Kawasaki Jukogyo Kabushiki Kaisha

Takashi Kajikawa

Mizuo Edamura

Satoru Kunise

Satoshi Furuitsu

Minoru Makimura

Koji Okamoto

A sputtering system including a workpiece and at least one target located in a vacuum reaction furnace, wherein a magnetic field is generated between the workpiece and the target and a electric field perpendicular to the magnetic field generated between the workpiece and the target is additionally generated. A plurality of targets may be located around the workpiece and either the workpiece or the targets may be rotated when the magnetron discharge is generated.

Sputtering system

Disclosed is an improved ion-nitriding process comprising ion-nitriding a workpiece at a high voltage level of glow discharge in a gas atmosphere resulting from the introduction of a gas mixture containing a specific amount of ammonia into a nitriding reactor, and then, further ion-nitriding the same workpiece at a lower voltage level of glow discharge in a gas atmosphere resulting from the introduction of a gas mixture not containing ammonia into the reactor.

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Miki, Japan

Takashi Kajikawa