Nikon Corporation

Other

Kabushiki Kaisha Topcon

Tokyo Kogaku Kikai Kabushiki Kaisha

Tokyo Kogaku Kikai Kabushiki

Takashi Gemma

Yutaka Ichihara

Takashi Yokokura

Mikihiko Ishii

Takuji Satoh

Shigeru Nakayama

Hajime Ichikawa

Katsumi Sugisaki

Hiroshi Ichihara

Katsura Otaki

Shuji Toyonaga

Naomasa Shiraishi

Akihiro Goto

Nobutaka Magome

Hiroshi Shirasu

Toshio Matsuura

Masato Shibuya

Katsuya Miyoshi

Jun Suzuki

Keiji Inada

Satoh Takuji

Bruce Jacobsen

A wavefront measuring device and method obtain wavefront information of an optical system. The method including: irradiating the optical system with a light beam; allowing the light beam passed via the optical system to come into a diffraction grating having periodicity in a first direction; and obtaining the wavefront information based on an interference fringe formed by light beams generated from the diffraction grating. The diffraction grating including: first portions which allow light to pass therethrough; and second portions which shield light, each of the second portions being provided between two of the first portions. A ratio between a width of one of the first portions in the first direction and a width of one of the second portions in the first direction is changed in the first direction, the one of the first portions and the one of the second portions being adjacent to each other.

Method and device for measuring wavefront using diffraction grating, and exposure method and device

There is provided a wavefront measuring method for obtaining wavefront information of an optical system. The method including: irradiating the optical system with a light beam; allowing the light beam passed via the optical system to come into a diffraction grating having periodicity in a first direction; and obtaining the wavefront information based on an interference fringe formed by light beams generated from the diffraction grating. The diffraction grating including: first portions which allow light to pass therethrough; and second portions which shield light, each of the second portions being provided between two of the first portions. A ratio between a width of one of the first portions in the first direction and a width of one of the second portions in the first direction is changed in the first direction, the one of the first portions and the one of the second portions being adjacent to each other.

Method and device for measuring wavefront using light-exit section causing light amount distribution in at least one direction

In the inspection apparatus of this projection optical system, a folding glass member, comprising a flat surface part and a reflecting spherical surface part opposing to the flat surface part, is disposed on the image plane side of the projection optical system so that the flat surface part opposes to the projection optical system. Further, in a state wherein a liquid is supplied between the projection optical system and the folding glass member, a measuring beam emitted from an interferometer unit enters the projection optical system; the measuring beam that transmitted through the projection optical system and the liquid, and entered the folding glass member is reflected by the reflecting spherical surface part, and once again passes through the liquid and the projection optical system; and the interference fringes obtained from the measuring beam and the reference beam generated within the interferometer unit are detected.

Projection optical system inspecting method and inspection apparatus, and a projection optical system manufacturing method

A method of manufacturing a projection optical system ( ) for projecting a pattern from a reticle to a photosensitive substrate, comprising a surface-shape-measuring step wherein the shape of an optical test surface ( ) of an optical element ( ) which is a component in the projection optical system is measured by causing interference between light from the optical surface ( ) and light from an aspheric reference surface ( ) while the optical test surface ( ) and said reference surface ( ) are held in integral fashion in close mutual proximity. A wavefront-aberration-measuring step is included, wherein the optical element is assembled in the projection optical system and the wavefront aberration of the projection optical system is measured. A surface correction calculation step is also included wherein the amount by which the shape of the optical test surface should be corrected is calculated based on wavefront aberration data obtained at the wavefront-aberration-measuring step and surface shape data obtained from the surface-shape-measuring step. The method also includes a surface shape correction step wherein the shape of the optical test surface is corrected based on calculation performed at the surface correction calculation step. Surface shape measuring interferometer systems and wavefront-aberration-measuring interferometer systems ( J- Q) used in performing the manufacturing method are also disclosed.

Interferometer that measures aspherical surfaces

Apparatus and methods are disclosed for measuring the surface topography of a test surface, such as a spherical or aspherical surface of a refractive or reflective optical element. The test surface is measured by detecting the state of interference fringes generated by interference of a reference light beam and a measurement light beam that interacts (e.g., reflects from) the test surface. The reference and measurement beams are produced by a point light source having a reflective surface. The point light source is disposed between a source of input light and the test surface. The measurement beam (after interacting with the test surface) and the reference beam are caused to interfere with each other to produce a first interference-fringe state. The distance between the point light source and the test surface can be changed between production of the first interference-fringe state and production of a second interference-fringe state. The profile of the test surface is determined by analyzing the resulting interference fringes. A null element can be used to convert a spherical wavefront of the measurement beam into an aspherical wavefront corresponding to the aspherical test surface, or to convert an aspherical wavefront generated by reflection of a spherical wavefront from an aspherical test surface into a spherical or planar wavefront.

Interferometric apparatus and methods for measuring surface topography of a test surface

Wavefront aberration-measuring apparatus are disclosed that can easily and accurately correct interference-fringe distortions arising from aberrations of an optical system in an interferometer and that can reduce wavefront aberration-measurement errors arising from such distortion. The apparatus comprise an interferometer that forms an interference fringe from a synthesis of a wavefront of light reflecting from a reference surface and a wavefront of light from a test object (such as a reflective surface or lens). The apparatus also comprises an image-pickup element for detecting the interference fringe, and an arithmetical calculator that calculates the wavefront aberration between the test object and the reference surface based on an output from the image-pickup element. Between the test object and the image-pickup element is an optical system (e.g., converging lens) that transmits a wavefront that is perpendicularly incident to a surface of the test object. An interference-fringe distortion corrector corrects the interference-fringe distortion based on a distortion aberration calculated in advance.

Apparatus and methods for detecting and correcting distortion of

Apparatus and methods are disclosed for measuring wavefront aberrations microlithography projection lenses such as i-line or excimer laser projection lenses. The apparatus comprises an argon-ion laser irradiating a Fizeau surface that reflects reference light and transmits test light. The test light is reflected by a spherical reflecting surface to pass twice through the test lens and the Fizeau surface, to interfere with the reference light. A piezoelectric element changes the fringes slightly. An image-pickup device receives the interference fringes and outputs data to a processor that calculates corresponding wavefront aberrations of the test lens. For testing an i-line lens, the argon laser can be a single-mode, 363.8 nm laser. For testing a lens used with a KrF excimer laser, the argon laser can emit second-harmonic light at 248.25 nm.

Apparatus and methods for measuring wavefront aberrations of a

In an interferometer, reflected light from a reference surface and a subject surface are introduced to an imaging optical system through a beam splitter, and an interference fringe formed from light reflected from the both surfaces is observed with a detection optical system. An alignment optical member is disposed in an optical path between the imaging optical system and an image plane of the interference fringe such that the rear focal point of the alignment optical member is located at the image plane. The alignment optical member is inserted in the optical path in aligning the subject surface and is removed in measuring the interference fringe. Accurate alignment of the subject surface is easily attained. A beam expander is interposed between a polarizing beam splitter and the subject surface and a 90.degree. retarder is interposed between the beam expander and the subject surface. The 90.degree. retarder is constructed of one or a plurality of reflecting mirrors formed of dielectric multilayer films. Noise introduced to the imaging optical system is minimized.

Interferometric surface profiler with an alignment optical member

An interferometer is used for observing the shape of a surface to be detected with the desired spatial resolution. A variable aperture stop is arranged at a Fourier transform image plane of the surface to be detected within an imaging optical system for forming an interference pattern of a reference light and a measuring light. The aperture diameter of the variable aperture stop is adjusted by a control in accordance with the desired spatial resolution.

Interferometer for observing the interference pattern of a surface under

An exposure apparatus is used for reproducing a mask pattern of a semiconductor device or the like onto a photosensitive substrate using a holography. The holography is utilized also in a process for alignment between a mask pattern hologram and an exposure region of the substrate. The pattern hologram is recorded to a recording medium by interference between an object wave from the pattern and a reference wave, and a second hologram is formed to the medium by diffraction light from an alignment mark formed on the mask. Prior to reconstruction of the pattern image, reconstruction light from the second hologram, illuminated with a reconstruction wave, is irradiated onto the substrate arranged in place of the mask. A reproduction image of the alignment mark on the substrate surface illuminated with the reconstruction light is measured, and relative displacement between the medium and the substrate is detected from a result of the measurement. The relative positional relationship between the medium and the substrate is corrected in accordance with the displacement information, and, thereafter, the surface is exposed with a reconstruction image of the pattern hologram.

Exposure method and apparatus using holographic techniques

An interferometer for measuring an aspherical shape uses a computer generated hologram. The interferometer comprises a hologram disposed at each of positions conjugate with plural types of aspherical surfaces to be examined and filed lens means disposed between a position conjugate with a convex aspherical surfaces and another position with a concave aspherical surface. The interferometer can measure plural types of aspherical surfaces to be examined without need of changing the position of the interferometer for each of the aspherical surfaces to be examined, even if the number of different surfaces to be examined increases.

Interferometer for measuring aspherical form with the utilization of

A method of analyzing interference fringes for use in a holographic interferometry process for measuring, by using a computer generated hologram, the shape of an object to be examined. The method comprises:

Method of and apparatus for analyzing interference fringes

A holographic interferometer comprising a source of laser beams, a condenser lens for converging a laser beam supplied from said laser-beam source, a pinhole which allows the passage of said converged laser beam, a collimator lens having a focal point which lies on said pinhole, a beam splitter disposed in an inclined manner between said pinhole and said collimator lens, a spacial filter disposed on the optical axis of a light reflected from said beam splitter and at an optically conjugate position relative to said pinhole, and a hologram standard disposed between said spacial filter and said beam splitter.

Growing community of inventors

Tokyo, Japan

Takashi Gemma