Ube Industries, Inc.

Takashi Amane

Tomohiko Yamamoto

Toshihiko Anno

Toshiyuki Nishino

A metal film/aromatic polyimide film laminate is composed of a composite aromatic polyimide film and a metal film, in which the composite aromatic polyimide film is composed of an aromatic polyimide substrate film having a linear expansion coefficient of 5&times;10 to 30&times;10 cm/cm/&deg; C. in the temperature range of 50-200&deg; C. (measured in machine direction), and a thin aromatic polyimide layer of polyimide prepared from a carboxylic acid component comprising a mixture of 3,3&prime;,4,4&prime;-biphenyltetracarboxylic dianhydride and 2,3,3&prime;,4&prime;-biphenyltetracarboxylic dianhydride in a molar ratio of 50:50 to 90:10 and an aromatic diamine component composed of 1,3-bis(4-aminophenoxy)benzene or a mixture of 1,3-bis(4-aminophenoxy)benzene and p-phenylenediamine and/or diaminodiphenyl ether in a molar ratio of 10/90 or more. Tg of the thin polyimide layer is 210-310&deg; C. The metal film is fixed to the thin polyimide layer at a 90&deg; peel resistance of 0.5 kg/cm or higher, while the thin polyimide layer is bonded to the substrate film at a 90&deg; peel resistance higher than that between the metal film and the thin layer.

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Yamaguchi, Japan

Takashi Amane