Honda Motor Co., Ltd.

Takashi Kobayashi

Katsuyuki Nakajima

Akihiro Nemoto

Hiroaki Yamagishi

Kenichi Fukami

Takayuki Ohnuma

Tsutomu Ando

Ryotaro Takada

Naruhiko Okubo

Seiichi Kouketsu

Kenji Sugai

Hidetaka Hiruma

A laser processing apparatus includes: a work support portion which supports the work and forms a closed space between the work and the work support portion; pads which are movable upward and downward inside the closed space and include upper surfaces respectively coming into contact with regions obtained by dividing a processing object region having the through-holes formed in the work to surround the region of the work over one circle when the pads move upward; a drive unit which drives the pads to move forward and backward between a state in which the pad is in contact with the work and a state in which the pad is separated from the work; a gas supply unit which supplies a gas into the closed space; and clamps which contact the work supported by the work support portion on inner circumferential surfaces and outer circumferential surfaces from above over one circle.

Laser processing apparatus and laser processing method

First steel material, a carbon sheet, and second steel material are put in a state of being separated from each other, and bonding parts are heated by, for example, applying current from a power supply to the carbon sheet. Alternatively, the bonding parts may be heated by an inductive heating coil. Thereafter, heating is terminated if the bonding parts reaching greater than or equal to the eutectic point and less than the liquidus line temperature is detected in the Fe&#x2014;C phase diagram. Furthermore, the carbon sheet is made to be sandwiched between the first steel material and the second steel material.

Method for bonding steel material and device for bonding steel material

A first laser working method includes a step of irradiating the metallic work held by a rotation holding mechanism, with a nanosecond laser beam from a first laser oscillation mechanism, to form a through hole, and a step of irradiating, when the metallic work is rotated under the action of the rotation holding mechanism, the inner wall of the through hole with a picosecond laser beam from a second laser oscillation mechanism, thereby to finish the same. While forming the through hole, metal vapor is sucked from the outside of the metallic work. Then, the gas is fed from the outside of the metallic work, and the inside of the metallic work is suctioned. In a second laser working method, when a lower hole made through is radially enlarged, the exit side of the lower hole is kept lower in pressure than the laser incident (or entrance) side.

Laser working apparatus, and laser working method

A perforation method and an perforation apparatus in which a hollow member of a fuel injection nozzle is filled with a filler such as a zirconia ball, and a laser light is applied to the hollow member to form an injection hole while vibrating the zirconia ball using an ultrasonic vibrator. After the injection hole is formed, the laser light is introduced through the injection hole to the inside of the fuel injection nozzle, and thereby is applied to the vibrated zirconia ball.

Perforation method and perforation apparatus

There is provided a method by which a member having an undercut in the inner peripheral portion thereof can be formed readily. To form a material () formed with a recess () and the undercut () by using a swaging device, while the material () is first gripped by a clamper (), and a mandrel () is inserted into the recess () of the material (). The mandrel () used has an outside diameter equal to the inside diameter of a blind hole of an aimed product (fuel injection nozzle). Then, the material () is pushed in by the mandrel () to a position at which the material () abuts on a stopper (), and the outside surface of the material () is struck by swaging dies () to perform a swaging operation. This swaging operation reduces the inside diameter of the recess () to the outside diameter of the mandrel (), with the undercut () left.

Growing community of inventors

Tochigi-ken, Japan

Takashi Kobayashi