Sumitomo Chemical Company, Limited

Tohto Kasei Co., Ltd.

Takao Oshima

Seimei Yasui

Minoru Hino

Michio Yamamoto

Kazuo Hayatsu

Akihiro Tachibana

Modified epoxy resin compositions having excellent flexibility and excellent compatibility with conventional epoxy resins as well as exhibiting the original properties of the epoxy resin before being modified such as mechanical strength, adhesion, heat resistance are disclosed and chemical resistance, which are obtained by treating an epoxy resin with at least one modified adduct [D] of a conjugated diene polymer or copolymer which has an imido bond and/or amido bond and a semi-ester structure and has an acid value owing to a free carboxyl group of 5 to 100. The modified adduct is obtained by reacting an adduct [A] of a polymer of a conjugated diene having a number average molecular weight of 300 to 20,000 or a copolymer of the conjugated diene and a vinyl monomer with an .alpha.,.beta.-unsaturated dicarboxylic acid or its anhydride, with a compound [B] containing one primary amino group in the molecule and a compound [C] containing a hydroxy group in the molecule.

Modified epoxy resin composition

Modified epoxy resin composition having excellent flexibility and excellent compatibility with conventional epoxy resins as well as the original properties of the epoxy resin before modified such as mechanical strength, adhesion, heat resistance and chemical resistance, which is obtained by treating an epoxy resin with at least one modified adduct [D] of a conjugated diene polymer or copolymer which has an imido bond and/or amido bond and a semi-ester structure and has an acid value owing to a free carboxyl group of 5 to 100, said modified adduct being obtained by reacting an adduct [A] of a polymer of a conjugated diene having a number average molecular weight of 300 to 20,000 or a copolymer of the conjugated diene and a vinyl monomer with an .alpha.,.beta.-unsaturated dicarboxylic acid or its anhydride, with a compound [B] of the formula: ##STR1## and a compound [C] of the formula:

A resin composition for electrocoating which comprises

Resin composition for electrocoating

A process for production of the maleic anhydride adduct of a liquid polymer having a maleic anhydride addition amount of 2 to 70% by weight, which comprises reacting a liquid polymer having a molecular weight of 150 to 5,000 and a viscosity of 2 to 50,000 cp at 30.degree. C. in the presence of at least one compound, as a gelation inhibitor, selected from the group consisting of imidazoles, thiazoles, metallic salts of mercaptothiazoles, urea derivatives, naphthylamines, nitrosamines, iron, iron compounds and specific halogen compounds, said liquid polymer being selected from the group consisting of liquid polybutadienes, liquid polyisoprenes and liquid copolymers comprising units of butadiene or isoprene and units of at least one compound selected from the group consisting of other diolefins, olefins and aromatic vinyl compounds.

Process for production of the maleic anhydride adduct of a liquid polymer

A process for production of the maleic anhydride adduct of a liquid polymer having a maleic anhydride addition amount of 2 to 70% by weight, which comprises reacting a liquid polymer having a molecular weight of 150 to 5,000 and a viscosity of 2 to 50,000 cp at 30.degree. C in the presence of at least one compound, as a gelation inhibitor, selected from the group consisting of imidazoles, thiazoles, metallic salts of mercaptothiazoles, urea derivatives, naphthylamines, nitrosamines, iron, iron compounds and specific halogen compounds, said liquid polymer being selected from the group consisting of liquid polybutadienes, liquid polyisoprenes and liquid copolymers comprising units of butadiene or isoprene and units of at least one compound selected from the group consisting of other diolefins, olefins and aromatic vinyl compounds.

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Otsu, Japan

Takao Oshima