Tokyo Electron Limited

Jsr Corporation

Japan Electronic Materials Corporation

Other

Tel Engineering Limited

Takashi Amemiya

Chikaomi Mori

Shuichi Tsukada

Shinji Iino

Syuichi Tsukada

Shigekazu Komatsu

Jun Mochizuki

Hisatomi Hosaka

Disclosed is a probe card ease for accommodating a probe card. The probe card case includes: a first case member configured to mount the probe card at a predetermined position therein; a second case member configured to be fitted to a top side of the first case member, and including a card fixing mechanism for fixing the probe card; and a case fixing mechanism configured to fix the first case member and the second case member. The probe card is capable of being transferred in a state where the probe card is accommodated in the probe card case and the first case member and the second case member are fixed, and the probe card is capable of being transferred only with the second case member in a state where the probe card is fixed to the second case member.

Probe card case and probe card transfer method

Disclosed is a probe card case for accommodating a probe card. The probe card case includes: a first case member configured to mount the probe card at a predetermined position therein; a second case member configured to be fitted to a top side of the first case member, and including a card fixing mechanism for fixing the probe card; and a case fixing mechanism configured to fix the first case member and the second case member. The probe card is capable of being transferred in a state where the probe card is accommodated in the probe card case and the first case member and the second case member are fixed, and the probe card is capable of being transferred only with the second case member in a state where the probe card is fixed to the second case member.

A wafer inspection apparatusincludes a middle platethat mounts a probe cardin which multiple contact probesare provided; a drawer type tablein which the middle plateis provided; a testerto which the probe cardis mounted; and a transfer robotthat transfers the middle plate. The middle plateincludes a baseand multiple supportsprotruding toward the probe cardto be mounted. A protruding height of each supportis equal to or higher than a protruding length of the contact probefrom the probe card. The probe cardis fastened to a probe card coverwhen the probe cardis mounted on the middle plate, and the transfer robottransfers the middle platefrom the tableto the tester

Substrate inspection apparatus and probe card transferring method

Probe card case

The present invention stably maintains contact between probe pins and a wafer. Screws are provided at a plurality of positions in an outer circumferential portion of a printed circuit board. On a lower surface side of the outer circumferential portion of the printed circuit board, a retainer plate is provided, and a bottom end surface of each of the screws is held down with the retainer plate. Turning each of the screws in a state where the bottom end surface of the each of the screws is held down with the retainer plate causes the outer circumferential portion of the printed circuit board to be moved up and down. Adjusting a height of the outer circumferential portion of the printed circuit board by turning each of the screws located at the plurality of positions enables parallelism of the entire probe card with respect to the wafer to be adjusted.

Probing apparatus and method for adjusting probing apparatus

In the present invention, an inspection contact structure is attached to the lower surface side of a circuit board in a probe card. In the inspection contact structure, elastic sheets with protruding conductive portions are respectively attached to both surfaces of a silicone substrate. The silicone substrate is formed with current-carrying paths passing therethrough in the vertical direction, and the sheet conductive portions are in contact with the current-carrying paths from above and below. The conductive portions on the upper side are in contact with connecting terminals of the circuit board. At the time of inspection of electric properties of a wafer, electrode pads on the wafer are pressed against the conductive portions on the lower side and thereby brought into contact with them.

Inspection contact structure and probe card

The probe card is configured such that the outline of the probe card is formed almost round shape and a plurality of connectors for being electrically connected with a tester are provided on the upper surface thereof along the outline. A substrate with many probes arranged thereon is provided on the bottom surface of the probe card. The substrate and the connectors are connected with one another via a flexible print wiring board.

Probe card and probe device for inspection of a semiconductor device

In the present invention, an inspection contact structure is attached to a lower surface side of a circuit board of a probe card. The inspection contact structure has a silicon substrate, and sheets attached to upper and lower surfaces of the silicon substrate. Each of the sheets is elastic and has conductive portions in a projecting shape. The silicon substrate is formed with current-carrying paths passing through the substrate in a vertical direction so that the conductive portions of the sheets and the current-carrying paths of the silicon substrate are in contact with each other. The upper and lower sheets are fixed to the silicon substrate, and the sheet on the upper surface is fixed to a circuit board.

Probe card for inspecting electric properties of an object

A probe card includes a contactor supporting probes, and a printed wiring board electrically connected to the contactor. An elastic sheet is interposed between the contactor and the printed wiring board. The elastic sheet is formed so that elasticity in a central side is smaller than that in an outer peripheral side of the contactor. An elastic reaction force which acts on the contactor from the elastic sheet when the elastic sheet is compressed becomes weaker at the central part side as compared with the outer peripheral side of the contactor. Thereby, the bending amount of a central part of the contactor which is away from a fixed end and bends the most is reduced, and horizontality of the contactor is maintained.

Probe card

A conductor pattern test apparatus comprises a DC voltage power source for applying a predetermined DC voltage to an end of one of a plurality of conductor patterns arranged in parallel with each other, a current measurement circuit for measuring a current flowing to another conductor pattern adjacent to the one of the conductor patterns via the end by the DC voltage power source to the end, and a short-circuit position calculation circuit for calculating a resistance value from the end to a short-circuited part of the two conductor patterns adjacent to each other, based on the current value measured by the current measurement circuit and the voltage value applied by the DC power source, and locating a position of the short-circuited part based on the calculated resistance value and a resistance value of a conductor pattern having no short-circuit. A disconnect location is also obtained.

Conductor pattern check apparatus for locating and repairing short and

A conductor pattern test apparatus comprises a DC voltage power source for applying a predetermined DC voltage to an end of one of a plurality of conductor patterns arranged in parallel with each other, a current measurement circuit for measuring a current flowing to another conductor pattern adjacent to the one of the conductor patterns via the end by the DC voltage power source to the end, and a short-circuit position calculation circuit for calculating a resistance value from the end to a short-circuited part of the two conductor patterns adjacent to each other, based on the current value measured by the current measurement circuit and the voltage value applied by the DC power source, and locating a position of the short-circuited part based on the calculated resistance value and a resistance value of a conductor pattern having no short-circuit. A disconnection position calculator calculates a capacitance value from voltage values.

Growing community of inventors

Yamanashi, Japan

Takashi Amemiya