Yamatake-honeywell Co., Ltd.

Yamatake Corporation

Takashi Kihara

Yoshiyuki Ishikura

Takashi Masuda

Shigeo Kimura

Takaaki Kuroiwa

Yasuhiro Goshoo

Pads and to be bonded to connection members are formed at positions where the pads face electrode extraction holes to A bonding agent low in wettability for the surfaces of electrodes and is used. The bonding agent and high-wettability material form the surfaces of the pads and This can firmly bond the connection members to the electrodes and and can prevent the electrodes and from short-circuiting.

Sensor and method of producing the same

An electrostatic capacity-type pressure sensor includes a diaphragm support body, first and second lids, a fixed electrode, a coupling member, an electrode support member, and a movable electrode. The diaphragm support body is formed into a tube shape. The first and second lids have thin diaphragm portions and thick fixing portions formed integrally with peripheral edge portions of the diaphragm portions and are arranged to face each other by bringing the fixing portions in tight contact with the two end portions of the diaphragm support body. The first and second lids separate the interior of the diaphragm support body from the outside by closing the two end portions of the diaphragm support body. The fixed electrode is formed on the inner surface of the fixing portion of at least one of the first and second lids. The coupling member has two ends respectively connected to the first and second lids to couple the diaphragm portions facing each other. The electrode support member is supported by the coupling member and arranged between the first and second lids at a predetermined interval. The movable electrode is formed on the electrode support member so as to face the fixed electrode. The movable electrode and the fixed electrodes are arranged parallel to each other at a predetermined interval to constitute a capacitor.

Electrostatic capacity-type pressure sensor

A capacitive pressure sensor is provided which is capable of highly accurately and reliably measuring pressure over a wide range from an extremely low level to a high level without being affected by environmental changes. The capacitive pressure sensor is constructed of a first diaphragm; a second diaphragm arranged in parallel with the first diagram; a diaphragm support arranged between the first and second diaphragms for supporting the first and second diaphragms along the periphery thereof to define a space isolated from the outside; a plurality of pillars having respective ends fixed on the opposing surfaces of the first and second diaphragms for securely supporting the first and second diaphragms; a movable electrode formed on one of the opposing surfaces of the first and second diaphragms; and a fixed electrode formed in the space without contacting with the plurality of pillars and securely supported by the diaphragm support. Pressure values measured by the capacitive pressure sensor are substantially free from errors due to fluctuations in atmospheric pressure and errors caused by aging changes of residual stress on the bonding interface.

Capacitive pressure sensor isolating electrodes from external environment

A capacitive pressure sensor includes first and second substrates, a groove, and first and second electrodes. The first substrate consists of an electrical insulating material. The second substrate consists of the same material as that for the first substrate and has a peripheral portion directly bonded to the first substrate. The groove is formed in a central portion of the surface of one of the first and second substrates. The first and second substrates oppose each other through the groove. The first electrode is coupled to a surface, of the first substrate, which opposes the second substrate so as to be movable together with the first substrate. The second electrode is arranged on a surface, of the second substrate, which opposes the first substrate so as to be parallel to the first electrode. The first and second substrate may consist of quartz glass or sapphire. The first and second substrates are bonded to each other at a temperature lower than the melting point of the substrate material without forming any bonding layer.

Growing community of inventors

Kanagawa, Japan

Takashi Kihara