Nippon Mining & Metals Co., Ltd.

Takashi Kinase

Toru Imori

Junnosuke Sekiguchi

A ULSI micro-interconnect member having a substrate and a ULSI micro-interconnect formed on the substrate, wherein the ULSI micro-interconnect includes a barrier layer formed on the substrate and a ruthenium electroplating layer formed on the barrier layer; the ULSI micro-interconnect member further including a copper electroplating layer formed using the ruthenium electroplating layer as a seed layer; and a process for fabricating the ULSI micro-interconnect members.

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Takatsuki, Japan

Takashi Kinase