Murata Manufacturing Co., Ltd.

Micron Technology Incorporated

Mitsubishi Denki Kabushiki Kaisha

Other

Elpida Memory, Inc.

Dainippon Screen Mfg. Co., Ltd.

Ps4 Luxco S.a.r.l.

Kyowa Hakko Kirin Co., Limited

Takashi Ishihara

Kengo Onaka

Shoji Nagumo

Kazunari Kawahata

Jin Sato

Nobuhito Tsubaki

Takuya Murayama

Hideo Naomoto

Akihiro Takami

Yasuhiko Tanuma

Akira Miyata

Kunihiro Komaki

Hiroaki Morikawa

Hisayuki Nagamine

Satoshi Arimoto

Munehisa Watanabe

Tsuyoshi Mukai

Eiichi Tamaki

Yoshitatsu Kawama

Takatoshi Chiba

Takashi Ito

Shigekazu Ito

Yuji Kaminishi

Wataru Nobehara

Yuichi Kushihi

Yoshinori Matsuno

Masamitsu Nagahama

Yoichiro Nishimoto

Masayuki Kawasaki

Hajime Sasaki

Masumi Koishi

Minoru Yamagami

Kazuhiro Okaniwa

Shigeru Kido

Masahiko Abe

Masanori Kasai

Haruka Momota

Fumio Mizoguchi

Masao Aiga

Akira Nakazawa

Makoto Yuasa

Genshiro Nakamura

Syoji Nagumo

Yukio Shinoda

Hitoshi Takebayashi

Masahiko Yokosuka

Rizwangul Ibrahim

A position detecting system includes receivers and a control unit. The four receivers are attached at positions different from one another in the circumferential direction of a pillar extending in the vertical direction. Each of first areas, which expands in the circumferential direction of the pillar, is an area in which the corresponding three receivers among the receivers receive radio waves from a transmitter directly, and is an area in which the remaining one receiver does not receive radio waves from the transmitter directly. Each of second areas is an area in which the corresponding two receivers among the receivers receive radio waves from the transmitter directly, and is an area in which the remaining two receivers do not receive radio waves from the transmitter directly. The control unit calculates the position of the transmitter by using different position computational algorithms for the first areas and the second areas.

Position detecting system

Disclosed herein is an apparatus that includes a first power ESD protection circuit arranged in a first circuit area; a plurality of data I/O circuits arranged in a second circuit area adjacent to the first circuit area in a first direction; a plurality of data I/O terminals arranged in the second circuit area, each of the plurality of data I/O terminals being coupled to an associated one of the plurality of data I/O circuits; a plurality of first power terminals arranged in the second circuit area; and a first power line extending in the first direction, the first power line coupling the plurality of first power terminals to the first power ESD protection circuit.

ESD placement in semiconductor device

A semiconductor device may include a multi-level wiring structure comprising a first-level wiring layer, a second-level wiring layer and an insulating layer between the first-level wiring layer and the second-level wiring layer. The device may also include a bond pad, a first wiring extending from the bond pad, and a second wiring overlapping at least in part with the first wiring through the insulating layer to be capacitively coupled to the first wiring. The first wiring and the second wiring may each be formed respectively as the first-level wiring layer and the second-level wiring layer. The device may also include a protection circuit configured to be DC coupled to the second wiring. The first-level wiring layer may include a redistribution layer (RDL).

Apparatuses and methods for protecting transistor in a memory circuit

Layouts for pads and conductive lines of memory devices are disclosed. A memory device may include memory cells and conductive lines arranged above memory cells. The conductive lines may extend from substantially a first side of the memory device to substantially a second side of the memory device. Each of the conductive lines may be electrically coupled to a bond pad, a first probe pad and a second probe pad. The bond pad may be positioned at or near the first side and be configured to receive power. The first probe pad may be positioned at or near the first side and be configured to be electrically coupled to a probe. The second probe pad may be positioned at or near the second side. Associated systems and methods are also disclosed.

Layouts for pads and conductive lines of memory devices, and related devices, systems, and methods

The position of a transmission device is estimated with a sufficient accuracy. A position estimation system includes a transmission device that includes a plurality of transmitters arranged symmetrically with respect to a specific reference position, a plurality of receivers that receive radio waves transmitted from the plurality of transmitters, and an estimation tool that estimates the position of the transmission device, based on reception strengths of the radio waves received at the receivers.

Position estimation system

Apparatuses including circuit layout regions of a semiconductor device and methods of designing the circuit layout regions of a semiconductor device are described. An example apparatus includes a first layout region including a first transistor area including at least one first transistor, at least one contact in proximity to the first transistor area, and a first resistor area comprising at least one first resistor coupled to the at least one first transistor. The first transistor area and the at least one contact are aligned in a first direction, and the first transistor area and the first resistor area are aligned in a second direction. The second direction may be substantially perpendicular to the first direction. The at least one contact may be one of a substrate contact and a well contact.

Apparatuses and methods for semiconductor circuit layout

An apparatus includes: a first substrate comprising a first current channel that includes a first plurality of doped regions on the first substrate; a second substrate comprising a second current channel that includes a second plurality of doped regions in the second substrate, wherein: the doped regions of the second substrate are physically separate from those of the first substrate, and the second current channel is aligned colinearly with the first current channel; and a conductive structure extending across the first substrate and the second substrate and electrically connecting matching doped regions of the first current channel and the second current channel.

Apparatus with a current-gain layout

The present invention relates to a method for purifying a protein by separating the protein from impurities in a non-adsorption mode using an activated carbon. In particular, the present invention relates to a method for purifying an antibody using the activated carbon instead of protein A affinity chromatography.

Method of purifying protein

An antenna includes an antenna element in which a predetermined electrode is provided on a dielectric base member and a substrate in which a predetermined electrode is provided on a base. A feed-terminal connecting electrode to which a feed terminal provided on the lower surface of the antenna element, an external-terminal connecting electrode to which an external electrode is connected, and a ground-terminal connecting electrode to which a ground terminal provided on the lower surface of the antenna element are provided on the upper surface of an ungrounded area of the substrate. A chip inductor is connected between the external-terminal connecting electrode and the feed-terminal connecting electrode, and a chip inductor is connected between the external-terminal connecting electrode and the ground-terminal connecting electrode. The shortcut of a current route achieved by each of the chip inductors is provided.

Antenna and wireless communication device

A semiconductor device is disclosed, which includes first and second power supply pads supplied with first and second power voltages, respectively, a first protection circuit coupled between the first and second power supply pads, and an internal circuit including a first power line and a plurality of transistors electrically coupled to the first power line. The first power line includes first and second portions, and the first portion is electrically connected to the first power supply pad. The device further includes a second protection circuit coupled between the second portion of the first power line and the second power supply pad.

Semiconductor device

An antenna includes an antenna element in which feed and non-feed radiation electrodes are formed on a dielectric base; and a substrate having a non-ground area in which a ground electrode is not formed. The antenna element is provided in the non-ground area of the substrate. Each of the feed and non-feed radiation electrodes has a radiation electrode by which fundamental and harmonic waves resonate, a capacitance-loading terminal is formed at a position of the antenna element where an electric field distribution of the harmonic wave becomes a node, and a power supply terminal is formed at a feed end of the feed radiation electrode. A power supply terminal connection electrode connected to the power supply terminal and a capacitance-forming electrode for causing a capacitance to occur between the power supply terminal connection electrode and the capacitance-forming electrode portion are provided on the substrate.

Antenna and radio communication apparatus

A non-feeding element is provided with a proximity-providing gap from a feeding element, and a resonant state is generated there by capacitive coupling. The non-feeding element resonates at a frequency different from a resonant frequency of the feeding element. The feeding element and the non-feeding element have alongside-ground-terminal extending portions spaced from an edge surface at one end of a ground surface formed on the circuit board and to extend in a direction along the edge surface at the one end of the ground surface. The feeding element and/or the non-feeding element is formed three-dimensionally with a plurality of bending portions so that at least parts of the alongside-ground-terminal extending portion of the feeding element and the ground-terminal extending portion of the non-feeding element have substantially the same amount of spacing from the ground surface.

Antenna device and wireless communication apparatus including the same

Growing community of inventors

Machida, Japan

Takashi Ishihara