Tdk Corporation

Takashi Abe

Makoto Yoshino

Kazuhiro Ebina

Akihiko Oide

Seiji Osada

Tomoki Okada

Hiroshi Yagi

Ryo Kobayashi

Kaoru Kawasaki

Yasunori Chiba

Takaya Ishigaki

Masatoshi Ito

Ryuji Hosogaya

Mitsuru Ito

Kazuo Iwai

Kunio Oda

Yasushi Izumibe

Yoshimi Yodokawa

Kenta Sasaki

Takeshi Sasaki

Eizou Tsunoda

Shigehiko Shirai

Minoru Kanzaki

Akio Shibata

Hideki Saitou

Hiroshi Ono

Fujimi Kimura

Toyoaki Tanaka

Akihiko Dobashi

Yuuki Okazaki

In the multi-layer coil component, the lead conductor is exposed from the end surface of the element body and is connected to the external electrode provided on the end surface. When the lead conductor is led out to the end surface of the element body, the lead area can be easily increased as compared with the case where the lead conductor is led out to the side surface of the element body. Therefore, by connecting the coil and the external electrode via the lead conductor, high connectivity between the coil and the external electrode is achieved.

Multi-layer coil component

In the multi-layer inductor, the internal electrode includes the auxiliary conductor, and the auxiliary conductor is jointed to the external electrode at the end face. Therefore, when a defect occurs in a part of the through conductors, a current flows through the remaining through conductor(s) and a current also flows through the auxiliary conductor. Therefore, overheating at the joint surface between the remaining through conductor(s) and the external electrode can be prevented, and cutting and/or fusion starting from the joint surface can be prevented.

Multi-layer inductor

In the multi-layer inductor, all of the plurality of through conductors are not aligned in a straight line, and the distance between the through conductors can be sufficiently kept in the element body having a predetermined dimensional standard. Therefore, the through conductor as a heat source is apart from each other, and the heat of the through conductor can be efficiently radiated to the outside of the element body.

In the multi-layer coil component, the via conductor electrically connecting the coil layers adjacent to each other in the stacking direction of the element body protrudes from the coil region toward the side surface of the element body when viewed from the stacking direction of the element body. Therefore, the coil has a concave-convex portion. When a force is applied to the multi-layer coil component from the outside, the force is dispersed in the concave-convex portion of the coil, and thus defects are less likely to occur in the coil than in a coil in which the side of the side surfaces is flat.

An unbaked ceramic layer is formed by applying a ceramic paste on to an organic flexible supporting body. First target marks are formed on the flexible supporting body before or after this process. Then, the positioning for printing electrodes is performed based upon information obtained through image processing of the first target marks, to print the electrodes on the unbaked ceramic layer. With this, a manufacturing method for ceramic electronic components that can minimize positional misalignment in electrode patterns is provided.

Manufacturing method and manufacturing apparatus for ceramic electronic

According to the present invention, ceramic electronic components are produced by a process which includes the steps of forming an unbaked ceramic layer on a surface of an organic flexible supporting body by applying a ceramic paste, the surface having an area that is given a peeling treatment and areas that are not given the peeling treatment; forming first target marks on the flexible supporting body; and positioning and priming electrodes on the unbaked ceramic layer, based upon information obtained through image processing of the first target marks.

After applying a metal film on a surface of a substrate, the metal film is patterned in such a manner that the surface of the substrate is exposed in a pattern that corresponds to the pattern of the required indented portion. Then, the substrate is immersed in an etchant which etches the substrate selectively to form the indented portion in the surface of the substrate using the metal film as a mask. The method makes it possible to define the depth and the pattern of an indented portion where a magnetic transducer is provided with a high degree of accuracy, to prevent a reduction in pattern accuracy due to re-adhering and to advance industrial productivity.

Method for manufacturing thin film magnetic head

Growing community of inventors

Kisakata-machi, Japan

Takashi Abe