Casio Computer Co., Ltd.

Lintec Corporation

Arakawa Chemical Industries, Ltd.

Hitachi-johnson Controls Air Conditioning, Inc.

Takashi Akutsu

Teruo Jinbo

Jun Hosoda

Hajime Manabe

Yoshito Yamaguchi

Kazuo Ogura

Ryuji Usami

Koichiro Daigo

Kosuke Shiba

Yoshiki Negoro

Masaru Setoguchi

Shigeru Matsuyama

Kenichi Tsutsumi

Hiroshi Morokuma

Akinori Matsubara

Kazuyuki Tamura

Youji Kaneko

Naofumi Tateishi

Yuki Eto

Tomohide Hukuzaki

Hitoshi Kato

Kazuhiro Takahashi

Masaharu Ito

Jun Maeda

Isao Ichikawa

Takuo Nishida

Yoji Wakayama

Kazumasa Yoshida

Keiko Kano

Naoaki Itoh

Sayaka Bandou

Yuichiro Komasu

Yasuhiko Kakiuchi

Yukinori Tanaka

Masakazu Awano

Yoshiaki Notoya

Yoshiro Ueda

The sheet for semiconductor processing of the present invention includes a base, an unevenness-absorbing layer provided on one surface of the base, and a pressure sensitive adhesive layer provided on the unevenness-absorbing layer, wherein the pressure sensitive adhesive layer is composed of an energy ray-curable pressure sensitive adhesive, and a stress at rupture of the pressure sensitive adhesive layer after energy ray curing is 10 MPa or more.

Sheet for semiconductor processing

The semiconductor processing sheet of the present invention is a semiconductor processing sheet including a base material and a pressure sensitive adhesive layer provided on one surface of the base material, wherein the pressure sensitive adhesive layer contains an acrylic polymer (A) having a molecular weight distribution of 3.0 or less and an acrylic polymer (B) having a molecular weight distribution of more than 3.0; and a gel fraction of the pressure sensitive adhesive layer is 50 to 70%, and a number average molecular weight of a sol content thereof is 60,000 or more.

Semiconductor processing sheet

The base film of the invention is a base film of a pressure-sensitive adhesive sheet for laminating onto a semiconductor wafer composed of: (A) a layer of a cured product in which a composition including a polyether polyol urethan(meth)acrylate oligomer and an energy ray curable monomer is cured by energy ray irradiation, and (B) a thermoplastic resin layer. The present invention, by using a surface protection sheet, protects a circuit side of a wafer with bumps, prevents collapse of bumps on the circuit side when grinding the back surface, and prevents generation of dimples or cracks on the grinding surface.

Base film and pressure-sensitive adhesive sheet provided therewith

To prevent bumps on the circuit side of a bump-bearing wafer from getting crushed when grinding the back side of said wafer while protecting the circuit side with a surface-protection sheet, and also to minimize the formation of dimples and cracks on the side being ground. [Solution] This base film for a pressure-sensitive adhesive sheet bonded to a semiconductor wafer comprises: (A) a layer obtained by using energy rays to cure a formulation containing a urethane (meth)acrylate oligomer and a thiol-group-containing compound; and (B) a layer comprising a thermoplastic resin.

A film is obtained by forming a film of and curing an energy ray-curable composition including a polymerizable silicone compound and an energy ray-curable resin having a viscosity at 25&#xb0; C. of 100-5,000,000 mPa&#xb7;S.

Film-like adhesive, adhesive sheet for semiconductor junction, and method for producing semiconductor device

An adhesive sheet includes a substrate and an energy-ray curable adhesive layer formed on the substrate. The energy-ray curable adhesive layer includes an energy-ray curable acrylic copolymer and a urethane acrylate. The energy-ray curable acrylic copolymer is formed by copolymerizing at least one of either a dialkyl(meth)acrylamide that has an alkyl group with carbon number of not more than 4, a phenol EO modified (meth)acrylate that has an ethylene glycol chain with a phenyl group bonded to the ethylene glycol chain, a (meth)acryloyl morpholine, or a (meth)acrylate that has an aceto-acetoxyl group, in total of 1 to 30 weight percent of all monomers to form the energy-ray curable acrylic copolymer. The energy-ray curable acrylic copolymer further includes a side chain with an unsaturated group.

Adhesive sheet

A projection apparatus has a projection system including a spatial optical modulator (SOM), which projects an image according to an input image signal, and a projection lens, two retardation sensors and a ranging section, which measure distances corresponding to plural positions in an image projection plane, a key/indicator section provided with a 'One-shot AFK' key, which instructs execution of keystone correction and focusing only once, and a 'Continuous AFK' key, which instructs continuous execution thereof, and a control section which performs keystone correction on a light image to be formed by the SOM in such a way that a projected image becomes a rectangle with adequate aspect ratio based on distances acquired, focuses the projection lens at an arbitrary position in an image having undergone keystone correction, and controls number of times keystone correction and focusing are to be executed in response to an instruction from one of the keys.

Projection apparatus, projection method and recording medium having recorded projection method

A projector apparatus is disclosed which has a projection unit which projects image corresponding to an input image signal, an instruction unit which issues an instruction for performing keystone correction, a distance survey unit which surveys distances between the projector apparatus and a plurality of positions on the image projected by the projection unit in accordance with an instruction from the instruction unit, and a focus control unit which performs keystone correction of the image projected by the projection unit in a manner that the image becomes a rectangle having an appropriate aspect ratio based on the distances obtained by the distance survey unit, while bringing the image projected by the projection unit into focus at the center position of the image after being keystone-corrected.

Projector apparatus, projection method, and recording medium storing projection method

After power is turned on, a control section causes a distance detecting section to detect a distance up to a screen, and controls focus positions of a projector lens and an imaging lens in synchronization with each other based on the detected distance (projection distance and subject distance) and an initialized zoom ratio. Moreover, when a change operation in angle of view is executed by a user in a user control apparatus, the control section changes a zoom ratio of the projector lens according to the user's operation and changes a zoom ratio of the imaging lens to correspond to the zoom ratio of the projector lens. The control section controls the zoom ratio and the focus position of the imaging lens in synchronization with setting of the zoom ratio and the focus position of the projector lens.

Projecting apparatus with shooting function, program for controlling projecting apparatus with shooting function, and projection image shooting system

A projection apparatus comprising a projection section for projecting an image corresponding to an input image signal, a distance measuring section for measuring each distance of several positions on an image projection plane made by the projection section, a focus control section for making keystone correction on an image projected by the projection section so that a projection image is formed into a rectangular shape having a proper aspect ratio based on each distance obtained by the distance measuring section while controlling a focus position of the image projected by the projection section, and a control section for instructing to carry out processing by the focus control section.

Projection apparatus, projection method and recording medium recording the projection method

A main CPU and a sub CPU take share of executing a tone generating process to generate multiple tone signals on a real-time basis without using an exclusive tone generator. The main CPU and sub CPU are formed on a one-chip LSI, thus facilitating realization of a compact electronic musical instrument. According to another structure, the main CPU executes tone generation while the sub CPU performs an effect process, thereby permitting a one-chip LSI to generate an effect-added musical tone.

Multi-channel tone generation apparatus with multiple CPU's executing

Apparatus for executing respective portions of a process by main and sub

The lower significant n bits of a first differential value between adjacent sampled values of a sampled received signal are cut off to provide a second differential value, which is then subjected to adaptive quantization to thereby provide data compression. When this data is expanded, the second differential value decoded from the adaptive quantized value is sequentially accumulated by 2.sup.n times at a period corresponding to 1/2.sup.n of the sampling period of the received signal. As a result, a quantizing error (quantization noise) per sampling of the received signal is dispersed in 2.sup.n periods to thereby provide an improved acoustic S/N ratio. When the first differential value of the received signal is quantized, when the lower significant n bits of the first differential value are cut off, and when the resulting signal is subjected to adaptive quantization, the resulting respective quantizing errors are fed to corresponding values processed next. Thus, accumulation of the quantizing errors is prevented.

Data compressing and expanding apparatus for tone generation

The lower significant n bits of a first differential value between adjacent sampled values of a sampled received signal are cut off to provide a second differential value, which is then subjected to adaptive quantization to thereby provide data compression. When this data is expanded, the second differential value decoded from the adaptive quantized value is sequentially accumulated 2.sup.n times at a period corresponding to 1/2.sup. of the sampling period of the received signal. As a result, a quantizing error (quantization noise) per sampling of the received signal is dispersed in 2.sup.n periods to thereby provide an improved acoustic S/N ratio. When the first differential value of the received signal is quantized, when the lower significant n bits of the first differential value are cut off, and when the resulting signal is subjected to adaptive quantization, the resulting respective quantizing errors are fed to corresponding values processed next. Thus, accumulation of the quantizing errors is prevented.

Data compressing and expanding apparatus

A musical-tone signal controlling apparatus includes a processor which executes a musical-tone controlling process on an input musical-tone signal supplied to the processor, the processor including a delay unit which executes a delay process on the input musical-tone signal; a first discriminator which determines whether or not the input musical-tone signal to be supplied to the processor has become null; a second discriminator which determines whether or not the output musical-tone signal processed by the processor has become null; and a reset circuit which automatically resets the delay unit when the second discriminator determines that the musical-tone signal processed by the processor has become null after the first discriminator determines that the input musical-tone signal to be supplied to the processor has become null.

Growing community of inventors

Tokyo, Japan

Takashi Akutsu