Mitsubishi Heavy Industries Limited

Mitsubishi Jukogyo Kabushiki Kaisha

Takashi Ishide

Takashi Akaba

Tadashi Nagashima

Yoshio Hashimoto

Saneyuki Goya

Toshiya Watanabe

Shuho Tsubota

Masao Watanabe

Kenji Nishikawa

Yasumi Nagura

Noriaki Sugimoto

Minoru Danno

Yukio Michishita

Yoshihito Fujita

Kohei Kawazoe

Masato Kinouchi

Makoto Yamasaki

Tsugumaru Yamashita

Isao Shirasu

Koji Okimura

Takahiro Ohta

Shoichi Hamada

Hironori Onitsuka

Ryu Suzuki

Tomoyoshi Baba

Michisuke Nayama

Kohei Kanaoka

Katsusuke Shimizu

Yasumi Nakura

Kazutaka Uda

Shoji Kushimoto

Kenji Muta

Takahiro Ota

Tatsuyuki Nishimiya

Kazuhiko Kamo

Hideshi Sakashita

Kenichi Kawanishi

Atsushi Takita

Shuhei Kuri

Osa Matsumoto

Masaru Tomeoka

Takuya Kitera

Syuhou Tsubota

Daijiro Fujie

Haruo Shirata

Kunio Terada

Shigeo Hashimoto

Seiichi Kawaguchi

Takuya Kidera

Michito Sakamoto

Masatoshi Sato

Sachiko Nakao

Shoichi Urushibata

Naruo Sakamoto

Masahiko Meka

Yoshiyuki Hemmi

Provided is a laser processing method in which a laser processing head for irradiating, with at least a short-pulse laser, a processed article having a protection layer laminated to a metal layer is used to process the processed article, whereby high-quality, highly accurate processing is possible by means of a short-pulse laser processing step for irradiating the protection layer with the short-pulse laser and ablating the protection layer, and a metal layer processing step for ablating the metal layer in the area that was ablated during the short-pulse laser processing step.

Laser processing method and laser processing apparatus

Provided are a processing device and a processing method with which the device can be made more compact, and with which highly precise processing can be performed. The processing device, which processes a member to be processed by irradiating the member to be processed with a laser, has: a laser oscillator having a plurality of vertical cavity surface-emitting laser diode chips that output laser light having a wavelength of 1,070 nm or less, and a substrate on the surface of which the plurality of vertical cavity surface-emitting laser diode chips are arranged in a matrix; a guidance optical system that guides the laser light output from the laser oscillator; and a control device that controls the output of the laser oscillator.

Processing device and processing method

A processing apparatus and a processing method which perform processing more accurately with a simple structure are provided. The processing apparatus includes an irradiation headand a control device. The irradiation headincludes a laser turning unitand a condensing optical system. The laser turning unitincludes a first prism, a second prism, a first rotating mechanism, and a second rotating mechanism. The control device adjusts the differences between rotation speeds and phase angles of the first prismand the second prismbased on a relation between at least a heat affected layer of a workpiece and a turning speed of laser.

Processing apparatus and processing method

Provided are a machining device and a machining method in which machining of higher precision can be performed with a simple configuration. The machining device has an irradiation head () and a controller; and the irradiation head () can be divided into a collimate optical system, a laser revolving unit (), and a light collection optical system (). The laser revolving unit () has a first prism (), a second prism (), a first rotation mechanism (), and a second rotation mechanism (). The controller controls the rotational speeds and the difference in phase angles of the first prism () and the second prism (), on the basis of at least the relationship between a heat affected layer of a member to be machined and the revolving speed of the laser.

Machining device and machining method

Provided is a photoelectric conversion device fabrication method in which current leakage from an intermediate contact layer via an intermediate-contact-layer separating groove is prevented as much as possible. Included are a step of film-forming a top layer having amorphous silicon as a main component; a step of film-forming, on the top layer, an intermediate contact layer electrically and optically connected thereto; a step of separating the intermediate contact layer by removing the intermediate contact layer by irradiating it with a pulsed laser, forming an intermediate-contact-layer separating groove that reaches the top layer; and a step of film-forming, on the intermediate contact layer and inside the intermediate-contact-layer separating groove, a bottom layer electrically and optically connected thereto and having microcrystalline silicon as a main component. A pulsed laser having a pulse width of 10 ps to 750 ps, inclusive, is used as the pulsed laser for separating the intermediate contact layer.

Photoelectric conversion device fabrication method and photoelectric conversion device

Provided is a method for manufacturing a photoelectric-conversion-device capable of controlling the groove depth of a processed groove to a desired value. The method for manufacturing a photoelectric conversion device () includes a groove forming step of irradiating an intermediate-contact-layer separating groove () constituting a photoelectric conversion device () with a picosecond laser and of moving the picosecond laser relative to the intermediate-contact-layer separating groove (), thereby forming a processed groove () in a predetermined scanning direction. In the groove forming step, interference fringes arranged in parallel in one direction are formed in an irradiated area corresponding to a beam diameter of the picosecond laser, and the picosecond laser is relatively moved such that the interference fringes are joined in the scanning direction.

Method for manufacturing photoelectric-conversion-device, device for photoelectric-conversion-device manufacturing device, and photoelectric conversion device

Aims are to provide a tubular-body residual-stress improving apparatus and an adjustment method thereof capable of adjusting irradiation position with favorable reproducibility, even when an optical fiber is eccentric. In the tubular-body residual-stress improving apparatus, an optical control unit () includes a rotational hold mechanism () for holding an optical fiber () in a manner that the optical fiber () is rotatable in a circumferential direction of the optical fiber (), and, if a position of an intensity peak of the laser beam from the optical fiber () in an axial direction of the tubular body () is offset from the center of an irradiation profile, a position at which the optical fiber () is held in the circumferential direction is adjusted by the rotational hold mechanism () so as to eliminate the offset or to minimize an influence of the offset.

Apparatus for improving residual stress in tubular body and adjustment method of the same

An object is to provide a method and an apparatus for improving a residual stress in a tubular body, which are enabled to improve the residual stress reliably by clearly defining controlling rage for treatment conditions without depending on an installation state and configuration of the tubular body. When an outer-circumferential surface of a welded portion of a cylindrical tubular body () is irradiated with a laser beam that circles around an outer circumference of the tubular body (), a heating width W in a circumferential direction heated by the laser-beam irradiation and a laser-beam moving speed V in the circumferential direction are set so that a stress in the circumferential direction in an inner surface of the tubular body () produced by the heating with the laser beam is at least larger than a yielding stress of a material that the tubular body () is made of.

Method for improving residual stress in tubular body and apparatus for improving residual stress in tubular body

A weld zone of T-piping and its neighborhood are efficiently laser-heated to remove residual stress. For this purpose, the weld zone of a T-piping () is irradiated and heated with a laser beam emitted from a laser head () to remove residual stress. At this time, a rotating travel cart () travels along a ring rail () to adjust the position of the laser head () in a &#x3b8;-direction, a vertical slide () slides to adjust the position of the laser head () in a Z-direction, a radial slide () slides to adjust the position of the laser head () in an L-direction, an arcuate piece slide () slides along an arcuate piece to adjust the &#x3b1;-direction of the laser head (), a laser head support portion () turns to adjust the &#x3b2;-direction of the laser head (), and oscillation adjusts the position of the laser head () in a &#x3b3;-direction.

Apparatus for improving residual stress of piping technical field

A residual stress improving apparatus for piping, which can heat an outer peripheral surface of piping to reduce (including eliminate) the residual stress of the piping is provided. The apparatus has a laser head portion, and circumferential direction moving mechanism composed of a ring rail and a rotational travel bogie. Further, the apparatus may adjust the reflection direction of laser light so that the laser light reflected by the outer peripheral surface of the piping does not return to the laser head, and adjust the delivery direction of the laser light so that the outer peripheral surface of the bending pipe portion located forwardly, in the pipe axis direction, of the laser head is irradiated with the laser light.

Residual stress improving apparatus for piping technical field

Control is exercised such that an arc discharge from a GMA electrode is performed after or simultaneously with start of oscillation of laser light from a laser oscillator, and oscillation of the laser light from the laser oscillator is stopped after or simultaneously with termination of the arc discharge from the GMA electrode. A coaxial laser beam machining head is configured such that the GMA electrode is disposed in a space portion between a first divisional laser beam and a second divisional laser beam, which have been formed by division by first and second reflecting mirrors, coaxially with the laser beams. Alternatively, the coaxial laser beam machining head is configured such that the GMA electrode is disposed in a space portion, which has been formed in a body of laser light by withdrawing part of the laser light outwardly with the use of first and second reflecting mirrors, coaxially with the body of the laser light.

Laser machining apparatus

A coaxial laser beam machining head, and a laser beam machining apparatus having it are provided. The head is small in size, free from the risk of damaging optical instruments, and inexpensive. The head comprises a collimating lens array, a first reflecting mirror for dividing laser light into a first divisional laser beam and a second divisional laser beam, a second reflecting mirror for further reflecting the first divisional laser beam to form a space portion between both divisional laser beams, a focusing lens array for focusing both divisional laser beams onto a portion to be welded, and a GMA electrode disposed in the space portion coaxially with the laser beams; or comprises a collimating lens array, a first reflecting mirror for reflecting part of laser light to form a space portion in a body of the laser light, a second reflecting mirror for further reflecting the part of the laser light, a focusing lens array for focusing the body of the laser light and the part of the laser light onto a portion to be welded, and a GMA electrode disposed in the space portion coaxially with the body of the laser light.

Laser beam machining head and laser beam machining apparatus having same

Welding system

A laser beam machining head includes a dividing optical system for dividing laser light into two separate laser beams, and providing spacing therebetween; a condensing optical system for condensing the separate laser beams into condensed laser light, and projecting it onto a cutting site of an object to be cut; and an inner assist gas nozzle placed between the separate laser beams, a width of an opening of a tip portion of the inner assist gas nozzle being nearly equal to a cutting width. Or the tip opening of the inner assist gas nozzle is slender; or its tip side is inclined, and the angle of inclination is variable; or the relative positions of the inner assist gas nozzle and a workpiece, or the relative positions of the focal position of the condensing optical system and the workpiece are variable independently; or an outer assist gas nozzle surrounding the separate laser beams is provided.

Laser beam machining head

In a laser beam machine head, when a filler wire and an optical axis of a laser beam are arranged coaxially, a convex roof mirror and a concave roof mirror are combined to divide the laser beam into two separate laser beams to that no laser beam is projected onto a filler wire feed pipe. Furthermore, the filler wire is fed from outside the laser beams to a condensing position via a filler wire guide in the spacing between the separate laser beams, or an electrode supported by a water flow pipe or an electrode holding pipe is brought close to the condensing position.

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Nagasaki, Japan

Takashi Ishide