Renesas Electronics Corporation

Toyota Jidosha Kabushiki Kaisha

Takashi Iwadare

Yasutaka Nakashiba

Akira Matsumoto

Teruhiro Kuwajima

Masayuki Furumiya

Shinichi Uchida

Yoshiyuki Sato

Jun Morimoto

Kozo Kato

Hidetoshi Morishita

Masato Taki

Hiroshi Sakakibara

Makoto Eguchi

A SOP has a semiconductor chip. The chip includes a pair of a lower layer coil and an upper layer coil laminated through an interlayer insulating film formed therebetween, a first circuit unit electrically coupled to the upper layer coil, and a plurality of electrode pads. Further, it has a wire for electrically coupling the upper layer coil and the first circuit unit, a plurality of inner leads and outer leads arranged around the semiconductor chip, a plurality of wires for electrically coupling the electrode pads of the semiconductor chip and the inner leads, and a resin made sealing member for covering the semiconductor chip. The wire extends along the extending direction of the wires.

Semiconductor device

A first semiconductor chip includes a first inductor and a second inductor, and a second semiconductor chip includes a third inductor and a fourth inductor. The first inductor is connected to a first receiving circuit of the first semiconductor chip, and the second inductor is connected to a second transmitting circuit of the second semiconductor chip through a first bonding wire. The third inductor is connected to a second receiving circuit of the second semiconductor chip, and the fourth inductor is connected to a first transmitting circuit of the first semiconductor chip through a second bonding wire.

Growing community of inventors

Ibaraki, Japan

Takashi Iwadare