Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Matsushita Electronics Corporation

Matsushita Electrical Industrial Co., Ltd.

Takao Ochi

Takashi Takata

Junichi Shinyashiki

Kenji Maeda

Takeshi Kawabata

Yoshiyuki Arai

Shigeru Nonoyama

Hajime Homma

Hiroki Naraoka

Hisashi Funakoshi

Toshiyuki Fukuda

Kenzo Hatada

Takashi Wakabayashi

Tetsuo Ito

Nobuyoshi Asaka

Ichiro Okumura

Takashi Noda

Keiji Okuma

Hajime Honma

Keiichi Fujimoto

A semiconductor apparatus is provided. The semiconductor apparatus includes: a base having a main surface on which a terminal is disposed; a first semiconductor device retained on the main surface of the base and having a top surface on which an electrode is disposed and a bottom surface facing the main surface of the base; a connection member connecting the terminal and the electrode; an encapsulant disposed on the main surface of the base and covering the terminal, the first semiconductor device and the connection member; and a heat dissipating member disposed on the encapsulant and having a space that opens in a direction extending perpendicular to the main surface of the base. The encapsulant is disposed in the space and, in a side view of the base, a peak of the connection member is located inside the space.

Semiconductor apparatus including a heat dissipating member

A resin molding moldwith a cavityhas a resin injection portfrom which a molding resinis injected toward the cavity, and an air release portfrom which air from the cavityis released during resin injection. Not only the resin injection portbut also the air release portis formed in a top surface portionof the cavity. Thus, even if a resin burr remains in the resin injection portor the air release port, it can be prevented from adhering to an external terminalA provided on a front surface portionof the substrate

Molded semiconductor device, apparatus for producing the same, and method for manufacturing the same

A semiconductor device includes: an element mounting member including a first electrode; a semiconductor element mounted on the element mounting member and including a second electrode; and an interposer element mounted on the element mounting member with a first side of the interposer element facing one of a side of the semiconductor element. The interposer element is one of a triangle and a trapezoid in plan view, and includes: a first interposer electrode electrically connected to the second electrode via a first wire; a second interposer electrode electrically connected to the first electrode; and an internal interconnection electrically connecting the first interposer electrode and the second interposer electrode to each other.

Circuit board, lead frame, semiconductor device, and method for fabricating the same

An object of the present invention is to provide a storing tray and a storing device whereby an object such as an electronic component to be stored can be picked up in a preferred manner and a plurality of stored objects can be flipped and transferred at once. Another object is to form the storing tray as a soft tray. The storing tray includes a storing part on its main surface, the storing part including a storing base for placing therein an object such as an electronic component, a plurality of convex portions formed along the outer periphery of the storing base to protrude upward more than the storing base, and concave portions formed along the outer periphery of the storing base between the plurality of convex portions to be recessed downward more than the storing base. The storing tray has an uneven back surface opposite in shape to the main surface.

Storing tray and storing device

A production equipment includes a substrateplaced inside and having a plurality of semiconductor elementsmounted thereon, and a resin molding moldhaving a cavity. The moldhas resin injection portsand air release ports. Each of the resin injection portsis formed in a top surface portion of the cavity in the mold in association with the corresponding semiconductor element. Each of the air release portsis formed around each of the resin injection ports

Production equipment of resin molding semiconductor device, method of manufacturing resin molding semiconductor device, and resin molding semiconductor device

A electronic circuit device is provided with an electronic component provided with an electrode, a substrate having an upper surface on which the electronic component is mounted, external electrode that is formed near the electronic component mounted on the upper surface of the substrate and that is connected to the electrode, an insulating protrusion that is provided across the upper surface of the external electrode, and a sealing resin that seals the electronic component without covering the external electrode. The upper surface of the external electrode is partitioned by the protrusion into a first area that is located on the sealing resin side and a second area that is located the side opposite to the first area. The adherence of fine particles such as flakes of the sealing resin to the external electrode is suppressed, so that a stable electric connection between the external electrode and the electric equipment can be maintained.

Card-type circuit device

A semiconductor chip is mounted on a first surface of a substrate, the substrate having wiring formed on the first surface, so that a circuit formation surface of the semiconductor chip faces the first surface of the substrate and that electrodes provided on the circuit formation surface are connected with the wiring. A sealing resin layer is then formed on the first surface of the substrate to cover the semiconductor chip. The sealing resin layer and the semiconductor chip are ground starting from a surface opposite to the circuit formation surface to thin the semiconductor chip.

Semiconductor device and method for fabricating the same

An electronic circuit device, includes: internal terminals; a board on which wirings to the internal terminals are formed; an electronic component that is mounted on the board and is connected with the internal terminals; and an encapsulation resin with which the electronic component and the internal terminals are encapsulated. A part of the wiring forms a ring-shaped portion, and the ring-shaped portion has a plurality of gaps by which the ring-shaped portion is divided into a plurality of discontinuous ring-constituting sections. The plurality of ring-constituting sections are connected to the respective internal terminals, and a coating region of the encapsulation resin is surrounded with the ring-shaped portion. The applied area of the encapsulation resin can be controlled to be constant without using a special element for controlling the flow of the encapsulation resin.

Electronic circuit device

Information storage semiconductor element

Semiconductor memory element

A plurality of connecting leads, each consisting of an internal lead and an external lead, are provided so as to extend inward from a lead frame main body, and are then cut off the lead frame main body. The connecting leads are electrically connected with an aluminum electrode of the semiconductor chip. A plurality of fixing leads, each having a distal end bent toward the semiconductor, are provided so as to extend inward from the lead frame main body and thereafter are cut off the lead frame main body. The semiconductor chip is clamped by the distal ends of the fixing leads. The semiconductor chip, the plural connecting leads and the plural fixing leads are sealed together into a resin package.

Semiconductor device having a lead clamping arrangement

Semiconductor device and manufacturing method of the same

Growing community of inventors

Shiga, Japan

Takao Ochi