Panasonic Intellectual Property Management Co., Ltd.

Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Takashi Imanaka

Daisuke Suetsugu

Kenichi Yamamoto

Takaaki Higashida

Hiroyuki Aizawa

Katsuya Morinaka

Hirotaka Hisamura

Hiroyuki Nakamura

Soichiro Hiraoka

Satoshi Ohuchi

Daido Komyoji

Hideo Ohkoshi

Shigehiro Yoshiuchi

Yuichi Miyoshi

Takami Ishida

Munekazu Nishihara

Toshinari Nitta

Shoichi Taji

Miyuki Nagaoka

Jun Katsube

Shinsuke Itoi

Hisayoshi Watanabe

Atsuhiro Fujii

Osamu Sengoku

Toru Uchida

Daisuke Nakamura

Hiroki Umehara

A sensor includes a sensor substrate, and an upper lid substrate joined to an upper surface of the sensor substrate. The sensor substrate includes a fixed part, a deformable beam connected to the fixed part, and a weight connected to the beam. The weight is movable relative to the fixed part. The upper lid substrate includes a first part containing silicon and a second part joined to the first part and containing glass. The first part includes a projection protruding toward the sensor substrate relative to the second part. The sensor has high accuracy or high reliability.

Sensor

An acceleration sensor includes a detection device, an opposed electrode, and a top lid. The detection device includes an active layer, a base layer, an oxide layer disposed between the active layer and the base layer, a first insulating layer, a contact portion, and a self-check electrode. The first insulating layer is disposed on the active layer at a side opposite to the oxide layer and provided with a first opening. The contact portion is disposed on a part of the first insulating layer at a side opposite to the active layer and includes a first metal layer connected to the active layer through the first opening. The opposed electrode is disposed at a location opposing the self-check electrode, and the top lid supports the opposed electrode.

Acceleration sensor

A sensor includes a circuit board, a wiring connection layer, a sensor element, and a conductive post. The circuit board has a first electrode. The wiring connection layer has second and third electrodes. The second electrode is connected to the first electrode. The sensor element has a fourth electrode. The conductive post connects the third electrode electrically with the fourth electrode. This sensor can be driven efficiently.

An angular velocity sensor includes a support body, a retaining portion connected to the support body, first to fourth weights, first to fourth arms, a drive unit for driving the first to fourth arms, and a monitor unit for detecting displacements of the first to fourth arms. An X-axis, a Y-axis, and a Z-axis that are perpendicular to each other are defined. The detector unit is symmetrical with respect to both an axis parallel to the X-axis and an axis parallel to the Y-axis. This angular velocity sensor can cancel an undesired signal caused by external disturbances, such as acceleration or impact, thus detecting an angular velocity accurately.

Angular velocity sensor

First sheet-like substrate is arranged at a region surrounded by first terminals of male connector and first circuit substrate, and second sheet-like substrate is arranged at a region surrounded by second terminals of female connector and second circuit substrate, and male connector and female connector are fitted together so that a first passive element of first sheet-like substrate and a second passive element of second sheet-like substrate configure a filter circuit.

Electronic circuit connection structure and its manufacturing method

A connecting structure includes a circuit board with a first connection land having a plurality of conductor patterns on the surface thereof, a second connection land disposed in a position opposite to the first connection land of the circuit board, and a flexible board including an insulating layer formed so as to surround at least a part of outer periphery of the second connection land. The first connection land and the second connection land are bonded to each other with a bonding member, and the insulating layer is thicker than the total thickness of the second connection land and the first connection land. It is possible to obtain an electronic circuit connecting structure which is free from short-circuit due to running of the bonding member such as solder even with the connecting land greatly reduced in size, and its connecting method.

Electronic circuit connecting structure, and its connecting method

A capacitor ( ) using a flexible substrate ( ) includes a hole portion ( ) formed in a dielectric ( ) to connect an upper electrode ( ) to an external leader electrode ( ). At least part of the hole portion ( ) extends from its lower end to upper end at an inclination between 0.1 and 20&deg; with respect to a top surface of the external leader electrode ( ). Then, an upper end corner of an inclined wall surface of the upper electrode ( ), which inclines along the hole portion ( ) of the dielectric ( ), has a downward inclination between 0.1 and 20&deg;. A lower end corner of the inclined wall surface of the upper electrode ( ), which inclines along the hole portion of the dielectric ( ), has an upward inclination between 0.1 and 20&deg;. As a result, stress concentration on the corners of the upper electrode ( ) is drastically reduced to prevent the upper electrode ( ) from cracking.

Capacitor and manufacturing method thereof

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Osaka, Japan

Takashi Imanaka