substrate, includes a first holding part configured to hold the first substrate from an upper surface side, a lower surface of the first substrate serving as a bonding surface, and a second holding part provided below the first holding part and configured to hold the second substrate from a lower surface side so that the second substrate faces the first substrate, a upper surface of the second substrate serving as a bonding surface to be bonded to the lower surface of the first substrate.

Substrate transfer device and bonding system

A bonding system includes a substrate transfer device configured to transfer a first substrate and a second substrate in a normal pressure atmosphere, a surface modifying apparatus configured to modify surfaces of the first substrate and the second substrate to be bonded with each other in a depressurized atmosphere, a load lock chamber in which the first substrate and the second substrate are delivered between the substrate transfer device and the surface modifying apparatus and in which an internal atmosphere of the load lock chamber is switchable between an atmospheric pressure atmosphere and the depressurized atmosphere, a surface hydrophilizing apparatus configured to hydrophilize the modified surfaces of the first substrate and the second substrate, and a bonding apparatus configured to bond the hydrophilized surfaces of the first substrate and the second substrate by an intermolecular force.

Bonding systems

Growing community of inventors

Koshi, Japan

Takashi Koga