Kabushiki Kaisha Toshiba

Takashi Inukai

Yukihiro Urakawa

Each of a plurality of inverters includes: a first transistor having one end connected to a first terminal; and a second transistor having one end connected to a second terminal and the other end connected to the other end of the first transistor. The first transistors included in the inverters located at either odd-number orders or even-number orders counted from an input terminal side of an inverter chain circuit become conductive when a pre-charge signal has a first state to pre-charge the other end of the first transistors, and become non-conductive when the pre-charge signal has a second state.

Semiconductor integrated circuit with a chain of inverters

Provided is a semiconductor integrated circuit that includes a monitoring circuit for monitoring characteristics of a semiconductor chip. The semiconductor integrated circuit comprises a first terminal with a first voltage and a second terminal with a second voltage. The semiconductor integrated circuit also comprises an inverter chain circuit comprising a plurality of inverters connected in cascade. Each of the plurality of inverters includes a first transistor and a second transistor. The first transistors included in the inverters located at either odd-number orders or even-number orders counted from an input terminal side of an inverter chain circuit function as pre-charge transistors. The pre-charge transistors have a conductivity type different from a conductivity type of the first transistors other then the pre-charge transistors.

Semiconductor integrated circuit for monitoring characteristics of a semiconductor chip

A semiconductor integrated circuit according to the examples of the present invention is applied to a system using a first power source voltage and a second power source voltage independent of the first power source voltage and includes a first area to which the first power source voltage is supplied, a thermal sensor placed in the first area, and a first input path placed in the first area, for transferring trimming data that determine the control contents of the thermal sensor to the thermal sensor.

Semiconductor integrated circuit

A thermal management system according to an embodiment of the present invention includes first and second thermo sensors embedded in a chip, a trimming control circuit which determines a characteristic of the first thermo sensor based on a trimming value, a nonvolatile memory which stores trimming data relating the characteristic of the first thermo sensor in an initial state and a system controller which provides temperature data to the trimming control circuit, wherein the temperature data relates a chip temperature detected by the second thermo sensor, wherein the trimming control circuit updates the trimming value based on the temperature data and the trimming data.

Thermal management system

A semiconductor device has a semiconductor element connected to an input/output terminal and a reference voltage terminal, a first rectifier element connected between the input/output terminal and the reference voltage terminal, which performs rectifier operation to prevent a voltage of the input/output terminal from becoming higher than a voltage of the reference voltage terminal by a predetermined value or more, and a second rectifier element connected between the input/output terminal and the reference voltage terminal, which performs rectifier operation to prevent the voltage of the reference voltage terminal from becoming higher than the voltage of the input/output terminal by a predetermined value or more.

Semiconductor device

A semiconductor integrated circuit is applied to a system using a first power source voltage and a second power source voltage independent of the first power source voltage and that includes a first area to which the first power source voltage is supplied, a thermal sensor placed in the first area, and a first input path placed in the first area, for transferring trimming data that determine the control contents of the thermal sensor to the thermal sensor.

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Kawasaki, Japan

Takashi Inukai