Omron Corporation

Takashi Fujimoto

Naoki Motoyama

Yoshinori Watajima

Naoyuki Kanamaru

Shuichi Sugimoto

Kazutaka Yoshida

Tetsuya Sawamura

Nobutomo Matsunaga

Shoichi Konagata

Hoshihisa Toki

Yoshihisa Toki

Hiroto Nagaishi

Nobutamo Matsunaga

A power module structure has a heat plate for contacting a heat sink, an insulating plate soldered to the heat plate, a terminal soldered to the insulating plate and a semiconductor chip having a contact point corresponding to the terminal so as to contact the terminal through this contact point. The terminal is provided with a shock absorbing part that serves to weaken the force generated due to the difference in coefficient of thermal expansion between the terminal and the insulating plate. The terminal has a force restricting part that serves to restrict this force and is locally formed as a soldering area through which the terminal is soldered to the insulating plate. Such a structure is contained inside a base and makes a surface-contact with a heat sink to form a solid state relay.

Power module structure and solid state relay using same

An excess current interrupting structure comprising a conductive wire rod which generates heat by an excess current connected between a pair of electric conductors, a circumference of the conductive wire rod being covered with a resin with a thin coated layer formed in the vicinity of a path of the conductive wire rod.

Method of manufacturing excess current interrupting structure

Excess current interrupting structure

Growing community of inventors

Takeo, Japan

Takashi Fujimoto