Semiconductor Components Industries, LLC

Sanyo Semiconductor Co., Ltd.

Takashi Kitazawa

Tetsuya Fukushima

Motoaki Wakui

Yasushige Sakamoto

Provided are: a circuit device demonstrating an improved connection reliability while being mounted; and a method for manufacturing the same. The circuit device of the present invention includes: an island; leads arranged around the island, each lead having a lower surface and a side surface exposed to the outside; and a semiconductor element mounted on the island and electrically connected to the leads through thin metal wires. Furthermore, the exposed end portion of the lead is formed to spread toward the outside. By forming the lead in this manner, the area where the lead comes into contact with a brazing filler material is increased, thus improving the connection strength therebetween.

Circuit device having funnel shaped lead and method for manufacturing the same

A semiconductor element () is secured to an island (), and a plurality of through-holes () are formed in the portion of the island (), which surrounds the area to which the semiconductor element () is secured. Further, the electrode pads of the semiconductor element () and leads () are electrically connected by copper wires (). In this structure, the cost of materials is reduced by using the copper wires () in comparison with gold wires. Further, a part of a resin package () is embedded in through-holes (), so that the island () can be easily supported within the resin package ().

Semiconductor device with copper wire ball-bonded to electrode pad including buffer layer

Provided are: a lead frame enabling efficient manufacturing of multiple circuit devices; and a method for manufacturing a circuit device using the same. In the lead frame of the present invention, units are arranged and frame-shaped first and second supporters are provided around the units to mechanically support the units. Moreover, a half groove is provided in the first supporter at a portion on an extended line of a dividing line defined at a boundary between each adjacent two of the units. Furthermore, a penetration groove penetrating a part of the second supporter at a portion on an extended line of another dividing line is provided.

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Kumagaya, Japan

Takashi Kitazawa