Fujitsu Corporation

Other

Takashi Hozumi

Toshimi Kawahara

Norio Fukasawa

Yoshiyuki Yoneda

Yasuhiro Shinma

Shinya Nakaseko

Masanori Onodera

Hirohisa Matsuki

Kenichi Nagashige

Yuzo Hamanaka

Mamoru Suwa

Syuichi Monma

Ryuji Nomoto

Yukio Takigawa

Masamitsu Ikumo

Mitsunada Osawa

Masaaki Seki

Hiroyuki Ishiguro

Shigeaki Yagi

Toshimi Kawashara

A semiconductor device includes a semiconductor chip, a resin package for sealing said semiconductor chip, metal layers provided on a mounting-side surface of said resin package in an exposed manner and connecting members for electrically connecting electrode pads provided on the semiconductor chip and the metal layers. The metal layers are provided with stud bumps on the mounting side, the stud bumps serving as external connection terminals.

Semiconductor device including stud bumps as external connection terminals

A wafer level semiconductor device including a wafer having a plurality of semiconductor elements formed on an upper surface thereof, a sealing resin including a first part for sealing the upper surface of the wafer and a second part for sealing a side surface of wafer, the second part having a lower edge surface flush with a lower surface of the wafer, and a film for covering the lower surface of wafer and the lower edge surface of the second part of the sealing resin and conducting the process using the wafer level semiconductor device in which the film is bonded. This structure prevents warping of the wafer level semiconductor device after the sealing resin is formed on the device and it is then taken out from the mold dies.

Wafer level semiconductor device and method of manufacturing the same

A method of producing semiconductor devices which have an excellent separability from a metal mold after resin encapsulation and thus eliminates the need to clean the metal mold. A metal mold for producing such semiconductor devices is also provided. According to the method of the present invention, the metal mold is first opened, and two separation sheets are disposed on dividing surfaces including cavity forming surfaces of a first metal mold and a second metal mold. A substrate is then placed on one of the separation sheets, with its semiconductor chip formed surface facing the second metal mold. An encapsulation resin is provided on the substrate placed on one of the separation sheets. The metal mold in a heated state is closed and pressed to form a resin layer for encapsulating electrodes formed on the substrate. The metal mold is again opened, and the resin-encapsulated substrate is taken out of the metal mold. After the separation sheets are removed, the substrate is divided into individual semiconductor devices.

Method of producing semiconductor devices having easy separability from a metal mold after molding

A semiconductor device is provided, which device includes a semiconductor chip including external terminals formed on a surface thereof and a sealing resin formed on the surface of the semiconductor chip. A contaminant film formed on the surface of said semiconductor chip has a laser-processed edge so that a peripheral portion of the surface of said semiconductor chip is bonded to the sealing resin.

Semiconductor device having increased reliability and method of producing the same and semiconductor chip suitable for such a semiconductor device and method of producing the same

In a semiconductor device of the present invention and a production method thereof, an electronic circuit is provided in a semiconductor substrate, the electronic circuit having terminals. An internal wiring pattern is provided in the substrate, the internal wiring pattern being connected to the electronic circuit terminals. A protective layer is provided on the substrate, the protective layer covering the substrate. Vias are provided on the substrate so as to project from the protective layer, the vias being connected to the internal wiring pattern at arbitrary positions on the substrate. An external wiring pattern is provided on the protective layer, the external wiring pattern being connected to the vias. Projection electrodes are connected to the external wiring pattern, the projection electrodes having a predetermined height above the external wiring pattern. An enclosure layer of a resin material is provided on the protective layer, the enclosure layer covering sides of the projection electrodes and external surfaces of the external wiring pattern.

Semiconductor device and method of production of the semiconductor device

A semiconductor device includes a semiconductor element, a resin package sealing the semiconductor element, resin projections protruding from a mounting surface of the resin package, metallic film parts provided to the resin projections, connecting members electrically connecting electrode pads on the semiconductor element and the metallic film parts, and connection pads extending from the metallic film parts, the connecting members being connected to the connection pads.

Semiconductor device and mounting structure

An adhesive composition including: a main component comprising a resin material, a solvent for dissolving said main component, and a filler added to said main component, wherein said filler has a particle size so as to make a concavo-convex depth of a surface of said adhesive composition equal to or less than 15 .mu.m after said adhesive composition is applied to an adherend and dried in order to evaporate said solvent before a thermocompression process. The present invention also discloses a semiconductor device using the adhesive composition, an adhering method using the adhesive composition and a method for producing a semiconductor device using the adhesive composition.

Adhesive composition, semiconductor device using the composition and

Growing community of inventors

Kasugai, Japan

Takashi Hozumi