Kaneka Corporation

Nissan Motor Company Limited

Takashi Ito

Shigeru Tanaka

Mutsuaki Murakami

Takashi Kikuchi

Masahiro Kojima

Satoshi Oku

Yasuyuki Tanaka

Yusuke Kato

Yoshio Shimoida

Norihisa Waki

Shiho Inoue

Akiko Waki

Kanji Shimoosako

Yuji Muroya

Masato Kusakabe

Shigeo Ibuka

Masaru Nishinaka

Ryutaro Mukai

Hiroyuki Ogino

Masami Yanagida

Gentaro Kano

Kazuki Miyatake

Keisuke Wakabayashi

Kohei Ogawa

Kanji Shimoohsako

Seiji Ishimoto

Tomohisa Matsuno

A current collector for a battery includes: a layer () formed from an electrically conductive material and at least one of (a) a polymer compound having an alicyclic structure, (b) a saturated hydrocarbon polymer compound having a hydroxyl group, (c) a phenoxy resin and an epoxy resin, and (d) an amine having an amine equivalent of 120 g/eq or less and an epoxy resin; a layer () which is formed on at least one surface of the layer (); and a layer () formed from an electrically conductive material. The current collector for a battery has stability to an equilibrium potential environment in a negative electrode, a low electric resistance, a blocking property to solvent in electrolytic solution, and a blocking property to a component in an electrolyte. In addition, the current collector for a battery has a high capacity retention rate, and battery durability is improved.

Current collector for battery and battery using same

A conductive film includes a layer 1 formed by a conductive material 1 that includes a polymer material 1 containing any of (1) an amine and an epoxy resin (where the epoxy resin and the amine are mixed in a ratio of 1.0 or more in terms of the ratio of the number of active hydrogen atoms in the amine with respect to the number of functional groups in the epoxy resin), (2) a phenoxy resin and an epoxy resin, (3) a saturated hydrocarbon polymer having a hydroxyl group, and (4) a curable resin and an elastomer and conductive particles 1. The conductive film has excellent stability in an equilibrium potential environment in a negative electrode and low electric resistance per unit area in the thickness direction. A multilayer conductive film including the conductive film achieves excellent interlayer adhesion, and using them as a current collector enables the production of a battery satisfying both weight reduction and durability.

Conductive film, current collector using same, battery and bipolar battery

A multilayer conductive film includes a layerincluding a conductive material containing a polymer materialhaving an alicyclic structure and conductive particlesand a layerincluding a material having durability against positive electrode potential. The multilayer conductive film has stability in an equilibrium potential environment in a negative electrode and stability in an equilibrium potential environment in a positive electrode, has low electric resistance per unit area in the thickness direction, and has excellent barrier properties for a solvent of an electrolytic solution. A battery including a current collector employing the multilayer conductive film can achieve both weight reduction and durability.

Multilayer conductive film, current collector using same, battery and bipolar battery

A collector for bipolar lithium ion secondary batteries comprises a first conductive layer that is obtained by adding a conductive filler to a base that contains an imide group-containing resin, and a second conductive layer that has a function of blocking lithium ions. The second conductive layer comprises a blocking resin layer that is obtained by adding a conductive filler to a base that contains a resin which contains no imide group, and a metal layer. This collector for bipolar lithium ion secondary batteries is used in such a manner that the first conductive layer is on the positive electrode active material layer side with respect to the second conductive layer.

Collector for bipolar lithium ion secondary batteries

A laminate of the present invention comprises a plating-target material including a layer-A, that is subjected to electroless copper plating and has a surface roughness such that an arithmetic mean roughness Ra measured at a cutoff value of 0.002 mm is less than 0.5 &#x3bc;m. The 90&#xb0; anti-peeling adhesive force of the layer-A is 1.0 N/25 mm or less. Furthermore, the layer-A includes a polyimide resin having a siloxane structure formed by polymerizing a diamine component having a structure represented by Formula (6) in a content of 5 to 95 mol % based on the entire diamine component. A sheet containing the layer-A has an elongation modulus of 1.8 GPa or less. The plating-target material of the present invention has a high adhesiveness to an electroless plating film formed on its surface, even if the surface is not so rough, and it is possible to favorably form electroless plating on the entire surface. Accordingly, the plating-target material and laminate of the present invention is suitably applicable to manufacturing of a printed-wiring board and the like.

Plating target material, polyamic solution and polyimide resin solution which are used to form the plating target material, and printed-wiring board using them

It is an object of the present invention to provide a component for plating suitably used in, for example, producing a printed circuit board, a solution, and a printed circuit board including the component, the component for plating having satisfactory adhesion to an electroless plating film provided on a surface of the component even when the surface roughness of the surface of the component is small. The object is achieved by a component for electroless plating including at least a surface a for electroless plating, the surface a having a surface roughness of 0.5 &#x3bc;m or less in terms of arithmetic average roughness measured with a cutoff value of 0.002 mm, and the surface a containing a polyimide resin having a siloxane structure.

Solution, component for plating, insulating sheet, laminate, and printed circuit board

It is an object of the present invention to provide a thermosetting resin composition having satisfactory adhesiveness, good processability, high heat resistance, and excellent dielectric characteristics in the GHz band; and a laminate and a circuit board including the thermosetting resin composition. The present invention provides a thermosetting resin composition including an imide oligomer component (A) containing at least one imide oligomer having a specific structure and an epoxy resin component (B) containing at least one epoxy resin. Furthermore, the present invention provides the thermosetting resin composition further including a polyimide resin component (C).

Thermosetting resin composition, laminated body using it, and circuit board

A thermosetting resin composition contains a polyimide resin component (A) containing at least one polyimide resin, an amine component (B) containing at least one amine, an epoxy resin component (C) containing at least one epoxy resin, and an imidazole component (D) containing at least one imidazole.

Thermosetting resin composition and use thereof

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Settsu, Japan

Takashi Ito