Kabushiki Kaisha Toshiba

Ohkawara Kakohki Co., Ltd.

Fuji Xerox Co., Ltd.

Tdk Corporation

Fuji Photo Film Company, Limited

Kyocera Corporation

Toshiba Memory Corporation

International Business Machines Corporation

Renesas Electronics Corporation

Shin-Etsu Chemical Co., Ltd.

Victor Company of Japan, Limited

Kioxia Corporation

Ajinomoto Co., Ltd.

Ube Industries, Inc.

San-Apro Limited

Takashi Ito

Masatoshi Tanabe

Tsuneo Hagiwara

Masaaki Ohkawara

Akira Tojo

Hiroki Takahashi

Katsumi Kobayashi

Kazuo Shimokawa

Hitoshi Masumura

Shoichi Iwaya

Motofumi Baba

Shuichi Suzuki

Masayuki Uchida

Tsuyoshi Sunohara

Hajime Kishimoto

Shinichi Kinoshita

Takahiro Aizawa

Takeo Iwasaki

Shuji Mochizuki

Haruka Yamamoto

Yasuaki Seki

Tatsuya Kobayashi

Kenichi Nakamura

Hiroshi Nakashima

Takuya Nakaike

Takayoshi Aoki

Toshiyuki Ozai

Hironobu Takagi

Kenji Hirotsu

Tadahiro Tsujimoto

Tadashi Murakami

Taizo Tomioka

Kensaku Tanaka

Yuichi Yashiki

Masashi Date

Takeshi Miyao

Hideki Kimura

Kentaro Fukuda

Yasunari Ukita

Kyoichi Takenaka

Kiyonori Furuta

Masahiko Hodumi

Yuusaku Shibuya

Masayoshi Nakajima

Misao Takahashi

Shizuo Aishima

Toshihiko Hatajima

Jiro Yamamoto

Masaharu Terayama

Tomokazu Kawase

Yutaka Yoshitani

Yuzuru Ohki

Masakazu Mori

Fumitaka Nakjajima

Harumitsu Mizuishi

Nobuo Takeuchi

According to an embodiment, a battery includes an exterior container, a lid member, a plurality of electrode groups, a first lead, a second lead, and an electrode terminal. The lid member closes an opening of an inner cavity of the exterior container, and the plurality of electrode groups are stored in the inner cavity. A first current collecting tab protruding toward the lid member in a first electrode is joined with the first lead, and a second current collecting tab protruding toward the lid member in the second electrode different from the first electrode is joined with the second lead separate from the first lead. The first and second leads are together connected to the electrode terminal exposed on an outer surface of the lid member.

Battery

A wire bonding apparatus according to an embodiment bonds a wire to a bonding portion by generating an ultrasonic vibration in a state of pressing the wire onto the bonding portion. The wire bonding apparatus includes a bonding tool that causes the wire to contact the bonding portion and applies a load, an ultrasonic horn that generates the ultrasonic vibration, a load sensor that continuously detects the load applied from the bonding tool to the bonding portion, and a controller that controls the operation of the bonding tool and the ultrasonic horn. The controller analyzes data of the load output from the load sensor between when the wire contacts the bonding portion and when the ultrasonic vibration is generated, and controls the operation of the bonding tool and the ultrasonic horn based on an analysis result.

Wire bonding apparatus and wire bonding method

An ultrasonic bonding apparatus includes a sensor that detects vibration along a height direction in a bonding target member which vibrates by ultrasonic vibration. The ultrasonic bonding apparatus includes a control device that changes control parameters associated with the driving of a bonding tool based on information related to the vibration along the height direction detected by the sensor.

Ultrasonic bonding apparatus, control device and control method

An ultrasonic bonding apparatus includes a temperature sensor that detects a temperature of a bonding target member arranged on an upper side of a stage. The ultrasonic bonding apparatus includes a control device that changes a control parameter associated with the driving of a bonding tool based on information related to the temperature detected by the temperature sensor.

Ultrasonic bonding apparatus

A semiconductor device includes a base, a first semiconductor chip mounted on the base, and a second semiconductor chip provided above the first semiconductor chip. The second semiconductor chip includes a first portion, a second portion including a region directly above a center of the first semiconductor chip, and a third portion including part of a portion of the second semiconductor chip other than a region directly above the first semiconductor chip. The second portion is thicker than the first portion. The third portion is thicker than the second portion and is disposed at a position sandwiching the first semiconductor chip.

Semiconductor device and method for manufacturing semiconductor device

A friction stir welding method includes joining a first metal member, a second metal member, and a third metal member by pressing a tool onto a joining member while rotating the tool. The tool has a protrusion at a tip of the tool. The joining member includes the first metal member, the second metal member, and the third metal member. A major element of the second metal member is the same as a major element included in the first metal member. The third metal member is sandwiched between at least a portion of the first metal member and at least a portion of the second metal member. A major element of the third metal member is the same as the major element included in the first metal member and the second metal member. A crystal grain size of the third metal member is 20 &#x3bc;m or less.

Friction stir welding method and joined body

A semiconductor device includes a base including interconnects, a first semiconductor chip including a first semiconductor element portion, and a second semiconductor chip including a second semiconductor element portion. The second semiconductor chip is electrically connected to the first semiconductor chip via at least one of the interconnects. The second semiconductor chip includes a first region, a first portion, and a second portion. The first region includes the second semiconductor element portion. The first portion is continuous with the first region. The second portion is continuous with the first region and is separated from the first portion in a second direction crossing a first direction. The first direction is from the base toward the first region. The second portion, the first portion, and at least a portion of the first semiconductor chip each is positioned between the base and the first region.

Semiconductor device, method for manufacturing semiconductor device, and method for manufacturing semiconductor package

According to one embodiment, the first end part of the first semiconductor chip in a lower stage protrudes to a larger extent in a first direction than the first end part of the first semiconductor chip in an upper stage. The second end part of the second semiconductor chip in a lower stage protrudes to a larger extent in a second direction opposite from the first direction than the second end part of the second semiconductor chip in an upper stage. The first interlayer semiconductor chip includes a first portion, a second portion, and a third electrode pad. The first portion overlaps the first chip group. The second portion protrudes in the second direction beyond the first chip group and the second chip group and is thicker than the first portion. The third electrode pad is provided on the second portion and bonded with the third metal wire.

Semiconductor device

A fixing device includes a fixing unit, a power supply unit, a pressure applying unit, and a controller. The fixing unit fixes toner onto a recording medium, using heat generated by a heat generator. The power supply unit supplies power to drive the fixing unit. The pressure applying unit applies pressure to the recording medium in a nip part between the pressure applying unit and the fixing unit. When plural recording media are sequentially transported, the controller controls the power supply unit to supply power during a first time period from when a trailing edge of one of the recording media passes the nip part to when a leading edge of the subsequent recording medium arrives at the nip part, in accordance with a relationship between the first time period and a second time period required to start the supply of power after the supply of power is stopped.

Fixing device, image forming apparatus, and non-transitory computer readable medium

A fixing device includes a fixing member including a heat generating layer that generates heat by induction, the fixing member fixing images onto plural recording media that are successively supplied thereto with heat generated from the heat generating layer; a pressure member that contacts the fixing member and forms a nip between the pressure member and the fixing member, the nip allowing the recording media to pass therethrough; an induction heating unit that inductively heats the heat generating layer of the fixing member; and a controller that controls a manner in which the induction heating unit heats the heat generating layer when the plural recording media successively pass through the nip in accordance with a total of times during which the recording media are not present in the nip, the total of times being measured from when the recording media started passing through the nip.

Fixing device and image forming apparatus

A fixing device includes a fixing unit, a power controller, a pressure applying unit, and a timing controller. The fixing unit fixes toner onto a recording medium transported in a determined transport direction, by using heat generated by a heat generator. The power controller controls supply of power for heating the fixing unit. The pressure applying unit applies pressure to the recording medium in a nip part formed between the pressure applying unit and the fixing unit. The timing controller controls the power controller to start supply of the power at a time which is a determined time period prior to an arrival time at which a leading edge of the recording medium in the transport direction arrives at the nip part.

A portable electronic apparatus capable of reliably determining whether a load detected by detecting units is caused by water pressure or by some other pressure and performing predetermined control according to the determination. A portable telephone apparatus is provided with operation detecting units and a control unit. The operation detecting units are detecting units for detecting pressure caused by a pressing operation. When a pressure is detected by at least one of the operation detecting units, the control unit performs first control (for example, control caused by detection of pressure other than water pressure). When even pressures are simultaneously detected by the operation detecting units, the control unit performs second control (for example, control caused by detection of water pressure) different from the first control.

Portable electronic apparatus

To provide a semiconductor device that can suppress deterioration in transistors and has a small layout area. In a nonvolatile semiconductor memory device according to the present invention, a control voltage (4 V) between a write voltage (10 V) and a reference voltage (0 V) is applied to a gate of a P-channel MOS transistor of a memory gate drive circuit corresponding to a selected memory gate line and also the reference voltage (0 V) is applied to a gate of an N-channel MOS transistor, and the write voltage is applied to the memory gate line. Since the transistors are turned on with a gate-source voltage lower than the conventional one, deterioration in the transistors can be suppressed.

Semiconductor device with transistor storing data by change in level of threshold voltage

An optical three-dimensional shaped item excelling in the smoothness of molding end face. There is provided a three-dimensional shaped item composed of, superimposed one upon another, multiple cured resin layers having a given configurational pattern formed by irradiating with actinic energy rays a molding face consisting of an actinic energy ray curable resin composition, wherein at least part of an uneven region of molding end face of the three-dimensional shaped item, the degree of unevenness thereof is reduced to smoothness by segregation of a component contained in the actinic energy ray curable resin composition and/or a substance derived from the component. Also, there is provided an actinic energy ray curable resin composition for the three-dimensional shaped item.

Process of making a three-dimensional object

It is intended to provide the following resin composition for stereolithography which is superior in storage stability and aging stability during operation, shows no increase in viscosity upon prolonged storage, has a high light-curing sensitivity and, therefore, makes it possible to produce, upon photo irradiation, an object by stereolithography, which is superior in dimensional accuracy, fabricating accuracy, water resistance, moisture resistance and mechanical properties at a high fabricating speed and a high productivity. A resin composition for stereolithography which is an actinic radiation-curable resin composition containing a cationic-polymerizable organic compound, a radical-polymerizable organic compound, a photo cationic polymerization initiator and a photo radical polymerization initiator, in which the photo cationic polymerization initiator contains a compound represented by the following formula (I) and having a purity of 80% or higher: wherein M represents an antimony atom or a phosphorus atom; and the broken line between Sand MFrepresents an ionic bond.

Actinic radiation-curable stereolithographic resin composition having improved stability

Growing community of inventors

Yokohama, Japan

Takashi Ito