Nhk Spring Co., Ltd.

Canon Anelva Corporation

Takashi Kayamoto

Shinji Saito

Masayoshi Ikeda

Yasumi Sago

Toshihiro Tachikawa

Kazuaki Kaneko

Takuji Okada

Tadashi Inokuchi

Toshihiko Hanamachi

Satoshi Hirano

Yuichiro Yamauchi

Gou Takahara

A temperature regulator or the like that can circulate a desired thermal medium and efficiently transfer the heat of the thermal medium is provided. The temperature regulator includes a pipe that is made of a metal or alloy with corrosion resistance to a predetermined thermal medium and that serves as a flow path for circulating the thermal medium; and a plate in which the pipe is buried, wherein the plate is formed by accelerating powder made of aluminum (Al) or alloy together with a gas and thereafter spraying the powder remaining in a solid phase toward the pipe so that the powder is deposited on the pipe.

Temperature regulator, cooling device, and method for manufacturing temperature regulator

A stage heater and a method of manufacturing a shaft capable of suppressing heat transfer from a heating substrate toward the shaft. The stage heater includes: a heating substrate made of aluminum or an alloy containing aluminum; and a shaft that is bonded to one surface of the heating substrate and supports the heating substrate. The shaft includes: a pipe made of a metal having a lower heat conductivity than a material of the heating substrate; and a bonding layer formed on a side of the pipe to be bonded to the heating substrate by accelerating a powder material of aluminum or a powder material of an alloy containing aluminum together with a gas and blowing the powder material while being maintained in a solid phase to the pipe so as to deposit thereon.

Stage heater and method of manufacturing shaft

A conductive member disposed as a power supply line and the like includes: a first conductive material and a second conductive material, at least one of which includes a conductive material having electrical resistance lower than that of aluminum; and a metal film formed by depositing powder including a metal, which is accelerated together with a gas and sprayed, in a sold state, onto a surface of a butting part, where the first conductive material and the second conductive material are butted against each other.

Conductive member

This application discloses the structure of an ESC stage where a chucking electrode is sandwiched by a moderation layer and a covering layer. The moderation layer and the covering layer have the thermal expansion coefficients between the dielectric plate and the chucking electrode. This application also discloses the structure of an ESC stage where a chucking electrode is sandwiched by a moderation layer and a covering layer, which have internal stress directed oppositely to that of the chucking electrode. This application further discloses a substrate processing apparatus for carrying out a process onto a substrate as the substrate is maintained at a temperature higher than room temperature, comprising the electrostatic chucking stage for holding the substrate during the process.

Electrostatic chucking stage and substrate processing apparatus

An electrostatic chuck comprising a ceramic chuck body having an adsorption face and an electrode for applying a potential to the adsorption face, the chuck body including a ceramic consisting mainly of MgO. The ceramic that consists mainly of MgO is doped with one or more additives selected from a group including TiC, TiO , ZrO , V O , Nb O , Ta O , Co O , Cr O , and NiO so that its electrical resistivity in a working temperature region ranges from 1&times;10 to 1&times;10 &OHgr;&middot;cm. This electrostatic chuck is highly resistant to a corrosive environment such as fluoride plasma.

Electrostatic chuck

Provided is a brazing filler metal for brazing stainless steel at low temperatures so as not to adversely affect the properties of the stainless steel, and without producing any brittleness in the brazed joint. The brazing filler metal essentially consists of 5 to 30 weight % of Mn or Sn, 20 to 70 weight % of Cu, inevitable impurities, and a balance of Ni. The brazing filler metal may further include no more than 3 weight % of Cr and/or Si.

Growing community of inventors

Isehara, Japan

Takashi Kayamoto