Clariant Finance (bvi) Limited

Az Electronic Materials USA Corp.

Ridgefield Acquisition

Takashi Kanda

Tatsuro Nagahara

Hatsuyuki Tanaka

Ralf Grottenmueller

Takashi Fujiwara

An inorganic polysilazane resin of the present invention has a Si/N ratio (i.e. a ratio of contained silicon atoms to contained nitrogen atoms) of 1.30 or more. The inorganic polysilazane resin having such a high Si content can be produced by, for example, a method in which an inorganic polysilazane compound containing both Si&#x2014;NH and Si&#x2014;Cl is heated to react NH with Cl, a method in which a silazane oligomer (polymer) that leaves no Si&#x2014;Cl bond is synthesized and a dihalosilane is added to the synthesized silazane oligomer (polymer) to perform a thermal reaction, and the like. A siliceous film can be formed by, for example, applying a coating composition containing the inorganic polysilazane resin onto a base plate and then dried and the dried product is then oxidized by bringing the dried product into contact with water vapor or hydrogen peroxide vapor and water vapor under heated conditions.

Inorganic polysilazane resin

The developer of the present invention is used in a method where a water-soluble resin coating layer is applied on a resist pattern formed by the conventional method, and the coating layer is crosslinked by an acid supplied from the resist, and the uncrosslinked area in the coating layer is dissolved and removed with a developer to thicken the resist pattern. This developer comprises an aqueous solution containing at least one surfactant selected from an N-acylsarcosinate, an N-acyl-N-methylalaninate, an N-acyltaurinate, an N-acyl-N-methyltaurinate, a fatty acid alkylol amide, and a fatty acid alkylol amide polyoxyethylene adduct.

Aqueous surfactant solution for developing coating film layer

A water-soluble resin composition comprising (1) a water-soluble resin, (2) a water-soluble crosslinking agent, (3) at least one of surface active agents selected from acetylene alcohols, acetylene glycols, polyethoxylates of acetylene alcohols and polyethoxylates of acetylene glycols, and (4) a solvent consisting of water or a mixture of water and a water-soluble solvent. This water-soluble resin composition is applied onto a resist pattern, then heated to crosslink by an acid supplied from the resist, followed by development to remove the non-crosslinked water-soluble resin coating layer. This water-soluble resin composition is excellent in coating characteristics on steps of resist patterns and in dimensional regulation upon fining of patterns so that resist patterns such as trench patterns and hole patterns can effectively be fined.

Growing community of inventors

Shizuoka, Japan

Takashi Kanda