Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Takashi Iwakiri

Kazuo Kawahito

Tsuyoshi Yoshino

Junichi Kurita

Kenji Kuranuki

Masakuni Ogino

Hiroshi Serikawa

Koji Ueoka

Masahiro Yabushita

Hirotoshi Toji

A solid electrolytic capacitor includes a capacitor element including a cathode portion and an anode portion, a cathode terminal bonded to the cathode portion, an anode terminal bonded to the anode portion, and an enclosure resin covering the capacitor element. The cathode terminal includes a cathode lower surface portion, a cathode connection portion, and a cathode support portion. The cathode connection portion is connected to an end portion of the cathode lower surface portion on an anode side and bonded to the cathode portion through a conductive adhesive. The cathode support portion is connected to a side portion of the cathode lower surface and brought into contact with a lower surface of the cathode portion on an end portion side of the cathode portion without involving the conductive adhesive therebetween.

Solid electrolytic capacitor

A solid electrolytic capacitor includes a planar solid electrolytic capacitor element having anode and cathode portions; anode and cathode terminals; and insulating coating resin. The anode terminal is electrically connected at the top surface thereof to the anode portion. The cathode terminal is electrically connected at the top surface side thereof to the cathode portion. The coating resin integrally coats the capacitor element so as to expose the bottom surfaces of the anode and cathode terminals. The anode and cathode terminals are disposed as close to each other as not more than 3 mm. The anode and cathode terminals have stair steps on both sides thereof and are connected to the anode and cathode portions at joint faces, respectively. The anode joint faces and the cathode joint faces are coated with coating resin. The solid electrolytic capacitor is provided with the anode joint faces and/or the cathode joint faces.

Solid-electrolyte capacitor, manufacturing method thereof, and digital signal processing substrate using the solid-electrolyte capacitor

A chip type solid electrolytic capacitor of the present invention has a section formed in a step-wise manner on a cathode lead frame that is connected with a capacitor element. An anode lead wire of the capacitor element is resistance welded to the top of a reversed V-letter shaped structure formed by folding part of an anode lead frame into halves. Further, with the chip type solid electrolytic capacitor of the present invention, part of respective cathode and anode lead frames is exposed outside in such a way as being made flush with the periphery of a resin package, thereby each serving as a terminal. Accordingly, a space problem due to the terminals has been eliminated and the anode lead wire can be made short, thus allowing the volume of a capacitor element employed to be increased. As a result, a chip type solid electrolytic capacitor having a large capacity with its outer dimensions is kept the same as a prior art capacitor can be obtained.

Chip type solid electrolytic capacitor and its manufacturing method

Growing community of inventors

Kyoto, Japan

Takashi Iwakiri