Toray Industries, Inc.

Katholieke Universiteit Leuven

Takashi Fujioka

Masato Honma

Noriyuki Hirano

Yoshiki Takebe

Makiko Saito

Atsuki Tsuchiya

Naokichi Imai

Mitsushige Hamaguchi

Kotaro Shinohara

Satoshi Seike

Tomohiro Takehara

Masaru Akita

Kentaro Adachi

Takayuki Fujiwara

Satomi Hiasa

Satomi Matsuo

Joris Baets

Ignace Verpoest

A fiber-reinforced resin substrate is described in which a plurality of resins having differing properties are strongly composited, wherein the fiber-reinforced resin substrate is obtained by impregnating a thermoplastic resin (A) and a thermoplastic resin (B) into continuous reinforcement fibers, wherein a thermoplastic resin (A) layer, which comprises the thermoplastic resin (A) and is exposed at one surface, and a thermoplastic resin (B) layer, which comprises the thermoplastic resin (B) and is exposed at the other surface, form a boundary region, where at least some of the continuous reinforcement fibers exist in a manner spanning across the boundary region and both the thermoplastic resin (A) and the thermoplastic resin (B) are crystalline resins having a melting point of not less than 200° C.

Fiber-reinforced resin substrate, preform, integrated product, and method for producing fiber-reinforced resin substrate

A fiber-reinforced plastic substrate is described in which a plurality of resins having different properties are firmly compounded and that includes components [A], [B], and [C]:

Fiber-reinforced resin substrate, integrated molded article, and method for manufacturing fiber-reinforced resin substrate

Provided is a method for producing a molded article having a thin film layer (B) formed on a surface of a porous body (A). The method includes a process (I) and a process (II) described below in this order:

Method for manufacturing molded article and preform of molded article

The invention aims to provide an electronic device housing that can maintain the antenna performance without deteriorating the radio communication performance, ensures uniform characteristics as one molded electronic device housing in spite of consisting of a plurality of members, and show excellent features in terms of the degree of warpage and dimensional accuracy as well as small deformation in high temperature environments and high mass productivity. The electronic device housing consists mainly of a fiber reinforcing member (a) and a fiber reinforcing member (b), the fiber reinforcing member (a) containing a resin (a1) and a fiber (a2), the fiber reinforcing member (b) containing a resin (b1) and a fiber (b2), the fiber reinforcing member (a) and the fiber reinforcing member (b) being joined directly without the existence of another layer at the joining face between the fiber reinforcing member (a) and the fiber reinforcing member (b), and the fiber reinforcing member (a) and the fiber reinforcing member (b) fulfilling a specific relation in terms of linear expansion coefficient and/or bending elastic modulus.

Electronic device housing

The present invention aims to provide an electronic device housing that is able to maintain the antenna performance without deteriorating the radio communication performance, excellent in terms of the degree of warpage and dimensional accuracy, and mass productivity. The electronic device housing includes a fiber reinforcing member (a) and a fiber reinforcing member (b), wherein the fiber reinforcing member (a) contains a resin (a1) and a fiber (a2), the fiber (a2) being in the form of discontinuous fibers; the fiber reinforcing member (b) contains a resin (b1) and a fiber (b2), the fiber (b2) being in the form of continuous fibers; the projected area of the fiber reinforcing member (a) accounts for 60% or more of the total projected area, which accounts for 100%, of the housing projected onto the plane of the top face; and requirements (i) and/or (ii) given below are met: (i) the resin (a1) is a thermoplastic resin having a melting point of more than 265&#xb0; C., and (ii) the resin (a1) is a thermoplastic resin having a water absorption rate of 0.4% or less.

Electronic device housing and method for producing same

A case which is configured of a cover comprising an electronic device, and which is characterized in that the electronic device is inserted into the cover. A case which is configured of a cover comprising an electronic device, and which has an improved storage capacity, while maintaining the stiffness required for a case.

Case having inner space within cover for electronic device

Provided is a structure having excellent flexibility represented by elastic restoring from compression or tensile elongation at break, and excellent lightness. A structure according to the present invention includes reinforced fibers, first plastic, and second plastic that exhibits rubber elasticity at room temperature, the reinforced fibers being discontinuous fibers, and the first plastic and/or the second plastic coating a crossing point between the reinforced fibers in contact with each other.

Structure

A method for manufacturing a composite structure in which a first member and a structure material as a second member are integrated, the method including: an arrangement step of arranging a structure precursor including a resin and reinforced fibers in a mold made of the first member; a heating step of heating the structure precursor to equal to or higher than a temperature at which a storage elastic modulus (G') of the structure precursor is less than 1.2&#xd7;10Pa; a shaping step of expanding the structure precursor by heating to form a structure material as a second member, and bringing the structure material into close contact with the first member to obtain a composite structure; and a cooling step of cooling the composite structure.

Method for manufacturing composite structure and method for manufacturing integrated composite structure

Provided is a mountain-shaped structure material being excellent in stiffness and lightness. The present invention is a structure material including a resin, reinforced fibers and voids. The structure material has a specific bending stiffness represented as Ec&#xb7;&#x3c1;being 2.5 or more where a bending modulus is Ec and a density is &#x3c1;. The structure material has a mountain shape.

Structure material and manufacturing method therefor

An electronic device housing includes: a bottom cover; a top cover; a partition structure that is disposed in a space divided by the bottom cover and the top cover and has an opening; and a heat generation member. The partition structure is joined to the bottom cover or the top cover to form a hollow structure, and the heat generation member is disposed on a surface of the partition structure on the hollow structure side.

A method for manufacturing a structure material is a method for manufacturing a structure material that includes a thermoplastic resin, reinforced fibers, and voids. The method includes: a first process for arranging a structure precursor comprising the thermoplastic resin and the reinforced fibers in a mold with a surface temperature of 80&#xb0; C. or less; a second process for raising the surface temperature of the mold up to a temperature at which a storage elastic modulus (G') of the structure precursor is less than 1.2&#xd7;10Pa; a third process for lowering the surface temperature of the mold down to a temperature at which the storage elastic modulus (G&#x2032;) of the structure precursor is 1.2&#xd7;10Pa or more; and a fourth process for removing a structure material obtained after end of the third process from the mold.

Method for manufacturing structure material

A resin supply material is used for molding a fiber-reinforced resin and includes a continuous porous material and a resin. The continuous porous material has a bending resistance Grt of 10 mN&#xb7;cm or more at 23&#xb0; C., and a bending resistance ratio Gr of 0.7 or less, the bending resistance ratio Gr being expressed by the formula:

Resin supply material, preform, and method of producing fiber-reinforced resin

A laminate includes reinforcing fibers, thermosetting resin (B) or thermoplastic resin (D), wherein adhesion with other members, particularly in high-temperature atmospheres, is outstanding. The laminate includes: a porous substrate (C) comprising a thermoplastic resin (c), reinforcing fibers (A) and a thermosetting resin (B), or a porous substrate (C) comprising a thermoplastic resin (c), reinforcing fibers (A) and a thermoplastic resin (D); wherein the porous substrate (C) has a gap part continuous in the thickness direction of the laminate, and the melting point or softening point is higher than 180&#xb0; C., and at least 10% of the surface area of one surface of the porous substrate (C) is exposed on one side of the laminate.

Laminate, integrated molding, and method of producing same

A housing includes: a top cover; a bottom cover having a rising wall member erected toward the top cover and joined to the top cover at a rim; and a reinforcing structure which is disposed in a space divided by the top cover and the bottom cover, and has an opening, the reinforcing structure being joined to the bottom cover. The bottom cover is formed of a material having a thickness of 0.1 mm or more and 0.8 mm or less and an elastic modulus of 20 GPa or more and 120 GPa or less.

Housing

A housing includes: a bottom cover; a top cover; and a reinforcing structure that is disposed in a space divided by the bottom cover and the top cover and has a flat portion, a rising wall member erected on a rim of the flat portion, and a joining portion extending from a rim of the rising wall member, or a curved portion, and a joining portion extending from a rim of the curved portion, the joining portion of the reinforcing structure being joined to the bottom cover or the top cover. The area of the joining portion is within a range of 10 cm2 or more and 100 cm2 or less, and the maximum value of the height of the reinforcing structure is within a range of 3 mm or more and 30 mm or less.

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Ehime, Japan

Takashi Fujioka