Fujitsu Semiconductor Limited

Fujitsu Corporation

Fujitsu Microelectronics Limited

Takao Nishimura

Akira Takashima

Yoshikazu Kumagaya

Kazuyuki Aiba

Yoshiaki Narisawa

Kouichi Nakamura

Tadashi Uno

Hiroshi Onodera

Masataka Mizukoshi

Eiji Yoshida

Mitsuhisa Watanabe

Tetsuya Hiraoka

Yoshito Akutagawa

Takao Ohno

Kaname Ozawa

Yuji Akashi

Mitsutaka Ikeda

Yoshihiro Tsukidate

Koji Sawahata

Katsuhito Kikuma

Atsushi Kikuchi

Nobutaka Shimizu

Fumihiko Ando

Hayato Okuda

Takao Akai

Takumi Ihara

Takayuki Norimatsu

In a semiconductor chip, a first semiconductor chipis provided on a chip-mounting component, and bonding wiresconnected to electrode padsE of the first semiconductor chipare fixed by being covered with a first insulating adhesive. A second semiconductor chipis mounted by being stacked on the first semiconductor chip, with the first insulating adhesivetherebetween. This structure can prevent problems such as breaking and short-circuits of bonding wires of the chip disposed directly on a substrate when another chip is mounted by being stacked.

Stacked semiconductor chips having double adhesive insulating layer interposed therebetween

A semiconductor device includes a semiconductor element having a main surface where an outside connection terminal pad is provided. The semiconductor element is connected to a conductive layer on a supporting board via a plurality of convex-shaped outside connection terminals provided on the outside connection terminal pad and a connection member; and the connection member commonly covers the convex-shaped outside connection terminals.

Semiconductor device

A semiconductor device includes a supporting board, a first semiconductor element mounted on a main surface of the supporting board; and an electronic component provided between the supporting board and the first semiconductor element; wherein the supporting board includes a concave part formed in a direction separated from the first semiconductor element; and at least a part of the electronic component is accommodated in the concave part.

Manufacturing method including deformation of supporting board to accommodate semiconductor device

A wiring board includes a main surface where an electronic component is mounted in a face-down manner so that a surface of the electronic component having plurality of external connecting terminals faces the main surface of the wiring board, the electronic component being fixed to the wiring board by an adhesive; an insulating layer formed on the main surface where the electronic component is mounted; an opening part formed in the insulating layer so that a plurality of adjacent wiring patterns are commonly and partially opened, the adjacent wiring patterns having electrodes where electrodes of the electronic component are connected; wherein an outer periphery of the opening part situated at a center side of the wiring board is formed in an oblique direction against extending directions of the wiring patterns.

Wiring board for flip-chip mounting, mounting structure of electronic components on wiring board, and semiconductor device including wiring board

A relay board provided in a semiconductor device includes a first terminal, and a plurality of second terminals connecting to the first terminal by a wiring. The wiring connecting to the first terminal is split on the way so that the wiring connects to each of the second terminals.

Relay board and semiconductor device having the relay board

A method for mounting electronic components includes a step of providing an adhesive on each of plural electronic component mounting parts on a wiring board; and a step of fixing one of the electronic components on each of the plural electronic component mounting parts via the adhesive. When the adhesive is provided on each of the plural electronic component mounting parts, the center of gravity of a volume of the adhesive provided on the mounting part where an Nth electronic component is to be mounted is shifted in a direction closer to the mounting part where an (N minus 1 or greater)th electronic component is provided neighboring and adjacent to the mounting part where the Nth electronic component is to be mounted.

Method for mounting electronic components

A semiconductor device is provided that forms a three-dimensional semiconductor device having semiconductor devices stacked on one another. In this semiconductor device, a hole is formed in a silicon semiconductor substrate that has an integrated circuit unit and an electrode pad formed on a principal surface on the outer side. The hole is formed by etching, with the electrode pad serving as an etching stopper layer. An embedded electrode is formed in the hole. This embedded electrode serves to electrically lead the electrode pad to the principal surface on the bottom side of the silicon semiconductor substrate.

Semiconductor device suitable for a stacked structure

A semiconductor device includes a supporting base whereupon an electrode terminal is placed; an intermediate member mounted on said supporting base; a semiconductor element, a portion thereof being supported with said intermediate member, and placed on said supporting base; and a convex-shaped member which corresponds to the electrode terminal of said semiconductor element and placed on said supporting base or said intermediate member; wherein the electrode terminal of said semiconductor element and the electrode terminal of said supporting base are connected with a bonding wire.

Semiconductor device and plural semiconductor elements with suppressed bending

To provide a small, high-performance semiconductor device in which contact between adjacent wires is prevented for increased flexibility in designing a wiring layout, and an efficient method for manufacturing the semiconductor device. The semiconductor device includes a substratehaving an electrodeA arranged on its surface; and a first semiconductor elementA which includes an electrodearranged on its surface and which is supported by the substrate, wherein a first wireis connected through a first bumpto at least one of the electrodes over the substrateand semiconductor elementA (i.e., at least one of the electrodesand), and a second wireis connected through a second bumpto a bonding portion of the wire

Semiconductor device and manufacturing method for the same

A wiring substrate includes a plurality of electrode terminals, to which external connection terminals of an electronic component are coupled, arranged in a row on one principal surface thereof, wherein the electrode terminals each include: a first linear portion; a second linear portion extending from an end of the first linear portion in a direction different from a direction of the first linear portion; and a bent portion that is a part where the first linear portion and the second linear portion are connected.

Wiring substrate and electronic device

A semiconductor device includes a semiconductor element; a plate member disposed opposite to an electronic-circuit forming portion of the semiconductor element; and an elastic body arranged in a compressed state between the semiconductor element and the plate member, wherein the elastic body includes at least one first protruding portion at one end in an extension direction of the elastic body, the first protruding portion being formed opposite to the electronic-circuit forming portion of the semiconductor element, and the semiconductor element and the plate member are fastened by an adhesive agent.

Semiconductor device and manufacturing method of semiconductor device

A semiconductor device capable of preventing contact between electrode terminals and a die pad as well as capable of surely performing wire bonding to the electrode terminals. A passive component is formed such that a vertical height of each electrode terminal is higher than that of an element part. More specifically, each cross-sectional area of the electrode terminals is slightly larger than that of the element part. Therefore, an upper part and lower part of each electrode terminal are slightly higher than (project from) the element part. Through an adhesive, the passive component is fixed such that the element part is located on the high position part so as to be nearly parallel to a substrate surface. Further, a part of each electrode terminal (bottom part) is located in each space within concave parts. Thus, a predetermined space is formed between each of the electrode terminals and the die pad.

Semiconductor device and manufacturing method thereof

A relay board provided in a semiconductor device, including an entire main surface that is made of a conductive material. The relay board may further include a substrate made of the same material as at least one semiconductor element provided in the semiconductor device. The main surface of the relay board may be formed at an upper part of the substrate.

Relay board provided in semiconductor device, semiconductor device, and manufacturing method of semiconductor device

A semiconductor device, includes a wiring board; a first semiconductor element mounted on the wiring board; a second semiconductor element mounted on the first semiconductor element so that a position of the second semiconductor element is shifted relative to a position of the first semiconductor element; wherein a part of a main surface of the second semiconductor element faces the first semiconductor element; and an electrode pad provided on the main surface of the second semiconductor element is connected to a second semiconductor element connection pad of the wiring board by a connection part.

Growing community of inventors

Kawasaki, Japan

Takao Nishimura