Ngk Insulators, Inc.

Takao Ohnishi

Yukihisa Takeuchi

Toshikazu Hirota

Koji Kimura

Hiroyuki Tsuji

Hideki Shimizu

Nobuo Takahashi

Kunihiko Yoshioka

Naoki Goto

Kazuyoshi Shibata

Shuhei Fujita

Tomohiro Yamada

Masahiko Namerikawa

Masayuki Uetani

Iwao Ohwada

Takaaki Koizumi

Takashi Ebigase

Motoo Noritake

Keizo Miyata

Yoshihiro Iseki

Natsumi Shimogawa

Yukihisa Osugi

Makoto Tani

Kazuhiro Yamamoto

Yuki Bessho

Masahiro Murasato

Kazunari Yamada

Takeshi Kaku

Katsuyuki Tsuneoka

Akifumi Morishita

Takatoshi Nehagi

Saichi Yamada

Takashi Wada

Yuhji Umeda

Daishi Tanabe

Miyuki Muto

An electrode embedded ceramic structure includes: a first ceramic layer; an electrode layer formed on the first ceramic layer; and a second ceramic layer covering the first ceramic layer and the electrode layer, the second ceramic layer being thinner than the first ceramic layer. In a cross section of the first ceramic layer, the electrode layer, and the second ceramic layer along a laminating direction in this electrode embedded ceramic structure, T1 and T2 satisfy Equation (T2−T1)/T2≤0.15, where T1 denotes a least thickness in the second ceramic layer, and T2 denotes an average thickness of the second ceramic layer.

Electrode embedded ceramic structure

A method for manufacturing a ceramic device is provided including fixing a ceramic substrate to a reinforcing plate via a sacrifice layer, forming a groove, which penetrates the ceramic substrate and the sacrifice layer and reaches the reinforcing plate, on an upper surface of the ceramic substrate to divide the ceramic substrate into plural ceramic substrates, and removing the sacrifice layer.

Method for manufacturing ceramic device

There is provided a method for manufacturing a piezoelectric element, the method having a step of polarizing the fired piezoelectric body while fixing at least two positions in a direction perpendicular to the polarization direction. The method is a means for obtaining a piezoelectric element provided with a thin and flat fired piezoelectric body with no warpage.

Method for manufacturing piezoelectric element

A method of manufacturing a piezoelectric element including a step of preparing a green sheet A including a portion which becomes a fired piezoelectric body later, by use of a piezoelectric material; a step of joining, to at least one surface of the green sheet A, a green sheet B having an opening in a portion facing the portion which becomes the fired piezoelectric body later, followed by firing to obtain the fired piezoelectric body provided with a reinforcing plate to which the reinforcing plate formed owing to the firing of the green sheet B is attached; and a step of forming a film-like electrode in a portion obtained by the firing of the green sheet A in the fired piezoelectric body provided with the reinforcing plate.

Method of manufacturing piezoelectric element

A manufacturing method for a thin board-shaped fired piezoelectric body has: a step of manufacturing, using a piezoelectric material, a green sheet having a ratio T/L of 0.000002 to 0.2, where T is the thickness and L is the maximum length within the surface after firing; and a step of obtaining the thin board-shaped fired piezoelectric body with reinforcing members for firing by performing firing after disposing the reinforcing members for firing by scattering at least on one surface of the green sheet so as to exclude the areas to be the thin board-shaped fired piezoelectric body later. The piezoelectric body which has excellent planarity and a thin board shape can be manufactured at low cost by the method.

Manufacturing method for thin board-shaped fired piezoelectric body

A piezoelectric element is provided with a ceramic substrate including a first surface on which a groove is formed, and a first electrode formed on the first surface of the ceramic substrate and including a crossing part that extends over the groove. At least one void is formed between a bottom of the groove and the crossing part of the first electrode.

Piezoelectric element with electrodes allowing substrate strain and method for manufacturing the same

There is provided a method for testing a piezoelectric/electrostrictive actuator, wherein the displacement of a piezoelectric/electrostrictive actuator is estimated on the basis of the relations between one or more frequency characteristic values selected from the group consisting of the heights and areas of the peaks of the resonance waveforms and the difference of the maximum and minimum of the first order or first to higher orders of the resonance frequency characteristic values of the piezoelectric/electrostrictive actuator and the k-th order (k=1 to 4) of the first or first to higher orders of resonance frequencies. According to this piezoelectric/electrostrictive actuator testing method, a piezoelectric/electrostrictive actuator can be tested with high precision without actually driving the same as a product and without being accompanied by any disassembly/breakage.

Method for adjusting piezoelectric/electrostrictive device

Testing apparatus for piezoelectric/electrostrictive device

A passage detection apparatus is configured to detect the change in the properties (propagation state of sound wave, dielectric constant, etc.) of a specific space, which changes according to the passage of an object in the specific space and the size of the object. The passage detection apparatus includes a pair of detection units and configured to transmit and receive signals to and from an external device. The specific space is formed by the space between the detection unit and the detection unit. The detection unit is supported by a first substrate. The detection unit is supported by a second substrate that is parallel to the first substrate, and arranged at the position corresponding to the detection unit supported by the first substrate.

Passage detection apparatus of object

There is disclosed a piezoelectric/electrostrictive element which can be used as a sensor, even if a piezoelectric/electrostrictive layer cracks. Provided is a piezoelectric/electrostrictive element comprising a substrate, a lower electrode layer secured onto the substrate, and a piezoelectric/electrostrictive layer secured onto the lower electrode layer, and the coverage of the lower electrode layer with respect to the substrate is 98% or less.

Piezoelectric/electrostrictive element having a specific coverage area of electrode on substrate, and manufacturing method of the same

There is provided a method for manufacturing a piezoelectric actuator where the planar shape is adjusted by subjecting the piezoelectric body layer located on one of the outer surfaces in the two or more piezoelectric body layers to a polarization treatment to control remnant polarization of the piezoelectric body layer. The piezoelectric actuator is used as a drive portion of a piezoelectric drive type variable capacitor. The variable capacitor has high mechanical strength and excellent reliability for a long period of time. The relation between the displacement amount of the piezoelectric actuator and the capacity of the capacitor is stable, and the variable capacity is wide.

Method for manufacturing piezoelectric actuator

Method for testing piezoelectric/electrostrictive device, testing apparatus, and method for adjusting piezoelectric/electrostrictive device

A method for manufacturing a piezoelectric/electrostrictive element includes a step of subjecting the piezoelectric/electrostrictive film to a heat treatment and a polarization treatment after the film is allowed to stand until the value of an electric constant has converged after the heat treatment. The piezoelectric/electrostrictive element manufactured in this method has small stress remaining in the piezoelectric/electrostrictive film, and predetermined performance regarding, for example, a displacement amount, a displacement-generating force, and an electric power efficiency (consumed electric power) as a piezoelectric/electrostrictive element (piezoelectric/electrostrictive film) is never spoiled.

Piezoelectric/electrostriction element manufacturing method

Disclosed is a piezoelectric/electrostrictive membrane sensor wherein the main component of terminal electrodes is contained in the vicinity of the surface of a piezoelectric/electrostrictive body. The membrane sensor is hardly electrostatically charged and thus prevented from electrostatic discharge damage and/or the attraction of dust, dirt or the like.

Piezoelectric/electrostrictive membrane sensor

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Nagoya, Japan

Takao Ohnishi