Senju Metal Industry Co., Ltd.

Showa Shell Sekiyu K.k.

Nec Corporation

Denso Corporation

Sigma Corporation

Fujitsu Corporation

Nippondenso Co., Ltd.

Showa Shell Sekiyu Kabushiki Kaisha

Sony Corporation

Showa Shell Sekiyo Kabushiki Kaisha

Takashi Hagiwara

Hiroyoshi Kawasaki

Yoshiichi Suzuki

Ichiro Kawamura

Hiroyuki Yamasaki

Yuji Kawamata

Kaichi Tsuruta

Noriko Yamakawa

Isamu Sato

Yoshihiko Aihara

Takahiro Roppongi

Daisuke Soma

Hiroyuki Mogamiya

Manabu Muraoka

Naoto Kameda

Kota Kikuchi

Takeo Saitoh

Shigeyuki Sekine

Takashi Obayashi

Tadashi Hattori

Takashi Yokokawa

Nobuei Ito

Toshiyuki Miyauchi

Kazuhiro Inoguchi

Takanori Minamino

Yutaka Hattori

Yasuhiro Iida

Norio Yamamoto

Naoya Haneda

Takahiro Hattori

Masao Tokunaga

Shigeki Kondo

Takahiro Nishizaki

Atsushi Ikeda

Hiroki Sudo

Tadaaki Isozaki

Yoji Kato

Daisuke Maruko

Yuichiro Yamada

Shigenori Sakuma

Atsumi Takahashi

Yasuhiro Kajikawa

Katsuji Kosaka

Yoshinori Hiraoka

Koichi Numazawa

Hiroyuki Yamada

Kazuyuki Hamamoto

Kenji Yaso

Yasuaki Hirokawa

Ichiro Kuwamura

Kahoru Mori

Youiti Kotanchi

Hirosi Tukamoto

Osamu Minai

Provided is a flux that allows soldering to be performed without requiring a step of removing a Cu-OSP film even with a Cu-OSP processed substrate. This flux containing rosin, an organic acid, a benzimidazole-based compound, and a solvent is characterized in that 30% by mass or more and 70% by mass or less of the rosin, 1% by mass or more and 10% by mass or less of the organic acid, 0.2% by mass or more and 10% by mass or less of the benzimidazole-based compound, and 20% by mass or more and 60% by mass or less of the solvent, wherein the benzimidazole-based compound is composed of at least one of 2-alkylbenzimidazole and a salt of 2-alkylbenzimidazole hydrohalide.

Flux

Provided herein is a solder material that includes a spherical core that provides space between a joint object and another object to be joined to the joint object and a solder coated layer that has a melting point at which a core layer of the core is not melted. The solder coated layer includes Sn as a main ingredient and 0 to 2 mass % of Ag, and coats the core. The solder coated layer has an average grain diameter of crystal grains of 3 &#x3bc;m or less, and the solder material has a spherical diameter of 1 to 230 &#x3bc;m and a sphericity of 0.95 or more.

Joining member, solder material, solder paste, formed solder, flux coated material, and solder joint

Provided is a flux containing not less than 11.0 degrees and not more than 17.0 of a contact angle between the flux and a resist substrate on which the flux has been printed to have 1.0 mm of a diameter and 0.15 mm of a thickness when heating the resist substrate at 150 degrees C. for 30 seconds and cooling the resist substrate to a room temperature. The flux also contains more than zero seconds and not more than 2.0 seconds of a zero-cross time when heating a Cu plate at 150 degrees C. in a thermostat oven for 12 hours, applying the flux onto the baked Cu plate, and dipping the baked Cu plate onto which the flux is applied into a Sn-3.0Ag-0.5Cu alloy at a dipping speed of 15 mm/sec and by 2.0 mm of a dipped depth.

Flux composition for solder applications

An object of the present invention is to provide a flux in which the occurrence of a bridge and a ball is suppressed at the time of soldering, and a resin composition for the flux. The flux comprising: at least one selected from 0.3 to 2.0 mass % of an organochlorine compound, and more than 0.04 mass % and 1.00 mass % or less of an amine hydrochloride; and 0.2 to 1.5 mass % of an organophosphorus compound that is at least one selected from a phosphonic acid ester and a phenyl-substituted phosphinic acid, each based on the whole flux.

Flux and resin composition for flux

A flux applying device for applying flux to a surface of solder, wherein the flux applying device includes: a dipping means that applies the flux to the surface of the solder by dipping the solder into the flux; a load applying means that applies a predetermined load to the solder, the load applying means being provided at a upstream side of the dipping means; a constant speed conveying means that conveys the solder at a predetermined speed with being under load by the load applying means; a drying means that dries the solder to which the flux is applied; a cooling means that cools the dried solder; a conveying speed measurement means that measures a conveying speed of the solder; and a control means that controls the conveying speed of the solder.

Flux applying device

Provided is a flux, flux residue of which keeps a predetermined viscosity during reflow and after a reflow step without hindering wettability of a solder alloy, the flux being compatible with an underfill in an underfill hardening step. The flux contains a thermosetting resin, a hardening agent, an organic acid and a solvent in which the flux contains 3% or more by mass to 8% or less by mass of the resin, 1% or more by mass to 5% or less by mass of the hardening agent to remain within a limit of an additive amount of the resin, 5% or more by mass to 15% or less by mass of the organic acid and a remainder of the solvent.

Flux with dibasic acid mixture

In the flux applying device, a control portion controls conveying rollers or the like so that thickness of flux applied to solder is controlled. The winding roller rotates so that the solder is conveyed at the conveying speed. The drawing-out roller applies any load (back tension) to the solder backward along the conveying direction of the solder when drawing out the solder. The solder is conveyed at the predetermined speed and dipped into the flux tank containing flux. The solder is pulled up from the flux tank at the conveying speed vertically. By pulling up the solder from the flux tank at the constant conveying speed vertically, the interfacial tension acts on the solderand the flux, so that the flux having a uniform thickness according to the conveying speed remains on the surface and back surface of the solder.

Liquid coating device

A soldering flux which is suitable as a no-clean post flux in flow soldering and which can prevent the formation of whiskers which tends to occur when soldering electronic parts to a printed circuit board using a lead-free solder (such as Sn-3.0Ag-0.5Cu) having a higher Sn content and a higher melting point than the eutectic solder contains, in addition to a rosin as a base resin and an activator, 0.2-4 mass % of at least one compound selected from acid phosphate esters and derivatives thereof. The formation of whiskers can be more effectively prevented by carrying out soldering in a nitrogen atmosphere.

Flux for lead-free solder and soldering method

[Problems] Addition of an organic acid such as a dicarboxylic acid to a soldering flux in order to improve wettability causes a reaction with copper oxide to form a metallic soap of copper having a green color. Although this metallic soap of copper is not corrosive and does not decrease reliability, its external appearance is impossible to distinguish it from verdigris which is indicative of corrosion. There is need for a soldering flux which does not form a metallic soap of copper. [Means for Solving the Problems] Addition of a tetrazole or a tetrazole derivative to a soldering flux can prevent carboxyl groups from reacting exclusively with copper ions, thereby suppressing the formation of a metallic soap of copper having a green color. Among tetrazoles and tetrazole derivatives, 5-phenyl-1H-tetrazole and its derivatives which have hydrogen as a substituent in the 1-position and a phenyl, group which strongly attracts electron in the 5-position are effective at improving soldering since they result in an increased polarity in the solvent.

Soldering flux

A decoding device that decodes demodulated data obtained by demodulating a quadrature modulated signal arising from digital modulation of a carrier and detects synchronization, the decoding device includes, a decoder configured to decode first demodulated data that is the demodulated data obtained by demodulating the quadrature modulated signal and is composed of in-phase axis data and quadrature axis data. The decoding device decodes second demodulated data obtained by interchanging the in-phase axis data and the quadrature axis data of the first demodulated data. A synchronization detector is configured to detect a boundary between predetermined information symbol sequences from first decoded data obtained by decoding the first demodulated data and detect the boundary from second decoded data obtained by decoding the second demodulated data. The synchronization detector selects and outputs one of the first decoded data and the second decoded data based on a result of the detection of the boundary.

Decoding device and method, receiving device and method, and program

An apparatus includes a vector unit to process a vector data, a cache memory which includes a plurality of cache lines to store a plurality of divisional data being sent from a main memory, each of the divisional data of vector data having been divided according to a capacity of a cache line, and a cache controller to send all of the divisional data as the vector data to the vector unit after the cache lines have stored all of the divisional data including the vector data.

Apparatus, processor, cache memory and method of processing vector data

A parallel processing system includes a network and a plurality of nodes which communicates asynchronously between the plurality of nodes through the network. Each of the plurality of nodes may include a plurality of CPUs and a communication control unit. Each of the plurality of CPUs as an issuing CPU generates and transmits an asynchronous communication request, retransmits the asynchronous communication request in response to a non-acceptance reply, and executes a subsequent process in response to an acceptance replay. The communication control unit determines whether the asynchronous communication request is acceptable, returns the acceptance reply to the issuing CPU when the asynchronous communication request is acceptable, and the non-acceptance reply to the issuing CPU when the asynchronous communication request is not acceptable, and executes the asynchronous communication request.

Parallel processing system in which use efficiency of CPU is improved and parallel processing method for the same

A transparent display panel such as an electroluminescent panel is overlapped on a part of a conventional instrument panel for use in an automobile. The overlapped display panel displays additional information such as navigation maps when required and is turned off under a normal driving condition. When the overlapped transparent display panel is turned off, the conventional instrument panel displays information such as a vehicle speed, an engine speed so and so forth. In this situation, overall luminance on the combined display panel is made uniform throughout a whole surface including the area where the transparent display panel is overlapped. To realize the uniformity of luminance, brightness of back lamps for illuminating the instrument panel is adjusted or a filter having an adequate transparency is used. The combined display panel may be also made by combining a non-transparent display panel with a conventional instrument panel. A filter may be used in this case to attain an overall uniform luminance on the combined display panel.

Combined display panel

A multiprocessor system includes a plurality of nodes interconnected by a network. Each of the nodes includes a job identification number generator for generating a job identification number, a controller for issuing an instruction and associating the instruction with the job identification number, and a data transfer unit for transferring data according to the instruction. The data transfer unit includes an error detector for detecting an error and for generating an error signal. The error detector associates the error signal with the job identification number.

Multiprocessor system and method for error tracking

A matrix-addressed electroluminescent display panel has lower electrodes and back electrodes orthogonally provided with each other through a luminescent layer and the like. A passivation layer is formed on the back electrodes on an opposite side of the lower electrodes with respect to the back electrodes, and back electrode leading members are formed on the passivation layer on an opposite side of the back electrodes with respect to the passivation layer to be electrically connected to the back electrodes. The lower electrodes have ends arranged on one side of a substrate, and the back electrode leading members are formed to have ends arranged on the same side of the substrate as the ends of the lower electrodes. Accordingly, terminals of the lower and back electrodes can be arranged on one side of the substrate, thereby preventing increase of the size of the display panel.

Matrix-addressed electroluminescent display device panel with

Growing community of inventors

Tokyo, Japan

Takashi Hagiwara