Mitsubishi Electric Corporation

Takashi Ijima

Koji Yamazaki

Provided is a metal jointed body, joined by solid-phase joining in the atmosphere, in which no protrusion of molten joining material occurs, that improves dimensional stability. A metal jointed body is formed by (A) making Ag films of two metal laminated bodies opposed to each other, the metal jointed body being configured by sequentially laminating a Zn film and an Ag film on an Al substrate serving as a member to be joined, and (B) bringing the Ag films into contact with each other, then (C) heating is performed while pressurizing, and closely adhering and solid-phase joining the Ag films to each other. The completed metal jointed body is a portion where Al—Ag alloy layers are provided on both sides of an Ag—Zn—Al alloy layer to join the Al substrates to each other.

Metal jointed body, semiconductor device, wave guide tube, and method for joining members to be joined

Provided is a metal joint () including: a Ag—Cu—Zn layer (); and Cu—Zn layers () joined to both surfaces of the Ag—Cu—Zn layer (), wherein the Ag—Cu—Zn layer () has a composition in which a Cu component is 1 atm % or more and 10 atm % or less, a Zn component is 1 atm % or more and 40 atm % or less, and the balance is a Ag component with respect to the total 100 atm %, and wherein the Cu—Zn layers () have a composition in which a Zn component is 10 atm % or more and 40 atm % or less and the balance is a Cu component with respect to the total 100 atm %. It is therefore possible to obtain the metal joint (), which is capable of joining metal base materials to each other without being limited to aluminum-based materials, and also have high mechanical strength.

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Tokyo, Japan

Takashi Ijima