Rohm Co., Ltd.

Kyocera Corporation

Unitika Ltd.

Kureha Kagaku Kogyo K.k.

Takashi Kimura

Hidekazu Otomaru

Satoru Kumazawa

Akira Fujiwara

Akihiko Kitagawa

Eisaku Takahashi

Hiroki Ito

Hiroshi Matsumoto

Kunihiko Takagi

Hisayoshi Kitajima

Munehiko Dombo

Kenichi Oe

An optical element mounting package includes an optical component and a base. The optical component reflects light. The base has a recess. In the recess, a first mounting portion and a second mounting portion are provided. On the first mounting portion, an optical element is to be mounted. On the second mounting portion, the optical component is mounted. The optical component includes a reflective surface and a transmission film on the reflective surface. A front surface of the transmission film is inclined relative to the reflective surface.

Mounting package for an optical element with inclined transmission film and flat mirror

An optical element mounting package includes a recess, a mounting portion for an optical element, and a reflector. The mounting portion is at a bottom surface of the recess. The reflector is, in the recess, positioned forward in an emission direction of light of the optical element. A first portion is a portion of an inner side surface of the recess, and is positioned in an opposite direction to the emission direction. The first portion has an inclined surface toward the bottom surface of the recess.

Optical element mounting package, electronic device, and electronic module

A sensor board includes an insulating substrate having an upper surface and a lower surface, first detection electrodes located on the upper surface of the insulating substrate, second detection electrodes located on the lower surface of the insulating substrate, and a heat generator located between the first detection electrodes and the second detection electrodes inside the insulating substrate and including at least one conductor layer. A portion of the insulating substrate between the heat generator and the first detection electrodes has the same thickness as a portion of the insulating substrate between the heat generator and the second detection electrodes.

Sensor board and sensor device

A semiconductor package in an aspect of the present invention includes a metal board, a first frame, a second frame, and a bond. The metal board has an upper surface including a mount on which a semiconductor device is mountable. The first frame has a side surface facing a side surface of the metal board and has a smaller thermal expansion coefficient than the metal board. The second frame is on upper surfaces of the metal board and the first frame and surrounds the mount, and has a smaller thermal expansion coefficient than the metal board. The bond is between the metal board and the first frame, between the metal board and the second frame, and between the first frame and the second frame. The semiconductor package includes an alloy layer between the metal board and the bond.

Semiconductor package, semiconductor apparatus, and method for manufacturing semiconductor package

A system power supply circuit receives an input voltage V, and supplies a power supply voltage to multiple load circuits including a microcomputer. Multiple power supply circuits support the multiple load circuits. An abnormality detection circuit generates an abnormality detection signal that is negated when the input voltage Vis within, and asserted when it deviates from, the first voltage range, and outputs this signal to the microcomputer. The interface circuit can communicate with the microcomputer. The interface circuit receives a control signal generated by the microcomputer in response to abnormality detection signal assertion, and suspends power supply circuit operation of a channel indicated by the control signal. When the input voltage Vdeviates from a second voltage range defined to be wider than the first voltage range, an internal protection circuit suspends at least one power supply circuit of a predetermined channel.

System power supply circuit

There are provided a sensor substrate and a sensor device which have high detection accuracy. A sensor substrate includes an insulating substrate; sensing electrodes disposed in the insulating substrate, the sensing electrodes being columnar and being composed of at least one pair of positive and negative sensing electrodes, in the at least one pair of positive and negative sensing electrodes, part of a positive electrode and part of a negative electrode being each exposed from one surface of the insulating substrate; and innerlayer wiring lines embedded within the insulating substrate, the innerlayer wiring lines corresponding to the positive electrode and the negative electrode, respectively, in the at least one pair of positive and negative sensing electrodes.

Sensor substrate arrangement for a particulate sensor device

A sensor board includes: an insulating substrate having a principal surface; and a detecting electrode disposed on the principal surface of the insulating substrate, the detecting electrode being formed mainly of a first metallic material composed of a base-metal based material which is catalytically inactive with respect to a decomposition reaction of particulates, an exposed surface of the detecting electrode being covered by a passivation film of the first metallic material.

Sensor board, lead-bearing sensor board, and sensor device

A sensor substrate according to the present invention includes an insulating substrate, a detection electrode on a principal surface of the insulating substrate, and resistance wiring including a heating electrode in the insulating substrate. The resistance wiring includes a multilayer wiring portion which is connected to the heating electrode and in which wires and other wires are connected in parallel.

Sensor substrate and sensor device

A regulator circuit includes: a regulator part configured to generate a constant internal power supply voltage based on an external power supply voltage; a connection port configured to receive power from the regulator part and to be connected to a connection cable having a predetermined cable resistance, the connection cable is configured to electrically connect the connection port to an external device; a current detecting part configured to detect a power supply current when the connection cable is connected to the connection port; and a voltage compensation part configured to compensate a voltage corresponding to a voltage drop due to the cable resistance according to a current value detected by the current detecting part.

Charging device including regulator circuit and integrated circuit

A wiring board includes an insulating substrate composed of a ceramic sintered compact; and a connection pad disposed on a surface part of the insulating substrate. The connection pad includes a first portion disposed on the surface part of the insulating substrate and a second portion disposed on the first portion and an outer periphery of the second portion being located on an inner side of an outer periphery of the first portion. The second portion of the connection pad is composed of platinum, and at least an exposed surface part of the first portion of the connection pad is composed of platinum containing a ceramic component.

Wiring board, wiring board with lead, and electronic device

A composition which can significantly accelerate equol production is provided. When formulated in a pharmaceutical preparation or a food or drink, this composition exerts effects of preventing a vascular disease by the cholesterol lowering function, preventing breast cancer or prostatic cancer, and preventing and/or treating osteoporosis. Also, when formulated in a feed or a pet food, the bone density is enhanced, so that it exerts effects to prevent weak legs of a pig, to strengthen egg shell of a laying hen, to prevent osteoporosis in a dog etc., and the like. It is a composition which comprises lactobionic acid, a salt of lactobionic acid or lactobionolactone as an active ingredient and a food or drink, a feed, a pet food or a pharmaceutical preparation, which contains the composition, and have effects to prevent and treat osteoporosis, an function to increase bone density, an effect to prevent breast cancer or prostatic cancer, and a cholesterol lowering function.

Equol production accelerating composition

A feed additive for laying hens comprising lactobionic acid or a lactobionic acid salt and a feed characterized by containing a feed additive for laying hens comprising lactobionic acid or a lactobionic acid salt and a feed. Namely, a feed additive for laying hens, which is excellent in effect of reinforcing eggshells, shows a particularly remarkable effect of improving eggshell qualities in the second half of the laying period, relieves stress caused by forced molting, cage transfer and so on and can inhibit lowering in the egg-laying rate.

Feed additive for laying hen and feed containing the same

The invention has such a double hetero structure () that an active layer () is sandwiched by an n-type clad layer () and a p-type clad layer () on a semiconductor substrate () made of GaAs. In the p-type clad layer (), for example, an n-type current constriction layer () consisting of at least two layers is provided in such a configuration that a first layer () thereof closer to the active layer is made of a material having almost the same refractive index as the p-type clad layer and a second layer () thereof farther from the active layer is made of a material having a smaller refractive index than the first layer (). By this configuration, a self-excitement type and high-power semiconductor laser can be obtained which operates in a stable manner up to a high power without generating a kink while being self-excited at a low power. Another embodiment of the invention comprises a current constriction layer having an n-type in which a stripe trench is formed in the p-type clad layer, and a light confinement layer having a smaller refractive index than the p-type clad layer is formed at the current constriction layer facing the active layer, so as to be of a p-type or non-doped type. By this configuration, a semiconductor laser can be obtained which operates up to a high power without generating a kink.

Semiconductor laser

A semiconductor laser device having a lower cladding layer, an active layer and an upper first cladding layer stacked on a compound semiconductor substrate in this order, a ridge-shaped upper second cladding layer provided on the upper first cladding layer, a current blocking layer provided on both sides of the upper second cladding layer, and a contact layer provided on the upper second cladding layer. A current interrupting layer or layers formed of an insulating material are provided between the upper second cladding layer and the contact layer, in the vicinity of at least one of a laser emission end face and a reflective end face, which are both end faces of the device in the longitudinal direction of the upper second cladding layer.

Semiconductor laser and method of producing the same

The present invention provides a ridge-type semiconductor laser devise comprising: a lower cladding layer of a first conductivity type, an active layer, and a first upper cladding layer of a second conductivity type, which are sequentially stacked on a compound semiconductor substrate of the first conductivity type; a second upper cladding layer of the second conductivity type which has a ridge shape and is provided on the first upper cladding layer; and a contact layer of the second conductivity type provided on the second upper cladding layer. Current blocking layers are provided on the first upper cladding layer, alongside the second upper cladding layer. Respective sections of these current blocking layers that follow the sides of the second upper cladding layer are of the second conductivity type, and respective sections of these current blocking layers that follow the first upper cladding layer are of the first conductivity type.

Growing community of inventors

Kyoto, Japan

Takashi Kimura