Nitto-denko Corporation

Nitto Electric Industrial Co., Ltd.

Takao Matsushita

Masayuki Yamamoto

Shigeji Kuroda

Saburo Miyamoto

Eiji Toyoda

Makoto Namikawa

Minoru Ametani

Akihiko Kira

Keigo Funakoshi

Masaki Sakata

Yoshinobu Ide

Keizo Shirakura

A peripheral edge of a protective tape joined to a front face of a semiconductor wafer is snagged on a needle having a sharp tip end so as to be partially separated from the front face of the semiconductor wafer; thus, a separated portion is formed. Next, an operation of joining a separating tape to a surface of the protective tape is started from the separated portion, and the protective tape is separated together with the separating tape from the front face of the semiconductor wafer with the separated portion as a starting end.

Method for separating protective tape, and apparatus using the same

A wafer formed thin through a back grinding process is placed on a support table included in an alignment stage. When a faulty suction is caused by a warp of the wafer, a surface of wafer is pressed by a pressing plate to be corrected and held by suction. The wafer held by suction is transported, along with the alignment stage, to a mount frame preparing unit at the next step. The wafer is received while being held by suction by a chuck table contacting the surface of wafer.

Semiconductor wafer transport method and semiconductor wafer transport apparatus using the same

Disclosed is an automatic semiconductor wafer applying apparatus capable of lightly easily stacking and loading ring frames onto a frame supply section. This apparatus has the following construction. An adhesive tape unwound from a tape roll is applied to a lower surface of the ring frame supplied to a tape applying position. The applied adhesive tape is cut out along the ring frame. The ring frame having the adhesive tape applied thereto is transported to a wafer applying position. A semiconductor wafer is applied onto the adhesive tape of the ring frame. In this apparatus, a frame supply truck movable with the ring frames stacked and held thereon is arranged so that it can be pushed/transported into and pulled out/transported from the frame supply section. A lift unit for receiving, lifting and supplying a group of ring frames stacked on the pushed and transported frame supply truck is installed in the frame supply section.

Automatic semiconductor wafer applying apparatus

A resist removing apparatus for removing an unwanted resist pattern from a surface of wafer W by applying an adhesive tape to the surface of wafer W having the resist patterns formed thereon, and separating the adhesive tape from the surface of wafer W. The apparatus includes an adhesive removing mechanism,for treating the surface of wafer W after the adhesive tape is separated therefrom. The adhesive removing mechanism,may be effective when constructed to jet ozone to the surface of wafer W heated, to irradiate the surface of wafer W heated, with ultraviolet rays, or to jet ozone to the surface of wafer W heated and irradiate the surface with ultraviolet rays.

Resist removing apparatus and method

An adhesive tape is applied to an article covered with a resist pattern. The article with the adhesive tape applied thereto is rapidly cooled to form cracks in the resist pattern on the surface of the article to weaken the cohesion between the resist pattern and the surface of the article. After the cooling, the adhesive tape is separated from the article, whereby the resist pattern is removed with the adhesive tape from the surface of the article.

Resist removing method

Method and apparatus for peeling protective adhesive tape from

A resist removing apparatus for removing unnecessary resist patterns from articles such as semiconductor substrates efficiently by using adhesive tape. A tape applicator unit is movable horizontally to apply the adhesive tape in strip form to a wafer supported on an applicator table. Then, a set of the tape applicator unit and a tape separator unit and a set of the applicator table and a separator table are moved horizontally relative to each other to shift the separator table under the wafer supported through the adhesive tape. A next wafer is transported to and placed on the applicator table in an unloaded state. The tape applicator unit and tape separator unit are moved horizontally and simultaneously to apply the adhesive tape to the wafer on the applicator table and separate the adhesive tape from the wafer on the separator table at the same time.

Resist removing apparatus

A process for peeling a protective film stuck to an upper-side of a wafer is disclosed. The protective film is peeled by adhering an adhesive tape to the upper side of the rear end of said protective film stuck on the wafer by means of a press roller, lifting the press roller and sliding said press roller forward, sliding a peeling unit forward to peel the adhesive tape together with the protective film by utilizing the adhesive force of the adhesive tape. The wafer is prevented from being damaged.

Process for peeling protective film off a wafer

A device for sticking adhesive tape to thin articles, such as semiconductor wafers, and trimming excess portions of said tape from the thin articles. A plurality of sticking rollers apply adhesive tape from a roll to each thin article, the tape having an adhesive side oriented towards an upper surface of the article and a width greater than a width of the article. A suction stage receives and holds each of the thin articles with the adhesive tape stuck thereto by said sticking rollers while a tape cutter trims the excess portion of the tape from along peripheral edge portions of the article. A tape peeling device then peels off the trimmed excess portions of the tape from the thin article, whereupon the thin article is conveyed back to a cassette.

Growing community of inventors

Mie-ken, Japan

Takao Matsushita