Toshiba Ceramics Co., Ltd.

Covalent Materials Corporation

Takao Sakamoto

Katsuyoshi Kojima

Shinya Kawamoto

Katsuaki Kotari

Yoshihiko Hoshi

Masayoshi Saitou

In a hydrophilicity treatment method including the step of rotating, on a polishing cloth, a mirror surface of a silicon wafer subjected to mirror-polishing followed by rinsing treatment while the mirror surface is pushed onto the cloth under the application of a small load with the contact of the mirror surface with a hydrophilicity treatment liquid, thereby making the mirror surface hydrophilic, the hydrophilicity treatment liquid is an aqueous liquid which comprises an organic compound having at least one hydrophilic group and having a molecular weight of 100 or more, a basic nitrogen-containing organic compound and a surfactant, and which has a pH of 9.5 to 10.5.

Hydrophilicity treatment method of a silicon wafer

A polishing apparatus which attaches the semi-conductor wafers to the polishing plate for performing the polishing as applying pressure the polishing cloth with the semi-conductor wafers, is provided with a guide ring disposed outside of the polishing plate for pressing the polishing cloth separately from the polishing plate, a retainer ring provided at the lower end of the guide ring for contacting the polishing cloth, and a weight detachably mounted on the upper surface of the guide ring for adjusting the pressure to the polishing cloth.

Polishing apparatus and method thereof

Growing community of inventors

Niigata, Japan

Takao Sakamoto