Sumitomo Metal Mining Company, Ltd.

Kabushiki Kaisha Toshiba

Nissan Motor Company Limited

Fuji Electric Co., Ltd.

Sanken Electric Co., Ltd.

Takashi Iseki

Shuji Okada

Yukihiro Goda

Jun-ichi Kobayashi

Masato Takamori

Yuichi Nakamura

Yoshinori Murakami

Satoshi Tanimoto

Yusuke Zushi

Shinji Sato

Kohei Matsui

Tsutomu Shioyama

Tomoo Oofuji

Hiroaki Nagata

Jiro Taguchi

Jun-Ichi Kobayashi

The present invention addresses the problem, in methods for producing a metal or alloy by reducing a mixture that contains an oxide ore, of providing an oxide ore smelting method with good productivity and efficiency. The present invention is an oxide ore smelting method for producing a metal or alloy by reducing a mixture that contains an oxide ore, the method comprising at least: a mixing step Sfor mixing an oxide ore with a carbonaceous reducing agent; a mixture-molding step Sfor molding the mixture obtained to obtain a mixture-molded body; and a reducing step Sfor heating the mixture-molded body obtained at a specified reducing temperature in a reducing furnace.

Oxide ore smelting method

Provided is a smelting method for producing metal by reducing a mixture that includes an oxide ore such as nickel oxide ore, wherein it is possible to improve productivity by raising the metal recovery rate as well as to inexpensively and efficiently produce high-quality metal. The present invention is a smelting method in which: an oxide ore and a carbonaceous reducing agent are mixed; the resulting mixture is heated and subjected to a reduction treatment; and metal and slag, which are reduction products, are obtained, wherein the reduction treatment is carried out in a state in which one or more surface deposits selected from carbonaceous reducing agents, metal oxides, and oxidation inhibitors are deposited on the surface of the mixture.

Method for smelting oxide ore

A steam valveof an embodiment includes: a valve elementof a steam control valve, the valve elementbeing provided to be movable in an up and down direction; a valve elementof a main stop valve, the valve elementbeing provided under the valve elementcoaxially with the valve elementto be movable in the up and down direction; a valve seatwith which the valve elementand the valve elementcome into and out of contact; and a guide tubeslidably supporting a valve rodincluding the valve element, and having a flange portionat a bottom side in a casing. The steam valvefurther includes: the casinghousing the valve element, the valve element, the valve seat, and the guide tube; a drain discharge holeformed at a bottom side of the casing; a drain pipeprovided with a shutoff valveand communicating with the drain discharge hole; and a flow direction changing partwhich changes a direction in which steam having passed between the valve elementand the valve seatand flowing along the guide tubeflows toward the drain discharge hole

Steam valve

In a method for producing a metal or alloy by forming pellets from an oxide ore, a method for smelting an oxide ore, wherein a high-quality metal can be produced. Provided is a method for smelting an oxide ore to produce a metal or alloy by heating for reducing a mixture containing an oxide ore and a carbonaceous reducing agent, wherein the carbonaceous reducing agent is composed of particles (reducing agent particles), the number of reducing agent particles which are contained in the carbonaceous reducing agent and have a maximum particle length of 25 &#x3bc;m or less is 2% or more and 25% or less of the total number of reducing agent particles contained in the carbonaceous reducing agent, and the average maximum particle length of reducing agent particles having a maximum particle length greater than 25 &#x3bc;m is 30 &#x3bc;m or more and 80 &#x3bc;m or less.

Disclosed herein is a high-temperature lead-free Au&#x2014;Sn&#x2014;Ag-based solder alloy that is excellent in sealability, joint reliability, and wet-spreadability, that can be kept at a high quality level for a long period of time, and that is provided at a relatively low cost. The lead-free Au&#x2014;Sn&#x2014;Ag-based solder alloy contains 27.5 mass % or more but less than 33.0 mass % of Sn, 8.0 mass % or more but 14.5 mass % or less of Ag, and a balance being Au except for elements inevitably contained therein during production. When having a plate- or sheet-like shape, the Au&#x2014;Sn&#x2014;Ag-based solder alloy has a surface whose L*, a*, and b* in an L*a*b* color system in accordance with JIS Z8781-4 are 41.1 or more but 57.1 or less, &#x2212;1.48 or more but 0.52 or less, and &#x2212;4.8 or more but 9.2 or less, respectively. When having a ball-like shape, the Au&#x2014;Sn&#x2014;Ag-based solder alloy has a surface whose L*, a*, and b* are 63.9 or more but 75.9 or less, 0.05 or more but 0.65 or less, and 1.3 or more but 11.3 or less, respectively.

Au&#x2014;Sn&#x2014;Ag-based solder alloy, electronic device sealed or joined using the same, and electronic apparatus equipped with the electronic device

There is provided a high-temperature Pb-free solder paste having the strength required to join electronic parts to a substrate and having excellence in wettability and workability. The solder paste formed by mixing a solder alloy and a flux, the solder alloy consisting of, based on the total mass of the solder alloy as 100 mass %: 0.4 to 13.5 mass % of Zn, at least one of 0.01 to 2.0 mass % of Cu or 0.03 to 0.7 mass % of Al, and a balance being Bi except for inevitable impurities.

Pb-free solder paste

A Pb-free solder alloy whose residual stress during solidification is small and which achieves high joint strength and high reliability, can suppress a reaction between Ni and Bi or diffusion of Ni when used to join Ni-containing electronic parts or substrates, and can withstand a high reflow temperature. A first aspect of a Pb-free solder alloy consists of 0.03% by mass or more but 0.70% by mass or less of Al, 0.2% by mass or more but 14.0% by mass or less of Zn, and the balance being Bi except for inevitable impurities. A second aspect of a Pb-free solder alloy consists of 0.03% by mass or ore but 0.70% by mass or less of Al, 0.2% by mass or more but 14.0% by mass or less of Zn, not more than 0.500% by mass of P, and the balance being Bi except for inevitable impurities.

Bi&#x2014;Al&#x2014;Zn&#x2014;based Pb-free solder alloy

Disclosed herein is a high-temperature Pb-free solder alloy having the strength required to join electronic parts to a substrate and having excellence in wettability and workability. The high-temperature Pb-free solder alloy contains 0.4% by mass or more but 13.5% by mass or less of Zn, 0.05% by mass or more but 2.0% by mass or less of Cu, 0.500% by mass or less of P, and a balance being Bi except for inevitable impurities. The Pb-free solder alloy may further contain 0.03% by mass or more but 0.7% by mass or less of Al.

Pb-free solder alloy

A method for manufacturing a semiconductor device is carried out by readying each of a semiconductor element, a substrate having Cu as a principal element at least on a surface, and a ZnAl solder chip having a smaller shape than that of the semiconductor element; disposing the semiconductor element and the substrate so that respective bonding surfaces face each other, and sandwiching the ZnAl eutectic solder chip between the substrate and the semiconductor element; increasing the temperature of the ZnAl solder chip sandwiched between the substrate and the semiconductor element while applying a load to the ZnAl solder chip such that the ZnAl solder chip melts to form a ZnAl solder layer; and reducing the temperature of the ZnAl solder layer while applying a load to the ZnAl solder layer.

Method for manufacturing semiconductor device, and semiconductor device

There is provided a high-temperature Zn-based Pb free solder alloy having a melting point of approximately 300 to 400&#xb0; C. and is excellent in wettability, joinability, workability and reliability. The Pb-free solder alloy mainly containing Zn consists of: 1.0 to 9.0 mass %, preferably 3.0 to 7.0 mass % of Al, 0.002 to 0.800 mass %, preferably 0.005 to 0.500 mass % of P, and a balance being Zn except for inevitable impurities incorporated during a manufacturing stage. The Pb-free solder alloy may include at least one of 0.3 to 4.0 mass % of Mg or 0.3 to 3.0 mass % of Ge.

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Tokyo, Japan

Takashi Iseki