Tokyo Electron Limited

Takashi Asakawa

Haruoki Nakamura

Masayuki Enomoto

Koichiro Inazawa

Nobuyuki Okayama

Yoshio Ishikawa

Moriyoshi Kinoshita

Yuji Sasaki

Ryota Aoi

Junichi Sato

Masato Hiratsuka

An aggregation method includes: acquiring log information including a measurement value of a force used by a processing apparatus and a measurement date and time, the measurement value being measured by a sensor of the processing apparatus that processes a substrate; storing the measurement value of the force and the measurement date and time included in the acquired log information in a storage unit; and integrating the measurement value of the force associated with the measurement date and time in a specified aggregation period with reference to the storage unit to calculate an integrated value of the force for each processing apparatus.

Aggregation method and processing apparatus

A substrate processing apparatus includes: a carrier storage rack configured to place and store a carrier that accommodates a substrate; a gas supply configured to supply an inert gas into the carrier placed on the carrier storage rack; and a controller configured to control whether to supply the inert gas into the carrier based on at least one of carrier information and substrate information.

Substrate processing apparatus and purging method

In a substrate processing apparatus, before a carrier is carried by a carrier arm, a carrier jig is held by a holding part provided to the carrier arm. First, the carrier arm is actuated to move the holding part of the carrier arm to a preset lowering start position. Then, an image including an opening in a table is taken. Thereafter, a distance between a central position of the opening and a central position of a region of the image is calculated, so as to obtain an amount of horizontal positional shift between the preset lowering start position and an ideal position. The lowering start position of the holding part is corrected by the positional shift as a correction value, whereafter the carrier is placed on the table at the corrected lowering start position.

Method for teaching carrier means, storage medium and substrate processing apparatus

The present invention is intended to achieve more accurate and facilitated positioning of a carrier onto a table, in a substrate processing apparatus configured for placing the carrier storing multiple sheets of wafers therein, on the table, by using a carrier arm. Before the carrier is actually carried by the carrier arm, a carrier jig having the same shape as the carrier is held by a holding part provided to the carrier arm. The carrier jig is provided with a camera, such that a central position of a region of an image taken by the camera will be coincident with a central position of an opening formed in the table, if the carrier jig is accurately located in an ideal position above the table. First, the carrier arm is actuated to move the holding part of the carrier arm to a preset lowering start position. Then, the image of the region including the opening is taken by the camera. Thereafter, a distance between the central position of the opening and the central position of the region of the image taken by the camera is calculated, so as to obtain an amount of a positional shift, in a horizontal direction, between the preset lowering start position and the ideal position. Consequently, the lowering start position of the holding part is corrected, by using the so-obtained amount of the positional shift as a correction value. Finally, the carrier is placed on the table, based on the so-corrected lowering start position.

The present invention relates to a plasma etching method and a plasma etching apparatus, and more particularly to a plasma etching method and a plasma etching apparatus in which the selection ration is enhanced by improving trench side-wall protecting effect.

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Oshu, Japan

Takashi Asakawa