Citizen Electronics Co., Ltd.

Citizen Watch Company, Ltd.

Citizen Holdings Company, Ltd.

Takashi Iino

Nodoka Oyamada

Kazuki Matsumura

Sadato Imai

Koki Hirasawa

Light emitting diode

An LED lighting device capable of discharging heat generated from a light emitting element to the outside the LED lighting device. An LED lighting device includes: a plurality of light emitting elements; a mounted substrate on which the light emitting elements are mounted; and an electrode portion configured to supply a current to the light emitting elements from outside the LED lighting device. On the mounted substrate, a wiring substrate is located. On the upper surface of the mounted substrate, the mounted substrate includes: a light emitting region in which the plurality of light emitting elements are mounted; an exposed region which is located on the outer side of the light emitting region and through which the upper surface of the mounted substrate is exposed; and a wiring region which is located on the outer side of the light emitting region and in which the wiring substrate is located.

Mounting and wiring substrates for lighting device and method for manufacturing mounting and wiring substrates for lighting device

A semiconductor device directly joins electrodes of a semiconductor element to electrodes of a metal substrate and has good yield, connection reliability, good mass productivity, and superior heat dissipation efficiency. A method for producing the semiconductor device that directly joins the electrodes of the metal substrate to the electrodes of the semiconductor element includes forming an electrode separating groove in an element mounting position on a main surface of the metal substrate at a predetermined depth. The semiconductor element is mounted to extend over the electrode separating groove. The metal substrate is ground from a surface reverse to the main surface of the metal substrate up to a position reaching the electrode separating groove.

Semiconductor device and method for producing the same

In a first aspect of the present inventive subject matter, a lighting device includes a light-emitting element that includes a first electrode and a second electrode on a lower surface of the light-emitting element; a phosphor layer directly covering a peripheral side surface of the light-emitting element; and a light-reflecting layer that is in contact with an upper surface of the light-emitting element and in contact with an upper surface of the phosphor layer directly covering the peripheral side surface of the light-emitting element.

Lighting device with a phosphor layer on a peripheral side surface of a light-emitting element and a reflecting layer on an upper surface of the light-emitting element and on an upper surface of the phosphor layer

Light-emitting diode

Provided is an LED package which is unlikely to cause the attenuation of emitted light from an LED element by bonding wires for electrical connection of the LED element. The LED package includes a board including a pair of connection electrodes formed thereon, an LED element mounted on the board, a bonding wire electrically connecting the LED element to the pair of connection electrodes, and a covering layer containing a phosphor and covering the bonding wire, wherein the phosphor is excited by emitted light from the LED element to emit light having an absorbance in the bonding wire lower than that of the emitted light and a wavelength longer than that of the emitted light.

LED package with covered bonding wire

Provided is a compact and high-luminance semiconductor light-emitting device which has excellent color rendering characteristics and which enables arbitrary selection of emission color depending on the use of the device. The semiconductor light-emitting device includes a light-emitting element assembly configured by a plurality of fluorescent semiconductor light-emitting elements each of which has external connection electrodes respectively connected to an n-type semiconductor layer and a p-type semiconductor layer, wherein at least an outer surface other than the external connection electrodes of each of the fluorescent semiconductor light-emitting elements is coated with a resin containing a fluorescent material. The light-emitting element assembly is configured such that the external connection electrodes of the fluorescent semiconductor light-emitting elements are directly connected in series using solder.

Semiconductor light-emitting device

A light-emitting element according to an embodiment of the present invention includes a body including an upper surface, a lower surface opposite to the upper surface, and a peripheral side surface extending between peripheral edges of the upper surface and peripheral edges of the lower surface, the peripheral side surface including a front surface and a rear surface opposite to the front surface; a pair of element electrodes as a first element electrode and a second element electrode positioned at the rear surface of the body; and a support disposed at the rear surface of the body between the first element electrode and the second element electrode that are positioned at a lower area of the rear surface of the body.

Growing community of inventors

Yamanashi-ken, Japan

Takashi Iino