Nec Corporation

Renesas Electronics Corporation

Canon Kabushiki Kaisha

The Furukawa Electric Co., Ltd.

Tachi-s Co., Ltd.

Oki Data Corporation

Honda Motor Co., Ltd.

Mitsubishi Electric Corporation

Lam Research Corporation

Subaru Corporation

Other

Hitachi, Ltd.

Ricoh Company, Ltd.

Olympus Optical Company, Ltd.

Yokogawa Electric Corporation

Takashi Inoue

Yasuhiro Okamoto

Tatsuo Nakayama

Hironobu Miyamoto

Yuji Ando

Kazuki Ota

Shuichi Murakami

Yasuhiro Murase

Masaaki Kuzuhara

Akio Wakejima

Mineo Kaneko

Michinari Mizutani

Masayoshi Tachihara

Yuichiro Akama

Yoshinao Miura

Naotaka Kuroda

Katsumi Yamanoguchi

Yasuyuki Tamura

Kazutaka Nara

Toshiyuki Takewaki

Shu Namiki

Kazuomi Endo

Hiroshi Kawaguchi

Takayuki Nagai

Ching-Hwa Chen

Kensuke Kasahara

Hidenori Shimawaki

Koji Funaoka

Keita Myochin

Kohji Matsunaga

Takayuki Ohmori

Nobuhiro Nagura

Masayuki Saiki

Akinori Taniguchi

Koji Hataya

Mitsuo Watanabe

Atsushi Ishii

Hiroshi Kawashima

Gerald Z Yin

Hideo Kobayashi

Tamaki Sato

Koji Saito

Yasutomo Watanabe

Toshio Mizuno

Hisato Oku

Hiroyasu Ishikawa

Jogen Yamaki

Shunichi Matsushita

Shigehiro Takasaka

Kazuyoshi Arata

Kazunori Sugiyama

David R Pirkle

Jun Koshoubu

Akira Sato

Tatsuo Watanabe

Koji Igarashi

Naoyuki Makita

Masami Horigome

Noritaka Matsubara

Kazuo Mikami

Yoshiyuki Touge

Jiro Hiroishi

Akira Hikone

Shigeru Ito

Takahiko Nagasawa

Takuro Muratani

Yoshio Karasawa

Yasuharu Hidaka

Yoshinori Kukino

Shinichi Yataka

Yoshiaki Utsubo

Toshiyuki Nagoshi

Takuya Hori

Kensuke Ikeda

Izumi Sato

Atsushi Yanagisawa

Shinya Kurasawa

Ken Miura

Takashi Oizumi

Yasuhiko Ito

Shunji Miyahara

Gunkichi Satoh

Mituo Miura

Saori Aoyama

Hideaki Tobioka

Hayami Tabira

Junichi Tanaka

Shigeyuki Yamano

Toshinari Kimura

Fumio Asano

Takumi Fujii

Masato Miyaguchi

Shinichiro Masaki

Masahiko Tanaka

Ken-ichi Kitayama

Mohammad Abdul Jalil

Yasuo Hirota

Kenji Nishiguchi

Riko Tsukamoto

Kazuo Kani

An integrated unit, includes a drive device, and a control device which is fixed to the drive device and is configured to control the drive device. The control device includes a guide pin protruding toward the drive device. The drive device includes a guide hole through which the guide pin is inserted. The control device is fixed to the drive device with the guide pin inserted through the guide hole. The drive device includes a protective wall which covers at least a part of the guide pin with the control device fixed to the drive device.

Integrated unit

Provided is a work planning system including a processor and a storage unit connected to the processor. The storage unit stores a plurality of shipping orders, work network information pertaining to a process for work necessary for shipping, and resource information pertaining to a plurality of resources that can be used for work. The processor classifies work corresponding to the plurality of shipping orders into a plurality of tasks on the basis of a prescribed condition and the work network information, generates a process plan including allocation of the resources to the process for each of the tasks on the basis of the resource information, and outputs the generated process plan.

Work planning system and work planning method

A vehicle includes a first power system, a second power system, a switching relay, and a relay controller. The first power system is coupled to an engine restart motor. The second power system is provided independently of the first power system and is coupled to a starter and an accessory. The coupling state of the switching relay is switchable to an on state in which the first power system and the second power system are coupled, and to an off state in which the first power system and the second power system are not coupled. The relay controller is configured to receive a supply of electric power from both the first power system and the second power system and to control the coupling state of the switching relay.

Vehicle with electric power supply control

A laser processing method for laser processing of a workpiece made of a base material and a fiber reinforced composite material containing fibers having a thermal conductivity and a processing threshold higher than physical properties of glass fibers. The laser processing method includes a step of processing the workpiece by forming a plurality of through-holes extending through the workpiece by irradiating the workpiece with pulsed laser light from a processing head while relatively moving the workpiece and the processing head in a predetermined cutting direction. The pulsed laser light has a pulse width smaller than 1 ms and an energy density capable of forming each of the through-holes by a single pulse.

Laser processing method and laser processing apparatus

A non-transitory computer readable medium (CRM) storing computer readable program code for monitoring a state of a chromatography apparatus embodied therein that: receives one or more monitoring conditions that each include a determination condition for parameters related to measurements taken using the chromatography apparatus; and displays, in parallel and using a combination operational expression: a first conditional expression based on at least one of the monitoring conditions that make up a first combined conditional expression, wherein the first combined conditional expression is based on a first combined monitoring condition that combines all of the received monitoring conditions, and a second conditional expression based on at least one of the monitoring conditions associated with the first conditional expression.

Monitoring method, monitoring device, and monitoring system for monitoring a state of a chromatography apparatus

In a power source system, a high-voltage battery and a low voltage battery are configured to store electric powers to be supplied to a traveling motor and an accessory, respectively. A step-up unit is interposed between the low-voltage battery and the traveling motor, and is configured to step up a voltage of the low-voltage battery and apply the stepped-up voltage to the traveling motor. A controller is configured to perform switching to a normal-time electric power supply circuit, in which the high-voltage battery and the traveling motor are coupled to each other, when the high-voltage battery is in a normal state and perform switching to an abnormal-time electric power supply circuit, in which the low-voltage battery and the traveling motor are coupled to each other via the step-up unit, when the high-voltage battery is in an abnormal state.

Power source system for electric-powered vehicle

A seat includes an airbag module fixed to a seat frame, a trim cover including a breaking part which breaks according to an inflation and a deployment of an airbag of the airbag module, a first stay cloth and a second stay cloth which guide the inflating and deploying airbag to the breaking part, a first fixing member which is attached to the backside frame and stretches and supports the first stay cloth, and a second fixing member which stretches and supports the second stay cloth, in which the backside frame is provided with a pair of first attachment holes into which both end portions of the first fixing member are inserted and a pair of second attachment holes into which both end portions of the second fixing member are inserted.

Vehicle seat

Provided are a method of manufacturing an engine, an engine, and a connected cylinder. The method of manufacturing an engine includes at least a fitting step of fitting a connected cylinder to a hollow portion of a cylinder block main body. The connected cylinder is (1) a first connected cylinder including two or more cylinder liners and a connecting portion configured to connect the two or more cylinder liners to each other or (2) a second connected cylinder including a connected cylinder main body portion having two or more cylinder bores and a coating configured to cover an inner peripheral surface of the connected cylinder main body portion in which the cylinder bores are formed. The cylinder block main body has one end side, another end side, and the hollow portion passing through the cylinder block main body from the one end side to the another end side.

Method of manufacturing internal combustion engine, internal combustion engine, and connected cylinder

A seat back board includes: a flexible plate member which is made of a resin material and has the Shore hardness higher than 50, the plate member including: a back-surface covering part which covers a back surface of a seat back; and a bottom-surface covering part which covers a bottom surface of a seat cushion; a sewing part, which is sewn with a cover member covering a front surface and side surfaces of the seat back or is sewn with a coupling member to be coupled with the cover member in a detachable manner, being provided in an edge portion of the back-surface covering part; and a locking part, to be locked in the seat cushion, being provided in the bottom-surface covering part.

Seat back board, trim cover and vehicle seat

A vehicle seat includes: a seat cushion; a lower frame which supports the seat cushion to be lifted and lowered and to be advanced and retreated along a floor in conjunction with the lifting and lowering, a finisher which covers a lower side frame; and a flexible cover which is hung from the side portion of the seat cushion such that a lower edge part is engaged in the finisher, and is expanded and folded in accordance with the lifting and lowering of the seat cushion, wherein: the finisher includes a guiding part which guides the lower edge part of the cover to be movable in an advancing and retreating direction of the seat cushion; and the lower edge part of the cover includes a guided part which is engaged with the guiding part to be movable in the advancing and retreating direction of the seat cushion.

A semiconductor device includes a first nitride semiconductor layer formed over a substrate, a second nitride semiconductor layer formed over the first nitride semiconductor layer and having a band gap wider than a band gap of the first nitride semiconductor layer, a trench penetrating through the second nitride semiconductor layer and reaching an inside of the first nitride semiconductor layer, a gate electrode placed in the trench over a gate insulating film, and a first electrode and a second electrode formed over the second nitride semiconductor layer on both sides of the gate electrode, respectively.

Semiconductor device and method of manufacturing semiconductor device

An optical waveguide circuit includes a polarization beam splitter connecting to a first input optical waveguide; an optical interference element receiving one of orthogonally polarization-split lights of a first light from the polarization beam splitter, and one of orthogonally-polarized lights from a second light input to a second input optical waveguide, the optical interference element causing interference therebetween; a first connection optical waveguide connecting the polarization beam splitter and the optical interference element; and a second connection optical waveguide connecting the second input optical waveguide and the optical interference element. The first and the second input optical waveguides have a straight-line shape or an S-shape including a first bending portion and a second bending portion to cancel the polarization-rotation of light taking place in the first bending portion. The polarization beam splitter, the first and the second connection optical waveguides, and the optical interference element are arranged in an S-shape.

Optical waveguide circuit having identical polarization-cancelling S-shaped curves

A semiconductor device includes a first nitride semiconductor layer formed over a substrate, a second nitride semiconductor layer formed over the first nitride semiconductor layer, a third nitride semiconductor layer formed over the second nitride semiconductor layer, a fourth nitride semiconductor layer formed over the third nitride semiconductor layer, a trench that penetrates the fourth nitride semiconductor layer and reaches as far as the third nitride semiconductor layer, a gate electrode disposed by way of a gate insulation film in the trench, a first electrode and a second electrode formed respectively over the fourth nitride semiconductor layer on both sides of the gate electrode, and a coupling portion for coupling the first electrode and the first nitride semiconductor layer.

Semiconductor device

A method of manufacturing a semiconductor device includes forming a first nitride semiconductor layer, forming thereover a second nitride semiconductor layer having a band gap wider than that of the first nitride semiconductor layer, and thereby forming a stacked body, etching the stacked body with a first film placed over the stacked body and including a first opening portion as a mask to form a trench penetrating through the second nitride semiconductor layer and reaching an inside of the first nitride semiconductor layer, causing an end portion of the first film to retreat from an end portion of the trench, forming a second film over the first film including the inside of the trench, and forming a gate electrode over the second film.

Method of manufacturing semiconductor device with a multi-layered gate dielectric

Growing community of inventors

Tokyo, Japan

Takashi Inoue