Toyoda Gosei Co., Ltd.

Takao Sato

Koichi Ota

Masaki Hashimura

Kenji Haga

A method for dividing a semiconductor wafer into chips according to the present invention is a method for dividing a semiconductor wafer into a large number of semiconductor chips, the semiconductor wafer having a semiconductor layer formed on a substrate. A first method includes the step of forming a blast-resistant mask on a surface of the semiconductor wafer, the blast-resistant mask having a pattern for leaving a grid-like exposed portion as it is and the step of blasting a fine particular blast material to thereby form dividing grooves reaching a predetermined depth of the substrate in the grid-like exposed portion. A second method includes the step of forming first dividing grooves in a surface of the semiconductor wafer in which the semiconductor layer is formed, by dicing, etching or blasting, so that the first dividing grooves have a relatively narrow groove width, and the step of forming second dividing grooves in a surface of the semiconductor wafer in which the semiconductor layer is not formed by dicing, and in positions corresponding to the first dividing grooves, so that the second dividing grooves have a relatively wide groove width.

Method for dicing semiconductor wafer into chips

A leakage measuring apparatus for detecting a minute amount of leakage of a sealing valve in a short time with high sensitivity, provided with a first pressure supply device for applying the same pressure to a first fluidic circuit and a test connection port to be connected with a sealing valve under leakage measurement, and to a second fluidic circuit serving as the reference and a reference connection port. First and second electromagnetic valves cut off the communication of the fluidic circuits to the first pressure supply device while the first and second fluidic circuits are under the applied pressure. A pressure sensor detects the pressure of the first fluidic circuit. A second pressure supply device supplies fluid to the first fluidic circuit and the same amount of fluid to the second fluidic circuit in order to maintain the pressure in the first fluidic circuit at the applied pressure on the basis of the detected pressure of the pressure sensor. A differential pressure sensor senses a differential pressure between the fluid pressures of the two fluidic circuits, thereby measuring the amount of leakage from the sealing valve quickly and accurately on the basis of the detected differential pressure.

Growing community of inventors

Aichi, Japan

Takao Sato