Canon Kabushiki Kaisha

Takashi Aoki

Mitsutoshi Hasegawa

Noritake Tsuboi

Yoshiyuki Imanaka

Yasuhiro Sawada

Kazunori Masuda

Ryoji Oohashi

Koji Noguchi

Satoru Higuchi

Daishiro Sekijima

Yuya Karakawa

A wiring component includes a first wiring portion including a plurality of wirings arranged side by side in a first direction, a second wiring portion including a plurality of wirings arranged side by side in a second direction, and a coupling portion configured to couple the first wiring portion and the second wiring portion to each other, wherein an angle formed by the first direction and the second direction is changeable by deformation of the coupling portion.

Wiring component, module, apparatus, and method for manufacturing module

A semiconductor module includes a semiconductor device having a first land, a second land, and a third land, a wiring board having a substrate, and a fourth land, a fifth land, and a sixth land disposed on the main surface of the substrate, a chip component having a first electrode and a second electrode disposed across a distance in the longitudinal direction and being disposed between the wiring board and the semiconductor device, a first solder joint for bonding the first land, the fourth land, and the first electrode, a second solder joint for bonding the second land, the fifth land, and the second electrode, and a third solder joint for bonding the third land and the sixth land. The volume of the first solder joint and the volume of the second solder joint are each larger than the volume of the third solder joint.

Semiconductor module and electronic apparatus

An electronic component mounting structure includes a first land, a second land making a pair with the first land, an electronic component having a chip shape and including a first electrode connected to the first land and a second electrode connected to the second land, a first wiring pattern connected to the first land, and a second wiring pattern connected to the second land and including a first partial pattern overlapping a portion of a body of the electronic component in planar view, the portion being not covered with the pair of electrodes, a second partial pattern formed integral with the first partial pattern and overlapping the first electrode of the electronic component in planar view, and a third partial pattern formed integral with the second partial pattern and parallel to the first wiring pattern.

Electronic component mounting structure and printed wiring board

A first semiconductor package which is located on an upper side includes a first printed wiring board and an encapsulation resin for encapsulating a first semiconductor chip. A second semiconductor package which is located on a lower side includes a second printed wiring board. The first printed wiring board includes first lands and a first solder resist having first openings for exposing the first lands. The second printed wiring board includes second lands opposed to the first lands, respectively, and a second solder resist having second openings for exposing the second lands and opposed to the first openings, respectively. The first lands and the second lands are solder joined to each other through the first openings and the second openings, respectively. The opening area of the first opening is set to be smaller than the opening area of the second opening. This improves joint reliability.

Stacked semiconductor device

A semiconductor package includes a printed wiring board and a semiconductor chip that has a first signal terminal and a second signal terminal and is mounted on the printed wiring board. The printed wiring board has a first land and a second land for solder joining, which are formed on a surface layer thereof. Further, the printed wiring board has a first wiring for electrically connecting the first signal terminal of the semiconductor chip and the first land, and a second wiring for electrically connecting the second signal terminal of the semiconductor chip and the second land. The second wiring is formed so that the wiring length thereof is larger than that of the first wiring. The second land is formed so that the surface area thereof is larger than that of the first land. This reduces difference in transmission line characteristics due to the difference in wiring length.

Semiconductor package and stacked semiconductor package

A liquid discharge head includes a heat generating element which generates heat energy used to discharge a liquid; a temperature detecting element which changes in output voltage in response to a change in the temperature of the heat generating element; an electrical power source line and a grounding line electrically connected to each other through the heat generating element to apply a current to the heat generating element; and a pair of lines for temperature detection electrically connected to each other through the temperature detecting element to apply a current to the temperature detecting element. Here, each of the pair of lines for temperature detection is arranged adjacent to the other.

Liquid discharge head and ink jet recording apparatus including liquid discharge head

This invention makes it possible to meet a requirement of high-quality image printing and high-speed driving of a semiconductor laser driver in a laser beam printer or the like while suppressing radiant noise. A laser circuit substrate includes a first wiring pattern and second wiring pattern connected to a main wiring pattern, a first circuit which is connected to the first wiring pattern and has a semiconductor laser element and a driving circuit for driving the semiconductor laser element, a second circuit which is connected to the second wiring pattern and compensates noise generated by the first circuit, a first capacitor which is connected to a first point in the first wiring pattern, and a second capacitor which is connected to a second point in the second wiring pattern. The positions of the first point and second point are set such that the sum of the impedances of the first wiring pattern and first circuit viewed from the first point, and the sum of the impedances of the second wiring pattern and second circuit viewed from the second point are substantially equal to each other.

Laser circuit substrate

A purpose of this invention is to suppress radiation noise while satisfying demands for higher speeds and higher image qualities of a semiconductor laser driving device in a laser beam printer or the like. A laser driving circuit includes a first wiring pattern and a second wiring pattern which are connected to a main wiring pattern, a first circuit which is connected to the first wiring pattern and has a semiconductor laser element () and a laser driving device for driving the semiconductor laser element, a second circuit which is connected to the second wiring pattern, has a compensation element and a compensation driving device, and compensates for noise in the first circuit, and a common mode choke coil which is connected to the first and second wiring patterns and selectively increases impedances to in-phase signal components in a signal flowing through the first wiring pattern and the first circuit and a signal flowing through the second wiring pattern and the second circuit.

Growing community of inventors

Urayasu, Japan

Takashi Aoki