Fujitsu Corporation

Takashi Kanda

Kenji Fukuzono

Masateru Koide

Shunji Baba

Takashi Nakagawa

Manabu Watanabe

Hideaki Yoshimura

Yasutomo Maehara

Kenji Iida

Kiyotaka Seyama

Misao Umematsu

Tomohisa Yagi

Yasuhiro Usui

Kaoru Sugimoto

Hitoshi Suzuki

Hidehiko Kira

Masanori Hashimoto

Takayoshi Matsumura

Tomoyuki Abe

Makoto Suwada

Shunichi Kikuchi

Minoru Hirano

Yasuo Tezuka

Satoshi Maruyama

Hiroaki Date

Jun Sugiyama

Shin Hirano

Noritsugu Ozaki

Hitoshi Nori

Kayo Motohashi

Yuki Hoshino

Tadanori Yokosawa

Nao Miyazaki

Seiichi Sugano

Souichi Obata

Hidekazu Kuniyoshi

A board includes a substrate having a bending property, a wiring pattern formed over the substrate and having a bending property, a conductive member formed over the wiring pattern, an electronic component; and a bonding member that bonds the conductive member and the electronic component to each other. And an electronic device includes a board having a bending property, a wiring pattern formed over the substrate and having a bending property, a conductive member formed over the wiring pattern, an electronic component; and a bonding member that bonds the conductive member and the electronic component to each other.

Board and electronic device

Electronic equipment includes: a substrate configured to include a first component, a second component, and an interconnection part that couples the first component with the second component by electric interconnections; and an exterior part configured to cover the first component, the second component, and the interconnection parts, and include a first exterior section that covers at least a portion of the first component, and a second exterior section that covers at least a portion of the interconnection parts, a thickness of the first exterior section being different from a thickness of the second exterior section to form a level difference in a boundary part between the first exterior section and the second exterior section.

Electronic equipment and beacon

A semiconductor package includes: a first substrate, disposed so as to be opposed to a second substrate, on which a semiconductor chip is mounted; and a solder ball formed on the first substrate, wherein the solder ball is joined to a pin that penetrates through the second substrate.

Semiconductor package, electronic device, and solder mounting method

A multilayer substrate includes a first substrate a second substrate that is stacked on and electrically connected to the first substrate, the second substrate having a different characteristic from a characteristic of the first substrate, a third substrate that is provided on a side of the first substrate, the second substrate being provided on the side of the first substrate, and the third substrate is electrically connected to the second substrate, and a connection member that electrically connects the first substrate and the third substrate to each other while the second substrate is bypassed.

Multilayer substrate

A package mounting structure includes: a first substrate having wiring; a second substrate having wiring; at least one cooling unit having a first face and a second face different from the first face; at least one power supply unit that is mounted on the first substrate and is joined to the first face of the cooling unit; and at least one electronic component that is mounted on the second substrate and is joined to the second face of the cooling unit, wherein the power supply unit supplies power to the electronic component through the wiring of the first substrate, the cooling unit, and the wiring of the second substrate.

Package mounting structure

There is provided a manufacturing method of a layered circuit board in which a first board and a second board are layered. The method includes arranging an adhesive resin sheet on the first board so that one face faces the first board, the adhesive resin sheet including a plurality of variant via holes, an opening area on the one face of each of the plurality of variant via holes being larger than an opening area on the other face, filling the variant via holes with conductive paste, arranging the second board on the other face of the adhesive resin sheet after the filling with the conductive paste, and performing heat press treatment to apply pressure to the adhesive resin sheet in a layering direction of the first board and the second board under heat.

Method for manufacturing layered circuit board, layered circuit board, and electronic device

An embodiment of a stacked structure includes: a first substrate that includes a first electrode; a second substrate that includes a second electrode; and an adhesive resin material that is provided between the first substrate and the second substrate and includes a plurality of conductive vias, the plurality of conductive vias electrically connecting the first electrode and the second electrode.

Stacked structure and manufacturing method of the same

A semiconductor device mounting structure includes: a substrate with an opening provided therein; a frame member with a frame body and a protruding portion that protrudes from the frame body, the frame body being formed and accommodated in a groove around the opening; a coreless substrate provided above the substrate and supported by the protruding portion of the frame member; and semiconductor elements provided on the coreless substrate.

Method of manufacturing semiconductor device mounting structure

Semiconductor device mounting structure, method of manufacturing the same, and electronic apparatus

For processing an uplink signal from a mobile station without desiring a high AFC capability in any state, in a wireless base station including a plurality of antennas, reception signals from a mobile station are taken in to perform a signal transmission and reception with the mobile station by a first antenna providing a higher reception signal level, in which a switchover from a signal transmission to the mobile station by the first antenna to that by a second antenna is performed when a frequency variation characteristic measured for an allocated frequency of the reception signal from the first antenna indicates that the mobile station is moving away from the first antenna.

Wireless base station and control method thereof

A semiconductor device includes a multi-layer substrate and a semiconductor element mounted on the multi-layer substrate. The multi-layer substrate contains a plurality of circuit-formation layers joined by a first resin material. The semiconductor element is mounted on the multi-layer substrate by being joined to the multi-layer substrate by a second resin material. The first resin material and the second resin material are curable in the same heating condition.

Semiconductor device and manufacturing method of a semiconductor device

The first support body is pressed against the second support body in response to the softening of the adhesive sheet. The fillers are allowed to reliably contact with one another between the first electrically-conductive land and the second electrically-conductive land. The fillers melt after the adhesive sheet has been softened. The intermetallic compounds are formed between the fillers and the electrically-conductive lands and between the fillers. Electrical connection is in this manner established between the first electrically-conductive land and the second electrically-conductive land. The matrix material and the adhesive sheet are then cured. The first support body and the second support body are firmly bonded to each other.

Method of making printed wiring board and method of making printed circuit board unit

A plurality of base transceiver stations and at least one extension device are connected, via an IP network that uses internet protocol. The extension device shares resources of the base transceiver stations by arbitrary changing a connection relationship between the base transceiver stations and the extension devices. When a mobile terminal communicates with a core network, the extension device uses the resources of at least one base transceiver stations according to fluctuation in the amount of traffic.

Radio communication system, base transceiver station, and extension device

A circuit board has a low thermal expansion coefficient that suits the thermal expansion coefficient of an element to be mounted thereupon and can prevent the occurrence of delamination and cracking of a core layer when the circuit board is used in a low temperature environment. The circuit board is constructed by laminating a core layer and at least one wiring layer, where the at least one wiring layer has slightly smaller external dimensions in a planar direction than the core layer.

Circuit board

A radio communication system for conducting the radio communication with a terminal device includes a first radio communication apparatus for processing a first signal; a second radio communication apparatus for processing a second signal, and to combine the first signal and the second signal; a common amplifier for amplifying the first and second signals from the second radio communication apparatus, transmitting the amplified signals to the terminal device, amplifying first and second signals received from the terminal device, and outputting the amplified signals to the second radio communication apparatus, the second radio communication apparatus separating the amplified first and second signals; and a switching apparatus coupled to the first radio communication apparatus, the second radio communication apparatuses and the common amplifier to disconnect the first or second radio communication apparatus when a fault occurs in the first or second radio communication apparatus, respectively.

Growing community of inventors

Kawasaki, Japan

Takashi Kanda